EP1000768A2 - Fabrication d'un support pour plaque lithographique - Google Patents
Fabrication d'un support pour plaque lithographique Download PDFInfo
- Publication number
- EP1000768A2 EP1000768A2 EP99203681A EP99203681A EP1000768A2 EP 1000768 A2 EP1000768 A2 EP 1000768A2 EP 99203681 A EP99203681 A EP 99203681A EP 99203681 A EP99203681 A EP 99203681A EP 1000768 A2 EP1000768 A2 EP 1000768A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- treatment
- aluminium
- acid
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 46
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 239000007864 aqueous solution Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 13
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002243 precursor Substances 0.000 claims abstract description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 10
- 238000011282 treatment Methods 0.000 claims description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 34
- 239000004411 aluminium Substances 0.000 claims description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- -1 aluminium ions Chemical class 0.000 claims description 6
- 238000005238 degreasing Methods 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 150000007522 mineralic acids Chemical class 0.000 claims description 3
- 239000001117 sulphuric acid Substances 0.000 claims description 3
- 235000011149 sulphuric acid Nutrition 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005299 abrasion Methods 0.000 abstract description 5
- 238000010186 staining Methods 0.000 abstract description 5
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000007743 anodising Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical compound [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Substances OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 2
- 235000011167 hydrochloric acid Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- PXRKCOCTEMYUEG-UHFFFAOYSA-N 5-aminoisoindole-1,3-dione Chemical compound NC1=CC=C2C(=O)NC(=O)C2=C1 PXRKCOCTEMYUEG-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 125000000218 acetic acid group Chemical class C(C)(=O)* 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 159000000013 aluminium salts Chemical class 0.000 description 1
- 229910000329 aluminium sulfate Inorganic materials 0.000 description 1
- 239000011260 aqueous acid Substances 0.000 description 1
- 150000001540 azides Chemical class 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/038—Treatment with a chromium compound, a silicon compound, a phophorus compound or a compound of a metal of group IVB; Hydrophilic coatings obtained by hydrolysis of organometallic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/036—Chemical or electrical pretreatment characterised by the presence of a polymeric hydrophilic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/20—Electrolytic after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/03—Chemical or electrical pretreatment
- B41N3/034—Chemical or electrical pretreatment characterised by the electrochemical treatment of the aluminum support, e.g. anodisation, electro-graining; Sealing of the anodised layer; Treatment of the anodic layer with inorganic compounds; Colouring of the anodic layer
Definitions
- This invention relates to a method for the production of a metallic support for use as a substrate for a lithographic printing plate. More specifically, the invention provides a method for the surface treatment of a metallic sheet, most particularly an aluminium sheet, whereby a substrate having particularly favourable lithographic properties may be obtained.
- aluminium substrates intended for use as support materials for lithographic printing plates and their precursors have generally been subjected to surface treatments prior to application of a light sensitive coating material. These treatments serve to improve the lithographic properties of the aluminium, in particular, its hydrophilicity. This is important during printing operations, since the basis of lithography is the ability of the lithographic plate to accept ink in image areas whilst rejecting ink and accepting water in background (non-image) areas, so that the printed image remains free from dirt and other contamination in said background areas.
- the light-sensitive coating of a lithographic printing plate precursor is imagewise exposed to radiation in order to change the solubility characteristics of the coating in the radiation-struck areas. The soluble areas are subsequently dissolved away by treatment with a developing solution, to expose the aluminium surface which must be capable of rejecting ink and accepting water.
- a typical surface treatment comprises an initial graining treatment, wherein the aluminium surface is roughened by either mechanical or electrochemical means, and a subsequent anodising treatment, by means of which a layer of aluminium oxide is formed on the surface of the aluminium.
- Anodising treatments may, for example, be carried out by passing a grained aluminium web through a bath of a suitable anodising acid, such as sulphuric or phosphoric acid, or a mixture thereof, whilst an electric current flows through the anodising bath and the web serves as the anode.
- post-anodic dip - is generally applied in order to improve specific lithographic printing properties of the substrate, such as clean up of background areas, coating adhesion or corrosion resistance, and will typically involve passing the aluminium through a solution, often an aqueous solution, of the chosen reagent.
