EP1143031A2 - Plasmaborierung - Google Patents
Plasmaborierung Download PDFInfo
- Publication number
- EP1143031A2 EP1143031A2 EP01110904A EP01110904A EP1143031A2 EP 1143031 A2 EP1143031 A2 EP 1143031A2 EP 01110904 A EP01110904 A EP 01110904A EP 01110904 A EP01110904 A EP 01110904A EP 1143031 A2 EP1143031 A2 EP 1143031A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- gas
- reactor
- plasma
- treatment
- boron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005271 boronizing Methods 0.000 title 1
- 238000011282 treatment Methods 0.000 claims abstract description 32
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052796 boron Inorganic materials 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000007789 gas Substances 0.000 claims description 43
- 239000000203 mixture Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 2
- 229910052756 noble gas Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
- C23C8/38—Treatment of ferrous surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
Definitions
- the present invention relates to a device for producing a boride layer a surface by plasma working comprising a reactor, the one Boron-containing gas medium can be supplied and in which one Glow discharge is generated.
- the device according to the invention is thereby characterized in that it has a plasma generator which has a pulsed DC voltage with a variable pulse width and / or pulse pause.
- the device according to the invention preferably has at least one Mass flow meter on for measuring and / or adjusting the composition and / or the flow of one or more of the gases in the gas medium.
- One can, for example, by changing the gas composition influence the layer formation during the process, this in turn possibly depending on the results of the analysis of the determined Particle composition in plasma.
- a gas medium which contains two or three components, for example a boron trihalide, hydrogen and a rare gas.
- one is used for the device according to the invention gas-independent pressure meter to measure the treatment pressure.
- the pressure meter which is independent of the type of gas, is preferably controlled by a computer.
- the distribution of the gas in the treatment room of the reactor can e.g. B. via a Carry out a gas shower.
- the reactor has an additional heater.
- the present invention also relates to a method of the aforementioned Genre, that by means of a device with the features of one of the device claims 1 to 10 is carried out.
- FIG. 1 shows a diagram of the Plant structure of a plant as used in the production method according to the invention a boride layer on a surface can be used by plasma working.
- the attachment comprises a reactor 10 with a treatment room 11 in which the plasma is generated.
- the treatment room 11 of the reactor 10 is charged with a boron donor medium, that reaches the treatment room 11 via a gas inlet 12 and the feed line 13.
- a total of three feed lines are connected to the feed line 13, via which the individual components of the treatment gas are supplied.
- These components are on the one hand the boron trihalide, e.g. As boron trichloride or boron trifluoride, which over the Branch line 14 is fed, which opens into the feed line 13.
- the second Component is hydrogen gas, which is supplied via branch line 15, which is also opens into the feed line 13.
- the third component is an inert gas, e.g. B. Argon that is supplied via the branch line 16, which also opens into the supply line 13.
- mass flow meters 17, 18 and 19 by means of which the flow of the respective component of the treatment gas can be adjusted and is measurable.
- the reactor 10 further comprises a charging plate 20, which is located in the reactor chamber 11 and rests on two support insulators and the live support (not shown).
- the voltage supply for generating the glow discharge is carried out schematically shown voltage supply line 21.
- the plasma generator supplies a pulsed DC voltage with a variable pulse width or pulse pause as below is explained.
- the composition and the flow of the treatment gas are determined using the Mass flow meters 17, 18, 19 set.
- the measurement of the treatment pressure takes place via a gas meter-independent pressure meter and is also computer-controlled regulated.
- the pressure measurement and pressure control is carried out using the in the diagram with 22 designated device, which is connected via line 23 to the treatment room 11 is.
- a vacuum pump 24 is connected downstream of this pressure control 22 to this line 23 connected.
- This vacuum pump 24 is located in this Exhaust pipe a device 25 for exhaust gas purification, which is sufficient Exhaust gas treatment ensures.
- the temperature of the plasma generator is regulated via the Temperature control device 26 and the line 27.
- the system according to the invention also has an additional heater 28 which in Reactor 10 is housed to achieve the desired treatment temperature in the Treatment room 11.
- the method according to the invention for producing a boride layer preferably works in the low pressure range, e.g. B. in the range of 1 to 10 hPa, and is by an electrical Activation of the gas atmosphere is supported.
- the components to be treated (borating) are connected cathodically against the container wall of the treatment room.
- the preferably made of boron trihalide, e.g. As boron trichloride or boron trifloride, hydrogen and Existing gas medium is placed in the treatment room 11 and experienced in addition to thermal, electrical activation by glow discharge.
- the Treatment temperature depends on the material to be borated Components and is for example above 700 ° C, preferably at 800 ° C or about that.
- a pulsed DC voltage is preferably applied in order to enable the surface to be activated by the noble gas ion bombardment before the treatment phase.
- active excited boron particles are generated during the treatment, which reach the surface of the component and form borides there primarily by diffusion.
- the reduction of the halogen present in the atmosphere, which is generated from the boron trihalide, is favored by the atomic hydrogen generated in the plasma, which is produced from the H 2 gas supplied.
- the diagram according to FIG. 2 shows an example of a possible voltage curve in FIG Dependence on the time for a pulsed direct current as it is for an inventive one
- the method is particularly advantageous.
