EP0924487A3 - Séchage à vide de matériau semi-conducteur - Google Patents
Séchage à vide de matériau semi-conducteur Download PDFInfo
- Publication number
- EP0924487A3 EP0924487A3 EP98124206A EP98124206A EP0924487A3 EP 0924487 A3 EP0924487 A3 EP 0924487A3 EP 98124206 A EP98124206 A EP 98124206A EP 98124206 A EP98124206 A EP 98124206A EP 0924487 A3 EP0924487 A3 EP 0924487A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor material
- vacuum drying
- vacuum
- prevail
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000001291 vacuum drying Methods 0.000 title 1
- 238000001035 drying Methods 0.000 abstract 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19756830A DE19756830A1 (de) | 1997-12-19 | 1997-12-19 | Vakuumtechnisches Trocknen von Halbleiterbruch |
| DE19756830 | 1997-12-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0924487A2 EP0924487A2 (fr) | 1999-06-23 |
| EP0924487A3 true EP0924487A3 (fr) | 1999-07-07 |
| EP0924487B1 EP0924487B1 (fr) | 2001-02-14 |
Family
ID=7852715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98124206A Expired - Lifetime EP0924487B1 (fr) | 1997-12-19 | 1998-12-17 | Séchage à vide de matériau semi-conducteur |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6170171B1 (fr) |
| EP (1) | EP0924487B1 (fr) |
| JP (1) | JPH11265875A (fr) |
| DE (2) | DE19756830A1 (fr) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7270706B2 (en) * | 2004-10-04 | 2007-09-18 | Dow Corning Corporation | Roll crusher to produce high purity polycrystalline silicon chips |
| FR2920046A1 (fr) * | 2007-08-13 | 2009-02-20 | Alcatel Lucent Sas | Procede de post-traitement d'un support de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs, et station de post-traitement pour la mise en oeuvre d'un tel procede |
| CN101561218B (zh) * | 2008-04-16 | 2010-12-08 | 富葵精密组件(深圳)有限公司 | 真空氮气烘箱 |
| US8756826B2 (en) * | 2010-11-30 | 2014-06-24 | Mei, Llc | Liquid coalescence and vacuum dryer system and method |
| DE102011004916B4 (de) | 2011-03-01 | 2013-11-28 | Wacker Chemie Ag | Vorrichtung und Verfahren zum Trocknen von Polysilicium |
| US10690413B2 (en) | 2012-02-01 | 2020-06-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12276454B2 (en) | 2020-04-21 | 2025-04-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12281847B2 (en) | 2020-04-21 | 2025-04-22 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9970708B2 (en) | 2012-02-01 | 2018-05-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12215925B2 (en) | 2020-04-21 | 2025-02-04 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10240867B2 (en) | 2012-02-01 | 2019-03-26 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10876792B2 (en) | 2012-02-01 | 2020-12-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| DE102012218748B4 (de) | 2012-10-15 | 2014-02-13 | Wacker Chemie Ag | Trocknen von Polysilicium |
| US10088230B2 (en) | 2012-11-08 | 2018-10-02 | Tekdry International, Inc. | Dryer for portable electronics |
| WO2014153007A1 (fr) | 2013-03-14 | 2014-09-25 | Revive Electronics, LLC | Procédés et appareils pour des dispositifs électroniques de séchage |
| US12584689B2 (en) | 2020-04-21 | 2026-03-24 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12510296B2 (en) | 2020-04-21 | 2025-12-30 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63302521A (ja) * | 1987-06-02 | 1988-12-09 | Mitsubishi Electric Corp | 半導体基板の乾燥装置 |
| EP0421902A1 (fr) * | 1989-10-06 | 1991-04-10 | Ultrasons Annemasse | Procédé de séchage sous vide de pièces diverses et dispositif de mise en oeuvre du procédé |
| EP0423377A1 (fr) * | 1989-09-15 | 1991-04-24 | International Business Machines Corporation | Procédé et dispositif pour le séchage d'objets |
| EP0539607A1 (fr) * | 1991-05-24 | 1993-05-05 | Nikku Industry Co., Ltd. | Appareil de sechage sous vide |
| US5263264A (en) * | 1990-01-25 | 1993-11-23 | Speedfam Clean System Company Limited | Method and apparatus for drying wet work |
| US5732478A (en) * | 1996-05-10 | 1998-03-31 | Altos Engineering, Inc. | Forced air vacuum drying |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4816081A (en) * | 1987-02-17 | 1989-03-28 | Fsi Corporation | Apparatus and process for static drying of substrates |
| JPH0422125A (ja) * | 1990-05-17 | 1992-01-27 | Fujitsu Ltd | 半導体ウエハの湿式処理方法 |
| JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
| US5331487A (en) * | 1992-01-16 | 1994-07-19 | International Business Machines Corporation | Direct access storage device with vapor phase lubricant system and a magnetic disk having a protective layer and immobile physically bonded lubricant layer |
| US5301701A (en) * | 1992-07-30 | 1994-04-12 | Nafziger Charles P | Single-chamber cleaning, rinsing and drying apparatus and method therefor |
| DE69420474T2 (de) * | 1993-06-30 | 2000-05-18 | Applied Materials Inc | Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum |
| US5791895A (en) * | 1994-02-17 | 1998-08-11 | Novellus Systems, Inc. | Apparatus for thermal treatment of thin film wafer |
| US5551165A (en) * | 1995-04-13 | 1996-09-03 | Texas Instruments Incorporated | Enhanced cleansing process for wafer handling implements |
-
1997
- 1997-12-19 DE DE19756830A patent/DE19756830A1/de not_active Ceased