- aqueous solutions containing, for example, sodium carbonate or bicarbonate, poly(acrylic acid) or various aqueous-soluble copolymers.
- Said metallic substrate may comprise any conducting metallic substrate but, most preferably, it comprises aluminium or an aluminium alloy containing small amounts of, for example, manganese, nickel, cobalt, zinc, iron, silicon or zirconium.
- Said substrate is generally provided in the form of a continuous web or roll of metal or metal alloy.
- said substrate is subjected to a degreasing treatment prior to said graining treatment.
- Said degreasing treatment is most conveniently carried out by means of an aqueous alkaline solution.
- said treatment involves passing said substrate through a bath containing a 5-20% w/v solution of, for example, sodium or potassium hydroxide.
- said substrate is rinsed with water prior to further treatment.
- Said treatment of said grained and anodised surface or surfaces with an aqueous solution comprising a copolymer of acrylic acid and vinylphosphonic acid is preferably carried out by immersing said substrate in an aqueous solution, preferably containing from 0.001% to 5.0% (w/w) (more preferably from 0.01% to 1.0%) of said copolymer at a preferred temperature of from 5° to 80°C (more preferably from 15° to 40°C) for a preferred dwell time of from 1 second to 60 minutes (more preferably from 15 seconds to 5 minutes) at a pH of between 0 and 13 (preferably from 1 to 5, and most preferably in the region of 3).
- Said aqueous solution also preferably contains aluminium ions in an amount of from 0.1 to 50,000 ppm; said aluminium ions may be added to said aqueous solution in the form of any convenient aluminium salt or, in the case of an aluminium substrate, may be present as a result of dissolution from said substrate.
- Said copolymer of acrylic acid and vinylphosphonic acid may be prepared by any of the standard polymerisation techniques known in the art, for example solution polymerisation, suspension polymerisation or emulsion polymerisation.
- Copolymers which are suitable for use in the method of the present invention typically have a weight average molecular weight in the range of from 10000 to 100000, preferably from 30000 to 70000, and most preferably in the region of 50000; the ratio of acrylic acid units to vinylphosphonic acid units in the copolymers typically lies in the range of from 0.5:1 to 1.5:1, preferably from 0.85:1 to 1.30:1.
- the application of the constant voltage or constant current is preferably realised by applying a constant d.c., pulsed d.c., a.c. (sine and square waveforms), biased a.c. or half wave 1-6 phases rectified a.c. voltage of from 0.1 to 1000 V (preferably from 1v to 100 V) across the treatment bath, using the substrate as one electrode and another electrical conductor, such as platinum, aluminium, carbon, stainless steel or mild steel as the other electrode.
- the aluminium substrate may form the cathode and the other electrical conductor may provide the anode; preferably, however, the aluminium substrate forms the anode, with the other electrical conductor providing the cathode.
- a surface film develops on said substrate, said film having a thickness of from 1 to 500 nm.
- said surface film may be produced with a textured surface finish.
- the graining treatment carried out in accordance with the method of the present invention may involve mechanical graining, wherein the surface of the substrate is subjected to mechanical forces which may, for example, be achieved by the use of a slurry of very small metal balls or via brush graining techniques.
- electrochemical graining may be employed; said technique comprises passing a substrate through a solution of a mineral or organic acid, or a mixture thereof, such as a mixture of hydrochloric and acetic acids, whilst applying an electric current to the acid solution.
- Typical graining conditions would involve the use of a bath of aqueous hydrochloric acid at a concentration of from 1-10 g/l and a temperature of 5-50°C, with a dwell time of from 1-60 seconds and an applied potential of from 1-40 V. The grained substrate is then rinsed with water prior to further processing.
- said grained substrate is preferably subjected to a desmutting treatment in order to remove by-products formed during the course of said electrograining treatment, and deposited on the surface of the substrate.
- a desmutting treatment in order to remove by-products formed during the course of said electrograining treatment, and deposited on the surface of the substrate.
