EP0484558B1 - Hochfrequenzspule und verfahren zu ihrer herstellung - Google Patents

Hochfrequenzspule und verfahren zu ihrer herstellung Download PDF

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Publication number
EP0484558B1
EP0484558B1 EP91909800A EP91909800A EP0484558B1 EP 0484558 B1 EP0484558 B1 EP 0484558B1 EP 91909800 A EP91909800 A EP 91909800A EP 91909800 A EP91909800 A EP 91909800A EP 0484558 B1 EP0484558 B1 EP 0484558B1
Authority
EP
European Patent Office
Prior art keywords
coil
coil conductors
high frequency
insulating layer
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91909800A
Other languages
English (en)
French (fr)
Other versions
EP0484558A4 (en
EP0484558A1 (de
Inventor
Atsuo Senda
Osamu Kanou
Katsuhiro Misaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of EP0484558A1 publication Critical patent/EP0484558A1/de
Publication of EP0484558A4 publication Critical patent/EP0484558A4/en
Application granted granted Critical
Publication of EP0484558B1 publication Critical patent/EP0484558B1/de
Anticipated expiration legal-status Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/045—Trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer

Definitions

  • the present invention relates generally to a high frequency coil having a structure in which strip-shaped coil conductors are formed on the surface of an insulating substrate and a method of fabricating the same, and more particularly, to a high frequency coil whose Q can be increased without increasing the thickness and the line width of coil conductors and a method of fabricating the same.
  • the high frequency coil used in a microwave circuit or the like has had the following structure. More specifically, the high frequency coil has a structure in which a coil conductor, for example, of a spiral type, is formed on the surface of an insulating substrate, an input electrode and an output electrode are respectively formed in side edge portions opposed to each other of the insulating substrate, and the input electrode and the output electrode are electrically connected to an outer end and an inner end of the above coil conductor, respectively.
  • the above described high frequency coil is disclosed in, for example, British Patent Publication GB2,223,624A.
  • a coil conductor is formed by a thin film forming technique such as sputtering or vacuum evaporation. Therefore, the high frequency coil has the disadvantage in that the electrical resistance of the coil conductor is increased because the thickness of the coil conductor is not made too large, resulting in decreased Q of the coil. Therefore, attempts have been conventionally made to lower the electrical resistance of the coil conductor by increasing the thickness and the line width of the coil conductor so as to increase Q of the coil.
  • the conventional high frequency coil has the disadvantage in that if the line width of the coil conductor is increased, the substrate is increased in size by the amount of the increase, to make it impossible to meet the recent requirement of miniaturization of electronic components.
  • the high frequency coil has the disadvantage in that there occurs a undesirable phenomenon referred to as under etching.
  • the thickness of a coil conductor is increased by superimposing on the upper surface of one coil conductor another coil conductor.
  • the line width of the coil conductor and the spacing between portions where the coil conductors are wound are very small, i.e., several tens of micrometers, therby to make it very difficult in the fabrication to further superimpose on one coil conductor another coil conductor having the same size with high precision.
  • DE-U-88 01 879 discloses an inductor comprising an electrical insulating support member, two spiral-type conductors being mounted on the two opposing surfaces of the insulating support member, and two central contact elements as well as two external contact elements. By means of a through hole the two centre contact elements of the two spiral-type conductors are connected to each other, and the external contact members represent the external terminals for this inductor.
  • GB-A-2 083 952 discloses a microcoil assembly comprising a spiral-patterned flat conductor 1 which is formed on both surfaces of an insulating substrate.
  • the conductors on both surfaces of the substrate are arranged so that electric current can flow through the two spiral-patterned conductors in the same directions.
  • the two conductors comprise inner ends which are connected to each other by a through hole, and outer ends which form the external lead terminals of the microcoil assembly.
  • JP-A-2-123 706 discloses a high frequency coil comprising a substrate, one spiral-patterned conductor being positioned on one of the surfaces of said substrate, and two terminal electrodes. This document does not deal with the reduction of the resistance of an inductor comprising two coil conductors being positioned on opposite surfaces of a insulating substrate.
  • an object of the present invention is to eliminate the above described disadvantages of the conventional high frequency coil and to provide a high frequency coil having a structure in which Q can be increased without increasing the thickness and the line width of coil conductors and a method of fabricating the same.
  • the inventors of the present application have found that if a pluarlity of high frequency coils are electrically connected in parallel so as to decrease the conductor resistance of coil conductors, the conductor resistance can be decreasd but the inductance is similarly decreased so that Q of the coil cannot be improved.
  • the inventors have found that the amount of the decrease in conductor resistance is larger than the amount of the decrease in inductance if a pair of coil conductors are formed such that the directions of currents flowing through the coil conductors are the same and so as to be opposed to each other with the insulating layer being interposed therebetween and have found that Q of the coil can be increased because the decrease in inductance can be restrained, thereby to make the present invention.
  • a high frequency coil according to the present invention has a structure comprising at least one insulating layer, a pair of coil conductors formed on both major surfaces of the insulating layer so as to be opposed to each other with the above insulating layer being interposed therebetween, and an input electrode and an output electrode formed on the above insulating layer, in which one end of each of the above pair of coil conductors is electrically connected to the input electrode and the other end thereof is electrically connected to the output electrode such that the directions of currents flowing through the above coil conductors are the same.
  • the high frequency coil according to the present invention includes one having the following multilayer structure in addition to the above described structure in which a pair of coil conductors is formed on both major surfaces of one insulating layer. More specifically, the present invention also includes a structure comprising a plurality of insulating layers, in which the insulating layers and pairs of coil conductors are alternately laminated such that the pair of coil conductors is arranged on both major surfaces of each of the insulating layers laminated.
