EP0802028B1 - Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente - Google Patents

Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente Download PDF

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Publication number
EP0802028B1
EP0802028B1 EP19970105331 EP97105331A EP0802028B1 EP 0802028 B1 EP0802028 B1 EP 0802028B1 EP 19970105331 EP19970105331 EP 19970105331 EP 97105331 A EP97105331 A EP 97105331A EP 0802028 B1 EP0802028 B1 EP 0802028B1
Authority
EP
European Patent Office
Prior art keywords
slices
fact
cutting
heel
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP19970105331
Other languages
English (en)
French (fr)
Other versions
EP0802028A2 (de
EP0802028A3 (de
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HCT Shaping Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HCT Shaping Systems SA filed Critical HCT Shaping Systems SA
Publication of EP0802028A2 publication Critical patent/EP0802028A2/de
Publication of EP0802028A3 publication Critical patent/EP0802028A3/de
Application granted granted Critical
Publication of EP0802028B1 publication Critical patent/EP0802028B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Definitions

  • the present invention relates to a device for putting in storage element of slices of a sawn block attached by a heel to a cutting support (see e.g. JP-A-06-039 831).
  • the block to be cut is generally mounted glued on a plate intended for use unique, if possible a material with characteristics approaching the material to be cut.
  • This plate is mechanically mounted on a second support cutting which serves as a link with the cutting machine.
  • the block of material will be cut completely and the cutting tool will open into the operating plate unique.
  • the block will appear as a set of separate parallel slices from each other by the saw cut but attached at their base by a partially cut heel and always part of the single use plate mounted on a cutting support. It will then be necessary to separate the slices of the single use plate.
  • the use of the slices thus obtained requires keep them separate and put them in items storage often called cassettes for processing subsequent such as for example washing, polishing or simply removing the remnants of glue.
  • the setting up manual storage is long and tedious with in addition significant risks of breakage.
  • the object of the present invention is to remedy to the aforementioned drawbacks and the device according to the invention is characterized, for this purpose, by the fact that it comprises a cutting mechanism comprising a cutting tool arranged to cut out said heel and a member displacement likely to produce relative displacement between all of the slices and the cutting tool to present the slices one by one to the cutting tool and to detach the slices one by one from the heel, and a recovery mechanism arranged to resume each detached slice and place it in an empty box of the storage element.
  • the setting operation storage item is made easier and faster, reliable and streamlined. Slices, even thick very reduced, can be treated easily and without risk of being damaged.
  • the operating device slice by slice is better suited and offers better performance, increased productivity and superior reliability.
  • the device comprises a single use plate on which the block is fixed and which is mounted on the cutting support and the cutting mechanism is arranged to cut said heel or single use plate according to a direction substantially perpendicular to the edges for separate them one by one from the heel.
  • the recovery mechanism comprises a conveyor belt for transferring the wafers separated from the heel towards the storage element.
  • the device comprises an installation with one or more nozzles intended inject a pressurized fluid to facilitate detachment of the released tranche.
  • the device for placing in cassette attached slices by a heel to a cutting support, object of the present invention therefore includes a table on which is fixed the cutting support with its cut block and stuck on the single use plate, a mechanism cutting allowing the cutting of the heel edge by slice consisting of a cutting tool, an element of relative displacement of all the slices allowing to present them one by one to the cutting tool, a slice and system recovery element carrier for subsequent storage item.
  • Slice by slice can be cut either by moving the block, the cutting tool being fixed, either by advancing the tool, the block then being fixed. he however, it can happen that both movements are required.
  • Figure 1 schematically illustrates the principle of application of the present invention.
  • the edge 2 falls on the conveyor belt 9 which will deposit it in a ramp 10 on a cushion of water.
  • the storage element 11 will receive the slice in one of its boxes empty 12 and then moves along column 13 thanks to the motor 14 in a substantially perpendicular direction on the plane of the ramp 10.
  • the single use plate 4 advantageously consists of a material whose physical and / or chemical properties are close to those of block 1. This plate 4 is also partially sawn by wires or blades during training slices. Separation of slices 2 from heel 3 by the cutting tool 7 is therefore carried out at the single use plate 4 in a perpendicular direction slices 2.
  • Figure 2 illustrates more particularly a solution cutting by a band saw 15 driven by wheels 16.
  • the cut edge 2 is separated here by a jet liquid from nozzle 17.
  • Figure 3 shows more particularly block 1 with its edges 2 partially supported by their heel 3 sawn in the single use plate 4 fixed on the cutting support 5.
  • the cutting tool 7 could for example be constituted by a mechanical cutting tool, such than a milling cutter, disc saw, wire saw, band saw or ribbon, or any other cutting system, for example thermal such as laser, plasma, torch, etc., or even a liquid pressure attack or dissolving system chemical.
  • the device according to the invention is advantageously used in the case of block of axial symmetry as by example of single crystals of silicon or semiconductor materials of great production. Any block of cut material by wire saws or multi-blades can however be processed by the device which is the subject of the present invention.
  • the embodiments described above are in no way limiting and that they can receive any desirable changes to inside the frame as defined by claim 1.
  • the cutting tool 7 could be arranged to move perpendicular to slices 2 compared to block 1 which would be stationary.
  • Nozzle 17 could be replaced by an installation comprising several nozzles intended to inject a fluid under pressure to facilitate detachment of the last tranche released.
  • the device could have a tank containing a liquid, for example water, in which all or part of the device is submerged to prevent drying of slices 2 during the procedure.
  • the band conveyor 9 could be replaced by any other means of transport.
  • Ramp 10 could be devoid of water cushion or even be removed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Claims (9)