- the process involves treatment of the grained substrate with an aqueous acid or alkali according to the methods well known in the art.
- the substrate is rinsed with water following desmutting.
- the grained and optionally desmutted substrate is then subjected to an anodising treatment in order to provide an anodic film of aluminium oxide on the grained surface or surfaces of the substrate.
- Anodising methods are well known in the art and typically involve passing the substrate through a bath containing an aqueous mineral acid, such as sulphuric, phosphoric, nitric, hydrofluoric or chromic acid, or an aqueous solution of an organic acid, for example oxalic, tartaric, citric, acetic or oleic acid, or a mixture of these acids, whilst applying an electric current to the anodising bath.
- an aqueous mineral acid such as sulphuric, phosphoric, nitric, hydrofluoric or chromic acid
- an organic acid for example oxalic, tartaric, citric, acetic or oleic acid, or a mixture of these acids
- Typical anodising conditions would involve the use of a bath of sulphuric acid at a concentration of from 10 to 300 g/l, preferably in the region of 120 g/l, and a temperature in the range of from 20o-60o, preferably in the region of 40oC, with a dwell time of from 5 to 120 seconds, preferably around 40 seconds, an applied potential of from 10-25 V, preferably about 20 V, and a current density of from 1000-2000 A/m 2 , preferably in the region of 1400 A/m 2 .
- the grained and anodised substrate is then rinsed with water prior to further processing.
- the support provided by the method of the present invention may subsequently be coated with a light-sensitive coating to give a lithographic printing plate precursor.
- coatings of the types well known to those skilled in the art may be applied for this purpose, for example, positive-working coatings incorporating quinone diazide derivatives, negative-working coatings incorporating diazo or azide resins or photocrosslinkable resins or silver halide based coatings.
- the coatings may be applied by any of the standard coating techniques known to the skilled person, such as curtain coating, dip coating, meniscus coating, reverse roll coating, and the like.
- the thus-obtained lithographic printing plate precursor may then be imagewise exposed and the non-image areas can be developed away to provide a lithographic printing plate which is subsequently used on a printing press to produce copies.
- Lithographic printing plates produced from aluminium supports obtained by the method of the present invention show excellent abrasion resistance, corrosion resistance, staining resistance and scumming resistance, both on plate development and on press.
- the surface film produced by the treatment according to the method of the present invention shows excellent coating adhesion in the image areas. Additionally, the plate exhibits very good exposure latitude and solvent resistance, and its overall properties are significantly improved when compared with a grained and anodised substrate which has been subjected to a prior art post-anodic dip treatment.
- a conventionally degreased, grained, desmutted and anodised aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of a copolymer of acrylic acid and vinylphosphonic acid (1:1) (M w 50000) (10 g/l) at room temperature.
- a constant d.c. voltage of 60 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was rinsed with water and coated with a solution of a naphthoquinone diazide photosensitive resin and a cresol novolak support resin in 2-methoxypropanol to produce a light-sensitive coating layer, and the coated substrate was baked at 130oC for 5 minutes.
- the resulting lithographic printing plate precursor was imagewise exposed to UV light at 100-300 mJ/cm 2 and the non-image areas were developed away with an aqueous alkaline developer solution by immersion for 30 seconds at 20oC.
- the resulting lithographic printing plate was rinsed with water and dried in a stream of cool air and subsequently produced 250,000 excellent quality copies on a Drent Web Offset press. The plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- a conventionally degreased, grained, desmutted and anodised aluminium substrate was immersed for 10 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of a copolymer of acrylic acid and vinylphosphonic acid (1:1) (M w 50000) (10 g/l) at room temperature.
- An a.c. voltage of 10 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press.
- the plate showed excellent resistance to abrasion, corrosion and staining/scumming, both during development and on press.
- a conventionally degreased, grained and desmutted aluminium substrate was immersed for 120 seconds in a bath fitted with a carbon electrode, and containing an aqueous solution of a copolymer of acrylic acid and vinylphosphonic acid (0.9:1) (M w 55000) (5 g/l) at room temperature.