  • an insulating layer made of an insulating material having sufficient mechanical strength to support coil conductors for example, glass or ceramics is generally used as the above described insulating layer.
  • the insulating layers may be made of a flexible insulating material provided that the lowermost insulating layer is made of such a rigid insulating material.
  • the known thin film forming technique such as a sputtering process, an evaporation process, an ion plating process or a screen printing process can be utilized. That is, a method of forming the coil conductors is not particularly limited.
  • a method of fabricating a high frequency coil comprises the steps of preparing an insulating layer, forming a conductor on the entire surface of the above insulating layer, etching the above conductor to form first and second coil conductors formed so as to be opposed to each other while being separated by the insulating layer and input and output electrodes on both major surfaces of the above insulating layer, coating both the entire major surfaces of the above insulating layer with photosensitive synthetic resin to form photosensitive synthetic resin films, disposing masks on portions, which face the above input and output electrodes and one end of each of the coil conductors, of the above photosensitive synthetic resin films to expose and develop the photosensitive synthetic resin films, removing portions other than the portions of the photosensitive synthetic resin films hardened by the exposure after the development to expose the input and output electrodes and to form a through hole in the portion facing the above one end of each of the coil conductors, and forming a conductor film on the above insulating layer to electrically connect the output electrode to the one end of each
  • a pair of coil conductors is formed so as to be opposed to each other while being separated by an insulating layer, and the directions of currents flowing through the coil conductors are the same. Accordingly, the decrease in conductor resistance is made larger than the decrease in inductance. Consequently, inductance L is relatively increased, as compared with that of the conventional high frequency coil having decreased conductor resistance. In the high frequency coil according to the present invention, therefore, Q of the coil can be increased by the amount of the relative increase in the inductance L.
  • Q of the coil can be increased without increasing the thickness and the line width of the coil conductors. Consequently, the increase in size of components of the high frequency coil can be avoided, and no undesired phenomena such as under etching occur at the time of the fabrication of the high frequency coil.
  • Figs. 1 to 3 are diagrams for explaining a high frequency coil according to one embodiment of the present invention.
  • a chip-type high frequency coil 1 is constructed by pattern formation of spiral-shaped first and second coil conductors 3 and 4 on both major surfaces 2a and 2b of an insulating substrate 2 made of glass or ceramics such as alumina.
  • an input electrode 5 and an output electrode 6 are formed on both side surfaces of the above insulating substrate 2 in the longitudinal direction.
  • Outer ends 3a and 4a of the above first and second coil conductors 3 and 4 are connected to the input electrode 5.
  • the surfaces of the first and second coil conductors 3 and 4 excluding regions on the input and output electrodes 5 and 6 on both major surfaces of the above insulating substrate 2 are coated with insulating layers 7 made of polyimide or polyamide resin.
  • Through holes 8 are formed in portions, which face inner ends 3b and 4b of the above first and second coil conductors 3 and 4, of the insulating layers 7.
  • lead electrodes 9 are respectively formed on the upper surfaces of the above insulating layers 7, and one ends of the lead electrodes 9 are respectively connected to the inner ends 3b and 4b of the first and second coil conductors 3 and 4 through the above through holes 8 and the other ends thereof are respectively connected to the output electrode 6.
  • first and second coil conductors 3 and 4 are so constructed that the directions of currents flowing through the first and second coil conductors 3 and 4 are the same.
  • step (4) when the inner ends 3b and 4b of the coil conductors 3 and 4 are connected to the output electrode 6, a method of connecting the inner ends 3b and 4b and the output electrode 6 by wire bonding using an Au line and fastening them with nylon or adhesives of an epoxy resin system may be adopted.
  • the first and second coil conductors 3 and 4 are formed on both the major surfaces 2a and 2b of the insulating substrate 2 so as to be opposed to each other with the substrate 2 being interposed therebetween, and the outer ends 3a and 4a of the coil conductors 3 and 4 are connected to the input electrode 5 and the inner ends 3b and 4b thereof are connected to the output electrode 6, thereby to make the directions of currents flowing through the coil conductors 3 and 4 the same. Accordingly, the conductor resistance can be reduced to approximately half, and Q of the coil can be improved because the decrease in inductance can be restrained.
  • the value of Q is 30 (at 400 MHz) if the value of L is 18 nH.
  • the value of Q is 35 (at 400 MHz) if the value of L is 10.5 nH, thereby to make it possible to improve Q by approximately 15 %.
  • the first and second coil conductors 3 and 4 may be merely formed opposed to each other on both the major surfaces of the insulating substrate 2 by the thin film forming technique. Accordingly, the thickness and the line width of the coil conductors need not be increased unlike the conventional example. Consequently, the increase in size of components can be avoided, and there arise no problems such as under etching.
  • the high frequency coil 1 according to the present embodiment is employed when the thickness and the line width of the coil conductors are made as large as possible and the conductor resistance is made smaller to improve Q, a larger effect is obtained.
  • the present invention may be applied to a multilayer coil constructed by forming one high frequency coil and then, forming an insulating layer in a portion excluding input and output electrodes and forming coil conductors on the upper surface of the insulating layer, or further repeatedly forming insulating layers and coil conductors. More specifically, as shown in Fig. 4, a multilayered high frequency coil may be constructed by further forming an insulating layer 11 and a third coil conductor 12 on a coil conductor 3 formed on the upper surface of one insulating substrate 2. Alternatively, a multilayered high frequency coil having more layers than those in the example as shown in Fig. 4 may be constructed by further laminating insulating layers and coil conductors.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Claims (7)