-
1998
- 1998-12-08 US US09/207,496 patent/US6170171B1/en not_active Expired - Fee Related
- 1998-12-17 DE DE59800476T patent/DE59800476D1/de not_active Expired - Fee Related
- 1998-12-17 EP EP98124206A patent/EP0924487B1/fr not_active Expired - Lifetime
- 1998-12-18 JP JP10360982A patent/JPH11265875A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63302521A (ja) * | 1987-06-02 | 1988-12-09 | Mitsubishi Electric Corp | 半導体基板の乾燥装置 |
| EP0423377A1 (fr) * | 1989-09-15 | 1991-04-24 | International Business Machines Corporation | Procédé et dispositif pour le séchage d'objets |
| EP0421902A1 (fr) * | 1989-10-06 | 1991-04-10 | Ultrasons Annemasse | Procédé de séchage sous vide de pièces diverses et dispositif de mise en oeuvre du procédé |
| US5263264A (en) * | 1990-01-25 | 1993-11-23 | Speedfam Clean System Company Limited | Method and apparatus for drying wet work |
| EP0539607A1 (fr) * | 1991-05-24 | 1993-05-05 | Nikku Industry Co., Ltd. | Appareil de sechage sous vide |
| US5732478A (en) * | 1996-05-10 | 1998-03-31 | Altos Engineering, Inc. | Forced air vacuum drying |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 013, no. 139 (E - 738) 6 April 1989 (1989-04-06) * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0924487A2 (fr) | 1999-06-23 |
| DE59800476D1 (de) | 2001-03-22 |
| JPH11265875A (ja) | 1999-09-28 |
| DE19756830A1 (de) | 1999-07-01 |
| EP0924487B1 (fr) | 2001-02-14 |
| US6170171B1 (en) | 2001-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0924487A3 (fr) | Séchage à vide de matériau semi-conducteur | |
| DE3666901D1 (en) | Composite semiconductor device and process for manufacturing the same | |
| SG54470A1 (en) | Semiconductor device and process for manufacturing the same | |
| DE3686091D1 (de) | Integrierte halbleiterschaltungen mit schaltungselementen zur untersuchung der integrierten schaltungen sowie mittel zum pruefen der schaltungselemente. | |
| GB9410762D0 (en) | Semiconductor device and method for manufacturing the same | |
| EP0417787A3 (en) | Multimold semiconductor device and the manufacturing method therefor | |
| KR900002405A (ko) | 평탄화된 헤테로구조물 및 그 제조 방법 | |
| DE69706910D1 (de) | Herstellungsverfahren einer T-förmigen Gate-Elektrode in einem Halbleiterbauelement, und die T-förmige Gate-Elektrode | |
| EP0350941A3 (en) | Stack-type piezoelectric element, process for producing the same, and stack-type piezoelectric device | |
| IT9020313A0 (it) | Albero forgiato a freddo, metodo e dispositivo per fabbricare lo stesso | |
| DE3587314D1 (de) | Vorrichtung zum entfernen von rohrteilen im bohrloch. | |
| DE3787562D1 (de) | Geraet zum nachweisen von fehlern im muster von masken. | |
| DE3586704D1 (de) | Terminalstuetzsystem zum veraendern des terminals von einer integrierten in eine verteilte konfiguration und umgekehrt. | |
| EP0253664A3 (en) | Semiconductor photo-sensor and method for manufacturing the same | |
| DE3585402D1 (de) | Dynamischer ram, und verfahren zur stabilisierung der stromstoesse in solch einer speicherschaltung. | |
| EP0257870A3 (en) | A semiconductor device, making and testing thereof | |
| DK399486D0 (da) | Fremgangsmaade til fremstilling af sten i en presse samt presse til fremstilling af naevnte sten | |
| DE59004853D1 (de) | Fixiervorrichtung zum Festlegen von Faszienhaltefäden mit Dichtkegel für die offene Laparoskopie. | |
| DE3787500D1 (de) | Isolierharz-Zusammensetzung und Halbleitervorrichtung unter deren Verwendung. | |
| DE69514343D1 (de) | Halbleitereinrichtung mit einer mikrokomponente, die eine starre und eine bewegliche elektrode aufweist | |
| EP0409256A3 (en) | Semiconductor ic device and method for manufacturing the same | |
| DE69015687D1 (de) | Heterostrukturbauelement und dessen Herstellungsverfahren. | |
| DE3851441D1 (de) | Verfahren und Vorrichtung zum automatischen Übereinstimmen von mindestens zwei kongruenten zylindrischen Flächen, insbesondere zum mechanischen Eingravieren. | |
| AU1595592A (en) | Test strip for immunoassay, assay method using the same and immunoassay device | |
| DE69003497D1 (de) | Andruckelement zum Aufspannen von Werkstücken. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| 17P | Request for examination filed |
Effective date: 19981217 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE IT |
|
| AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
| AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
| 17Q | First examination report despatched |
Effective date: 19990714 |
|
| AKX | Designation fees paid |
Free format text: DE IT |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAG | Despatch of communication of intention to grant |
Free format text: ORIGINAL CODE: EPIDOS AGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE IT |
|
| ITF | It: translation for a ep patent filed | ||
| REF | Corresponds to: |
Ref document number: 59800476 Country of ref document: DE Date of ref document: 20010322 |
|
| EN | Fr: translation not filed | ||
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed | ||
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20020702 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20051217 |