- a rectified a.c. voltage of 20 V was applied across the carbon electrode and the aluminium electrode which was formed by the aluminium substrate, the carbon electrode serving as the cathode and the aluminium electrode as the anode.
- the resulting substrate was coated, baked, exposed and developed in exactly the same manner as described for Example 1 to provide a lithographic printing plate which produced 250,000 excellent quality copies on a Drent Web Offset press.
- the plate showed excellent resistance to abrasion, corrosion, and staining/scumming, both during development and on press.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB9825822.1A GB9825822D0 (en) | 1998-11-16 | 1998-11-16 | Production of lithographic printing plate support |
| GB9825822 | 1998-11-16 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP1000768A2 true EP1000768A2 (fr) | 2000-05-17 |
| EP1000768A3 EP1000768A3 (fr) | 2001-02-21 |
| EP1000768B1 EP1000768B1 (fr) | 2004-03-03 |
Family
ID=10843020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP19990203681 Expired - Lifetime EP1000768B1 (fr) | 1998-11-16 | 1999-11-03 | Fabrication d'un support pour plaque lithographique |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1000768B1 (fr) |
| JP (1) | JP2000141938A (fr) |
| DE (1) | DE69915211T2 (fr) |
| GB (1) | GB9825822D0 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1642746A1 (fr) * | 2004-10-01 | 2006-04-05 | Agfa-Gevaert | Procédé pour la fabrication d'une plaque d'impression lithographique de type négatif |
| US7416831B2 (en) | 2004-08-20 | 2008-08-26 | Eastman Kodak Company | Substrate for lithographic printing plate precursor |
| WO2012145162A1 (fr) | 2011-04-19 | 2012-10-26 | Eastman Kodak Company | Substrats en aluminium et précurseurs de plaque d'impression lithographique |
| US9074162B1 (en) | 2014-02-07 | 2015-07-07 | Ecolab Usa Inc. | Detergent compositions comprising vinylidene diphosphonic acid polymers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2301760B1 (fr) | 2009-09-28 | 2013-08-14 | Fujifilm Corporation | Procédé de fabrication d'un substrat en aluminium pour plaque d'impression planographique et procédé pour le recyclage de la plaque d'impression planographique |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL267931A (fr) * | 1960-08-05 | 1900-01-01 | ||
| DE3406101A1 (de) * | 1984-02-21 | 1985-08-22 | Hoechst Ag, 6230 Frankfurt | Verfahren zur zweistufigen hydrophilierenden nachbehandlung von aluminiumoxidschichten mit waessrigen loesungen und deren verwendung bei der herstellung von offsetdruckplattentraegern |
| DE4023267A1 (de) * | 1990-07-21 | 1992-01-23 | Hoechst Ag | Platten-, folien- oder bandfoermiges traegermaterial fuer offsetdruckplatten, verfahren zu seiner herstellung und seine verwendung |
| US5262244A (en) * | 1990-07-21 | 1993-11-16 | Hoechst Aktiengesellschaft | Hydrophilic copolymers and their use in reprography |
-
1998
- 1998-11-16 GB GBGB9825822.1A patent/GB9825822D0/en not_active Ceased
-
1999
- 1999-11-03 DE DE1999615211 patent/DE69915211T2/de not_active Expired - Lifetime
- 1999-11-03 EP EP19990203681 patent/EP1000768B1/fr not_active Expired - Lifetime
- 1999-11-11 JP JP32119499A patent/JP2000141938A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416831B2 (en) | 2004-08-20 | 2008-08-26 | Eastman Kodak Company | Substrate for lithographic printing plate precursor |
| EP1642746A1 (fr) * | 2004-10-01 | 2006-04-05 | Agfa-Gevaert | Procédé pour la fabrication d'une plaque d'impression lithographique de type négatif |
| WO2012145162A1 (fr) | 2011-04-19 | 2012-10-26 | Eastman Kodak Company | Substrats en aluminium et précurseurs de plaque d'impression lithographique |
| US8632940B2 (en) | 2011-04-19 | 2014-01-21 | Eastman Kodak Company | Aluminum substrates and lithographic printing plate precursors |
| US9120299B2 (en) | 2011-04-19 | 2015-09-01 | Eastman Kodak Company | Aluminum substrates and lithographic printing plate precursors |
| US9074162B1 (en) | 2014-02-07 | 2015-07-07 | Ecolab Usa Inc. | Detergent compositions comprising vinylidene diphosphonic acid polymers |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69915211D1 (de) | 2004-04-08 |
| EP1000768B1 (fr) | 2004-03-03 |
| EP1000768A3 (fr) | 2001-02-21 |