  1. Eine Hochfrequenzspule mit folgenden Merkmalen:
    zumindest einer Isolationsschicht (2);
    zumindest zwei Spulenleitern (3, 4), die auf zwei gegenüberliegenden Oberflächen der Isolationsschicht (2) gegenüberliegend zueinander angeordnet sind; und
    einer Eingangselektrode (5) und einer Ausgangselektrode (6),
    dadurch gekennzeichnet, daß
    die Spulenleiter (3, 4) derart angeordnet sind, daß Ströme, die durch die zwei Spulenleiter (3, 4) fließen, die gleiche Richtung aufweisen; und
    die Spulenleiter (3, 4) derart mit der Eingangselektrode (5) und der Ausgangselektrode (6) verbunden sind, daß die Spulenleiter (3, 4) elektrisch parallelgeschaltet sind.
  2. Die Hochfrequenzspule gemäß Anspruch 1, gekennzeichnet durch
    eine Mehrzahl von laminierten Isolationsschichten (2, 11), wobei die Isolationsschichten (2, 11) und Paare von Spulenleitern (3, 4, 12) abwechselnd derart laminiert sind, daß das Paar von Spulenleitern (3, 4, 3, 12) auf beiden Hauptoberflächen jeder der laminierten Isolationsschichten (2, 11) angeordnet ist.
  3. Die Hochfrequenzspule gemäß Anspruch 1 oder 2, dadurch gekennzeichnet,
    daß die Eingangselektrode (5) und die Ausgangselektrode (6) derart gebildet sind, daß dieselben ein Paar von Seitenoberflächen der Isolationsschicht (2) bedecken, die einander gegenüberliegen.
  4. Die Hochfrequenzspule gemäß einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß
    die Isolationsschicht (2, 11) ein rechteckiges Isolationssubstrat, das aus einem isolierenden Material hergestellt ist, ist.
  5. Die Hochfrequenzspule gemäß einem der Ansprüche 1 bis 4, gekennzeichnet durch
    isolierende Harzschichten (7), die derart gebildet sind, daß sie jeweils das Paar von Spulenleitern (3, 4) bedecken.
  6. Die Hochfrequenzspule gemäß einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß
    eine ebene Form des Spulenleiters (3, 4, 12) spiralförmig ist.
  7. Ein Verfahren zum Herstellen einer Hochfrequenzspule gemäß einem der Ansprüche 1 bis 6, gekennzeichnet durch folgende Schritte:
    Vorbereiten einer Isolationsschicht (2);
    Bilden eines Leiters auf der gesamten äußeren Oberfläche der Isolationsschicht (2);
    Ätzen des Leiters, um einen ersten und einen zweiten Spulenleiter (3, 4), die derart gebildet sind, daß sie einander gegenüberliegen, während sie durch die Isolationsschicht (2) getrennt sind, und eine Eingangs- und eine Ausgangs-Elektrode (5, 6) auf beiden Hauptoberflächen der Isolationsschicht (2) zu bilden;
    Beschichten der gesamten Hauptoberflächen der Isolationsschicht (2) mit einem Photo-empfindlichen synthetischen Harz, um Photo-empfindliche synthetische Harzfilme zu bilden;
    Anordnen von Masken auf Abschnitten der Photo-empfindlichen synthetischen Harzfilme, die der Eingangs- und der Ausgangs-Elektrode (5, 6) und einem Ende jedes Spulenleiters (3, 4) gegenüberliegen, um die Photo-empfindlichen synthetischen Harzfilme (7) zu belichten und zu entwickeln;
    Entfernen von Abschnitten mit Ausnahme der Abschnitte der Photo-empfindlichen Harzfilme, die durch die Belichtung gehärtet sind, nach der Entwicklung, um dadurch die Eingangs- und die Ausgangs-Elektrode (5, 6) zu exponieren und ein Durchgangsloch (8) in dem Abschnitt zu bilden, der einem Ende jedes Spulenleiters (3, 4) gegenüberliegt; und
    Bilden eines Leiterfilms (9) auf dem Harzfilm (7), um dadurch die Ausgangselektrode (6) mit dem Ende jedes Spulenleiters (3b, 4b) zu verbinden, das zu einer inneren Oberfläche des Durchgangslochs (8) exponiert ist.
EP91909800A 1990-05-25 1991-05-24 Hochfrequenzspule und verfahren zu ihrer herstellung Expired - Lifetime EP0484558B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP136647/90 1990-05-25
JP13664790A JPH0430406A (ja) 1990-05-25 1990-05-25 高周波コイル
PCT/JP1991/000698 WO1991019303A1 (fr) 1990-05-25 1991-05-24 Bobine haute frequence et procede pour sa fabrication