  1. Vorrichtung, um mit einem Zwischenstück (3) auf einem Schneidsupport (4, 5) befestigte Wafer (2) eines gesägten Rohlings (1) in ein Aufbewahrungselement (11) einzubringen, dadurch gekennzeichnet, dass sie einen Schneidmechanismus (6, 7, 8) mit einem Schneidwerkzeug (7, 15), das dafür eingerichtet ist, das benannte Zwischenstück (3) zu zersägen, sowie mit einem Bewegungsorgan (6), das in der Lage ist, eine Relativbewegung zwischen der Gruppe von Wafern (2) und dem Schneidwerkzeug (7, 15) zu erzeugen, um die Wafer (2) dem Schneidwerkzeug einzeln darzubieten und die Wafer einzeln vom Zwischenstück (3) abzulösen, sowie einen Aufnahmemechanismus (9, 10) umfasst, der dafür eingerichtet ist, jeden abgelösten Wafer (2) aufzunehmen und ihn in ein leeres Fach des Aufbewahrungselements (11) zu legen.
  2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass sie eine Platte zur einmaligen Verwendung (4) umfasst, auf der der Rohling (1) befestigt ist und die auf den Schneidsupport (5) montiert ist, und dadurch, dass der Schneidmechanismus (6, 7, 8) so eingerichtet ist, dass er das benannte Zwischenstück (3) oder die Platte zur einmaligen Verwendung (4) in einer Richtung zerschneidet, die im Wesentlichen senkrecht zu den Wafern (2) ist, um sie einzeln vom Zwischenstück abzutrennen.
  3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Schneidmechanismus so eingerichtet ist, dass der Schneidsupport (4, 5) gegen das Schneidwerkzeug (7, 15) bewegt wird, das ortsfest ist.
  4. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass das Schneidwerkzeug (7) so eingerichtet ist, dass es sich senkrecht zu den Wafern (2) relativ zum Rohling (1) bewegt.
  5. Vorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass der Aufnahmemechanismus ein Förderband (9) umfasst, das dazu bestimmt ist, die vom Zwischenstück abgetrennten Wafer (2) zum Aufbewahrungselement (11) zu fördern.
  6. Vorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass der Aufnahmemechanismus eine Rampe (10) umfasst, auf der die abgetrennten Wafer (2) mit oder ohne Wasserkissen gleiten können, um in ein Fach des Aufbewahrungselements (11) abgelegt zu werden, das in einer zur Ebene der Rampe (10) im Wesentlichen senkrechten Richtung beweglich montiert ist.
  7. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass das Schneidwerkzeug eine Schleifscheibe (7), eine Streifen-, Band- oder Drahtsäge (15), eine Fräse oder ein Organ ist, das nach einem thermischen oder einem Druckfluidverfahren arbeitet.
  8. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass sie eine Einrichtung umfasst, die eine oder mehrere Düsen (17) aufweist, die dazu bestimmt sind, ein Druckfluid einzuspritzen, um das Ablösen des freigesetzten Wafers (2) zu erleichtern.
  9. Vorrichtung nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass sie eine Wanne umfasst, die eine Flüssigkeit enthält, in die die Vorrichtung ganz oder teilweise eintaucht, um das Trocknen von im Verfahrensverlauf befindlichen Wafern (2) zu verhindern.
EP19970105331 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente Expired - Lifetime EP0802028B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH95696A CH691169A5 (fr) 1996-04-16 1996-04-16 Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
CH95696 1996-04-16
CH956/96 1996-04-16

Publications (3)

Publication Number Publication Date
EP0802028A2 EP0802028A2 (de) 1997-10-22
EP0802028A3 EP0802028A3 (de) 1998-04-08
EP0802028B1 true EP0802028B1 (de) 2003-05-21

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970105331 Expired - Lifetime EP0802028B1 (de) 1996-04-16 1997-03-29 Vorrichtung für das Einlegen von durch Zersägen eines Rohlings erhaltenen Wafern in Aufbewahrungselemente

Country Status (4)

Country Link
EP (1) EP0802028B1 (de)
JP (1) JPH1070095A (de)
CH (1) CH691169A5 (de)
DE (1) DE69722071T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE19950068B4 (de) * 1999-10-16 2006-03-02 Schmid Technology Systems Gmbh Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102005053410B4 (de) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102009060575B9 (de) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
CN111452237A (zh) * 2020-05-13 2020-07-28 张家港市超声电气有限公司 晶拖脱胶装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (fr) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Procédé et appareil pour le découpage des baguettes en bois utilisées comme trame dans les nattes et analogues
JPS61125767A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPH0639831A (ja) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd スライシングマシンにおけるウエハーの収納装置
JPH07205140A (ja) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd ワイヤーソーのウェーハ取出方法

Also Published As

Publication number Publication date
JPH1070095A (ja) 1998-03-10
DE69722071D1 (de) 2003-06-26
CH691169A5 (fr) 2001-05-15
EP0802028A2 (de) 1997-10-22
DE69722071T2 (de) 2004-03-18
EP0802028A3 (de) 1998-04-08

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