| DE69915211T2 (de) | 2005-01-13 |
| GB9825822D0 (en) | 1999-01-20 |
| JP2000141938A (ja) | 2000-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4561944A (en) | Method for producing supports for lithographic printing plates | |
| US4566952A (en) | Two-stage process for the production of anodically oxidized aluminum planar materials and use of these materials in manufacturing offset-printing plates | |
| CA1239612A (fr) | Axydation anodique et traitement d'aluminium non poli au silicate | |
| US4272342A (en) | Electrolytic graining method | |
| US4445998A (en) | Method for producing a steel lithographic plate | |
| US4824757A (en) | Process for preparing positive-acting photosensitive lithographic aluminum printing plate precursor using nitric acid electrokyte for graining | |
| US4482434A (en) | Process for electrochemically roughening aluminum for printing plate supports | |
| JPS5959897A (ja) | シ−ト、箔又はストリツプの形の材料の製造法及びオフセツト印刷板用支持体 | |
| EP1002644B1 (fr) | Production d'un support pour plaque d'impression lithographique | |
| CA1325402C (fr) | Support double couche d'aluminium anodise, methode de preparation dudit support et plaque offset comprenant ledit support | |
| US4388156A (en) | Aluminum electrolysis in non-aqueous monomeric organic acid | |
| JPS60159093A (ja) | アルミニウム又はアルミニウム合金を電気化学的に粗面化する方法 | |
| EP1000768B1 (fr) | Fabrication d'un support pour plaque lithographique | |
| CA1189378A (fr) | Sensibilisation electrochimique de couches enregistreuses | |
| EP0097503A2 (fr) | Procédé pour produire une plaque d'impression lithographique | |
| JPH0472719B2 (fr) | ||
| JPH0667674B2 (ja) | 印刷版支持体で使用するためのアルミニウムの電気化学的粗面化法 | |
| US4840709A (en) | Single-stage electrochemical image-forming process for reproduction layers | |
| GB2343680A (en) | Lithographic printing plate support | |
| CA1225613A (fr) | Cliches en aluminium anodise traite avec un compose de silicate et de carboxylate | |
| US4585529A (en) | Method for producing a metal lithographic plate | |
| JPH11208138A (ja) | 平版印刷版用支持体の作製方法、平版印刷版用支持体、及び感光性平版印刷版 | |
| JPS6362795A (ja) | 平版印刷版用支持体の製造方法 | |
| US4381226A (en) | Electrochemical treatment of aluminum in non-aqueous polymeric polybasic organic acid containing electrolytes | |
| US5264110A (en) | Electrolytic square wave graining |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB IT NL |
|
| AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
| PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
| AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
|
| AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
| 17P | Request for examination filed |
Effective date: 20010821 |
|
| AKX | Designation fees paid |
Free format text: DE FR GB IT NL |
|
| RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: AGFA-GEVAERT |
|
| GRAH | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOS IGRA |
|
| GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): DE FR GB IT NL |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20040303 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 20040303 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
| REF | Corresponds to: |
Ref document number: 69915211 Country of ref document: DE Date of ref document: 20040408 Kind code of ref document: P |
|
| NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
| ET | Fr: translation filed | ||
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed |
Effective date: 20041206 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: 732E |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: TP |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 20101019 Year of fee payment: 12 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20101007 Year of fee payment: 12 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20101012 Year of fee payment: 12 |
|
| GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20111103 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST Effective date: 20120731 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 69915211 Country of ref document: DE Effective date: 20120601 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111103 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111130 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20120601 |