EP0841167A3 - Méthode de production d'un trou traversant, substrat silicon avec un trou traversant, dispositif utilisant un substrat méthode de production d'une tête d'impression à jet d'encre et tête d'impression à jet d'encre - Google Patents

Méthode de production d'un trou traversant, substrat silicon avec un trou traversant, dispositif utilisant un substrat méthode de production d'une tête d'impression à jet d'encre et tête d'impression à jet d'encre Download PDF

Info

Publication number
EP0841167A3
EP0841167A3 EP97119648A EP97119648A EP0841167A3 EP 0841167 A3 EP0841167 A3 EP 0841167A3 EP 97119648 A EP97119648 A EP 97119648A EP 97119648 A EP97119648 A EP 97119648A EP 0841167 A3 EP0841167 A3 EP 0841167A3
Authority
EP
European Patent Office
Prior art keywords
hole
substrate
etching
layer
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97119648A
Other languages
German (de)
English (en)
Other versions
EP0841167B1 (fr
EP0841167A2 (fr
Inventor
Takayuki Yagi
Junichi Kobayashi
Yasushi Kawasumi
Genzo Momma
Kenji Makino
Kei Fujita
Yasushi Matsuno
Yukihiro Hayakawa
Masahiro Takizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0841167A2 publication Critical patent/EP0841167A2/fr
Publication of EP0841167A3 publication Critical patent/EP0841167A3/fr
Application granted granted Critical
Publication of EP0841167B1 publication Critical patent/EP0841167B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/13—Heads having an integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Pressure Sensors (AREA)
  • Weting (AREA)
  • Micromachines (AREA)
EP19970119648 1996-11-11 1997-11-10 Méthode de production d'un trou tranversant et utilisation de cette méthode pour produire un substrat silicon avec un trou traversant ou un dispositif utilisant ce substrat, méthode de production d'une imprimant à jet d'encre et utilisation de cette méthode pour produire une imprimante à jet d'encre Expired - Lifetime EP0841167B1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP298642/96 1996-11-11
JP298643/96 1996-11-11
JP29864296 1996-11-11
JP29864396 1996-11-11
JP29864296 1996-11-11
JP29864396 1996-11-11

Publications (3)

Publication Number Publication Date
EP0841167A2 EP0841167A2 (fr) 1998-05-13
EP0841167A3 true EP0841167A3 (fr) 2000-03-08
EP0841167B1 EP0841167B1 (fr) 2004-09-15

Family

ID=26561605

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19970119648 Expired - Lifetime EP0841167B1 (fr) 1996-11-11 1997-11-10 Méthode de production d'un trou tranversant et utilisation de cette méthode pour produire un substrat silicon avec un trou traversant ou un dispositif utilisant ce substrat, méthode de production d'une imprimant à jet d'encre et utilisation de cette méthode pour produire une imprimante à jet d'encre

Country Status (3)

Country Link
EP (1) EP0841167B1 (fr)
DE (1) DE69730667T2 (fr)
DK (1) DK0841167T3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7178905B2 (en) 2003-06-05 2007-02-20 Samsung Electronics Co., Ltd. Monolithic ink-jet printhead

