JPH1070095A - ブロックの鋸引きによって得られた薄片を保存要素に入れる装置 - Google Patents

ブロックの鋸引きによって得られた薄片を保存要素に入れる装置

Info

Publication number
JPH1070095A
JPH1070095A JP11357397A JP11357397A JPH1070095A JP H1070095 A JPH1070095 A JP H1070095A JP 11357397 A JP11357397 A JP 11357397A JP 11357397 A JP11357397 A JP 11357397A JP H1070095 A JPH1070095 A JP H1070095A
Authority
JP
Japan
Prior art keywords
slice
heel
cutting
cutting tool
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11357397A
Other languages
English (en)
Japanese (ja)
Inventor
Charles Hauser
オゼール シャルル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPH1070095A publication Critical patent/JPH1070095A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP11357397A 1996-04-16 1997-04-16 ブロックの鋸引きによって得られた薄片を保存要素に入れる装置 Pending JPH1070095A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH95696A CH691169A5 (fr) 1996-04-16 1996-04-16 Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc.
CH956/96 1996-04-16

Publications (1)

Publication Number Publication Date
JPH1070095A true JPH1070095A (ja) 1998-03-10

Family

ID=4199092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11357397A Pending JPH1070095A (ja) 1996-04-16 1997-04-16 ブロックの鋸引きによって得られた薄片を保存要素に入れる装置

Country Status (4)

Country Link
EP (1) EP0802028B1 (de)
JP (1) JPH1070095A (de)
CH (1) CH691169A5 (de)
DE (1) DE69722071T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003512196A (ja) * 1999-10-16 2003-04-02 エーシーアール オートメーション イン クリーンルーム ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状基板を分離して引き離すための方法および装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900671C2 (de) * 1999-01-11 2002-04-25 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung
DE102005016519B3 (de) * 2005-04-08 2007-03-01 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen, Vereinzeln und Transportieren von in einer Halteeinrichtung sequenziell angeordneten Substraten
DE102005016518B3 (de) * 2005-04-08 2006-11-02 Rena Sondermaschinen Gmbh Vorrichtung zum Ablösen und Vereinzeln von Substraten, insbesondere Wafern hergestellt aus Substratblöcken
DE102005023618B3 (de) * 2005-05-21 2006-12-07 Aci-Ecotec Gmbh & Co.Kg Einrichtung zum Vereinzeln von Silizium-Wafern von einem Stapel
DE102005053410B4 (de) * 2005-11-09 2008-01-24 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
DE102006059809B4 (de) * 2006-12-15 2008-08-21 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102009060575B9 (de) 2009-12-23 2013-11-28 Gebrüder Decker GmbH & Co. KG Verfahren sowie Vorrichtung zum Vereinzeln von Wafern aus einem Ingot
DE102010045098A1 (de) 2010-09-13 2012-03-15 Rena Gmbh Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
DE102011090053A1 (de) * 2011-12-28 2013-07-04 Robert Bosch Gmbh Vereinzelungsvorrichtung und Verfahren zum Vereinzeln eines metallischen oder keramischen Rohteiles
CN111452237A (zh) * 2020-05-13 2020-07-28 张家港市超声电气有限公司 晶拖脱胶装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR481627A (fr) * 1915-05-12 1916-12-28 Frans Henrik Aubert Wielgolask Procédé et appareil pour le découpage des baguettes en bois utilisées comme trame dans les nattes et analogues
JPS61125767A (ja) * 1984-11-20 1986-06-13 Sumitomo Metal Ind Ltd ワイヤソ−のウエハ取出方法
JPH0639831A (ja) * 1991-02-13 1994-02-15 Nippon Spindle Mfg Co Ltd スライシングマシンにおけるウエハーの収納装置
JPH07205140A (ja) * 1994-01-10 1995-08-08 Tokyo Seimitsu Co Ltd ワイヤーソーのウェーハ取出方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003512196A (ja) * 1999-10-16 2003-04-02 エーシーアール オートメーション イン クリーンルーム ゲゼルシャフト ミット ベシュレンクテル ハフツング 板状基板を分離して引き離すための方法および装置

Also Published As

Publication number Publication date
EP0802028B1 (de) 2003-05-21
DE69722071D1 (de) 2003-06-26
CH691169A5 (fr) 2001-05-15
EP0802028A2 (de) 1997-10-22
DE69722071T2 (de) 2004-03-18
EP0802028A3 (de) 1998-04-08

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