Publications (3)

Publication Number Publication Date
EP0484558A1 EP0484558A1 (de) 1992-05-13
EP0484558A4 EP0484558A4 (en) 1993-06-30
EP0484558B1 true EP0484558B1 (de) 1995-07-26

Family

ID=15180214

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91909800A Expired - Lifetime EP0484558B1 (de) 1990-05-25 1991-05-24 Hochfrequenzspule und verfahren zu ihrer herstellung

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EP (1) EP0484558B1 (de)
JP (1) JPH0430406A (de)
DE (1) DE69111569T2 (de)
WO (1) WO1991019303A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3409341B2 (ja) * 1992-11-02 2003-05-26 株式会社村田製作所 コイル
DE19835016B4 (de) * 1998-08-03 2006-09-21 Bartels Mikrotechnik Gmbh Blockweise Fertigung von Induktivitäten mit Mikrotechniken
DE69931670T2 (de) * 1998-12-11 2006-09-21 Matsushita Electric Industrial Co., Ltd., Kadoma Hochfrequenzinduktivität mit hohem Q-Faktor
FR2792775B1 (fr) * 1999-04-20 2001-11-23 France Telecom Dispositif de circuit integre comprenant une inductance a haut coefficient de qualite
JP3634305B2 (ja) 2001-12-14 2005-03-30 三菱電機株式会社 積層インダクタンス素子
KR102443196B1 (ko) * 2015-09-25 2022-09-15 삼성전자주식회사 전자 장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1191592A (fr) * 1958-02-15 1959-10-20 Dumas & Tible Perfectionnements apportés aux circuits imprimés
JPS49101249U (de) * 1972-12-21 1974-08-31
KR890004585B1 (ko) * 1980-09-11 1989-11-16 아사히가세이고교가부시키가이샤 마이크로코일(microcoil)
DE8801879U1 (de) * 1988-02-13 1988-04-07 Akyürek, Altan, Dipl.-Ing., Wien Induktivität für Leistungselektronik- bzw. Leistungselektrikanwendungen
JPH07101652B2 (ja) * 1988-11-01 1995-11-01 株式会社村田製作所 高周波コイルの製造方法

Also Published As

Publication number Publication date
EP0484558A4 (en) 1993-06-30
WO1991019303A1 (fr) 1991-12-12
EP0484558A1 (de) 1992-05-13
DE69111569T2 (de) 1996-03-21
JPH0430406A (ja) 1992-02-03
DE69111569D1 (de) 1995-08-31

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