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6273557B1 (en) 1998-03-02 2001-08-14 Hewlett-Packard Company Micromachined ink feed channels for an inkjet printhead
US6379571B1 (en) 1998-06-11 2002-04-30 Canon Kabushiki Kaisha Etching method for processing substrate, dry etching method for polyetheramide resin layer, production method of ink-jet printing head, ink-jet head and ink-jet printing apparatus
RU2144472C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Способ образования толстопленочного слоя в микроинжекционном устройстве
RU2151066C1 (ru) * 1998-11-03 2000-06-20 Самсунг Электроникс Ко., Лтд. Узел пластины сопла микроинжектора и способ его изготовления
RU2144470C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Микроинжектор и способ его изготовления (варианты)
RU2144471C1 (ru) * 1998-11-03 2000-01-20 Самсунг Электроникс Ко., Лтд. Способ сборки микроинжектора и устройство для осуществления способа
JP4690556B2 (ja) * 2000-07-21 2011-06-01 大日本印刷株式会社 微細パターン形成装置と微細ノズルの製造方法
IT1320599B1 (it) 2000-08-23 2003-12-10 Olivetti Lexikon Spa Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione.
US6675476B2 (en) 2000-12-05 2004-01-13 Hewlett-Packard Development Company, L.P. Slotted substrates and techniques for forming same
US6419346B1 (en) * 2001-01-25 2002-07-16 Hewlett-Packard Company Two-step trench etch for a fully integrated thermal inkjet printhead
US6481832B2 (en) 2001-01-29 2002-11-19 Hewlett-Packard Company Fluid-jet ejection device
US6517735B2 (en) 2001-03-15 2003-02-11 Hewlett-Packard Company Ink feed trench etch technique for a fully integrated thermal inkjet printhead
US6818138B2 (en) 2001-06-22 2004-11-16 Hewlett-Packard Development Company, L.P. Slotted substrate and slotting process
DE60222969T2 (de) 2001-08-10 2008-07-24 Canon K.K. Verfahren zur Herstellung eines Flüssigkeitsausstosskopfes, Substrat für einen Flüssigkeitsausstosskopf und dazugehöriges Herstellungsverfahren
ITTO20011019A1 (it) * 2001-10-25 2003-04-28 Olivetti I Jet Procedimento perfezionato per la costruzione di un condotto di alimentazione per una testina di stampa a getto di inchiostro.
US7105097B2 (en) 2002-01-31 2006-09-12 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
US6648454B1 (en) 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
US6880926B2 (en) 2002-10-31 2005-04-19 Hewlett-Packard Development Company, L.P. Circulation through compound slots
CN100355573C (zh) * 2002-12-27 2007-12-19 佳能株式会社 用于制造喷墨记录头的基础件
US6883903B2 (en) 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
US6821450B2 (en) 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
JP2005035281A (ja) 2003-06-23 2005-02-10 Canon Inc 液体吐出ヘッドの製造方法
US7429335B2 (en) 2004-04-29 2008-09-30 Shen Buswell Substrate passage formation
DE102005046156B3 (de) * 2005-09-27 2007-05-31 Siemens Ag Vorrichtung mit Funktionselement und Verfahren zum Herstellen der Vorrichtung
JP4144640B2 (ja) * 2006-10-13 2008-09-03 オムロン株式会社 振動センサの製造方法
DE102007031549B4 (de) 2007-07-06 2021-07-08 Robert Bosch Gmbh Vorrichtung aus einkristallinem Silizium und Verfahren zur Herstellung einer Vorrichtung aus einkristallinem Silizium
WO2009067123A1 (fr) * 2007-11-24 2009-05-28 Hewlett-Packard Development Company, L.P. Matrice de tête d'impression de dispositif d'impression à jet d'encre comportant une couche de protection de bord pour résistance chauffante
US9136160B2 (en) 2012-06-29 2015-09-15 Institute of Microelectronics, Chinese Academy of Sciences Solid hole array and method for forming the same
CN103510088B (zh) * 2012-06-29 2015-11-11 中国科学院微电子研究所 固态孔阵及其制作方法
CN103281661B (zh) * 2013-05-09 2019-02-05 上海集成电路研发中心有限公司 一种mems麦克风结构及其制造方法
JP2023108679A (ja) * 2022-01-26 2023-08-07 キヤノン株式会社 記録素子基板及びその製造方法
CN120315166B (zh) * 2025-06-17 2025-08-22 中科院南京天文仪器有限公司 基于双层电极协同刻蚀的mems变形镜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
EP0609012A2 (fr) * 1993-01-25 1994-08-03 Hewlett-Packard Company Méthode pour la fabrication d'une tête d'impression thermique par jet d'encre
EP0750992A2 (fr) * 1995-06-30 1997-01-02 Canon Kabushiki Kaisha Procédé de fabrication d'une tête à jet d'encre

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
EP0609012A2 (fr) * 1993-01-25 1994-08-03 Hewlett-Packard Company Méthode pour la fabrication d'une tête d'impression thermique par jet d'encre
EP0750992A2 (fr) * 1995-06-30 1997-01-02 Canon Kabushiki Kaisha Procédé de fabrication d'une tête à jet d'encre

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7178905B2 (en) 2003-06-05 2007-02-20 Samsung Electronics Co., Ltd. Monolithic ink-jet printhead

Also Published As

Publication number Publication date
EP0841167B1 (fr) 2004-09-15
DE69730667D1 (de) 2004-10-21
DE69730667T2 (de) 2005-09-22
EP0841167A2 (fr) 1998-05-13
DK0841167T3 (da) 2005-01-24

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