- the voltage is z. B. in a medium range 650 volts, the voltage pulse being maintained, for example, 160 ⁇ s and the Pulse pause, for example, is 50 ⁇ s.
- the pulse pause is therefore about a factor of 3 shorter than the duration of the DC voltage pulse.
- the period is in Embodiment 210 microseconds and thus the frequency is 4.762 kHz.
- the duty cycle defined as the ratio of the length of the pulse duration to the pulse pause within one Pulses is 3.2 in the exemplary embodiment. It was found that Using a relatively high voltage requires a longer pulse pause.
- argon can also be used in the treatment gas at relatively low levels Tensions, e.g. B. achieve good results in the range above 500 volts.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Chemical Vapour Deposition (AREA)
- Electron Sources, Ion Sources (AREA)
- Primary Cells (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Plasma Technology (AREA)
Abstract
Description
- Fig. 1
- eine schematisch vereinfachte Darstellung einer erfindungsgemäßen Anlage zur Erzeugung einer Boridschicht auf einer Oberfläche durch Plasmaborieren
- Fig. 2
- ein Diagramm betreffend die zeitliche Änderung der Spannung bei dem gepulsten Gleichstrom der für ein erfindungsgemäßes Verfahren verwendet wird.
Claims (11)
- Vorrichtung zur Erzeugung einer Boridschicht auf einer Oberfläche durch Plasmaborieren umfassend einen Reaktor mit einem Behandlungsraum, in dem eine Glimmentladung erzeugt wird und eine Zuführeinrichtung, über die dem Reaktor ein ein Borspendermedium enthaltendes Gasmedium zugeführt wird, dadurch gekennzeichnet, dass die Vorrichtung einen Plasmagenerator aufweist, der eine gepulste Gleichspannung mit einer veränderbaren Pulsbreite und/oder Pulspause liefert.
- Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass wenigstens ein Massendurchflußmesser (17,18,19) vorgesehen ist für die Messung und/oder Einstellung der Zusammensetzung und/oder des Durchflusses wenigstens eines der Gase in dem Gasmedium.
- Vorrichtung nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass wenigstens zwei, vorzugsweise drei Massendurchflußmesser (17,18,19) vorhanden sind, jeweils für die Messung und/oder Einstellung des Durchflusses von Borspendermedium und/oder Wasserstoff und/oder Edelgas.
- Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass ein gasartunabhängiger (22) Druckmesser für die Messung des Behandlungsdrucks vorgesehen ist.
- Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der gasartunabhängige Druckmesser (22) für die Messung des Behandlungsdruckes rechnergesteuert geregelt wird.
- Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Verteilung des Gases im Behandlungsraum über eine Gasdusche erfolgt.
- Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass diese einen gekühlten Gaseinlaß, insbesondere für das eingeleitete Borspendermedium aufweist.
- Vorrichtung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass diese eine Gasreinigungseinrichtung (25) für die Abgasbehandlung aufweist.
- Vorrichtung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass die Gasreinigungsreinrichtung (25) einer an den Behandlungsraum angeschlossenen Vakuumpumpe (24) nachgeschaltet ist.
- Vorrichtung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass für den Reaktor (11) eine Zusatzheizung (28) zur Erzielung einer gewünschten Behandlungstemperatur vorgesehen ist.
- Verfahren nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass es mittels einer Vorrichtung mit den Merkmalen einer der Ansprüche 21 bis 30 durchgeführt wird.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19755595 | 1997-12-15 | ||
| DE19755595 | 1997-12-15 | ||
| EP98965249A EP1044289B1 (de) | 1997-12-15 | 1998-12-11 | Plasmaborierung |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98965249A Division EP1044289B1 (de) | 1997-12-15 | 1998-12-11 | Plasmaborierung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1143031A2 true EP1143031A2 (de) | 2001-10-10 |
| EP1143031A3 EP1143031A3 (de) | 2004-04-28 |
Family
ID=7851902
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP01110904A Ceased EP1143031A3 (de) | 1997-12-15 | 1998-12-11 | Plasmaborierung |
| EP98965249A Expired - Lifetime EP1044289B1 (de) | 1997-12-15 | 1998-12-11 | Plasmaborierung |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP98965249A Expired - Lifetime EP1044289B1 (de) | 1997-12-15 | 1998-12-11 | Plasmaborierung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6783794B1 (de) |
| EP (2) | EP1143031A3 (de) |
| JP (1) | JP4588213B2 (de) |
| KR (1) | KR100583262B1 (de) |
| CN (1) | CN1198953C (de) |
| AT (1) | ATE215132T1 (de) |
| DE (1) | DE59803574D1 (de) |
| WO (1) | WO1999031291A2 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE524493C2 (sv) * | 2002-02-25 | 2004-08-17 | Telia Ab | Uppskattningsenhet och metod för att bestämma positionen för en mobil station i ett mobilt kommunikationssystem |
| CA2623650A1 (en) * | 2005-09-22 | 2007-04-05 | Skaffco Engineering & Manufacturing, Inc. | Plasma boriding method |
| MX2008013386A (es) * | 2006-04-20 | 2009-01-26 | Skaff Corp Of America Inc | Partes mecanicas que tienen resistencia incrementada contra el desgaste. |
| US8012274B2 (en) * | 2007-03-22 | 2011-09-06 | Skaff Corporation Of America, Inc. | Mechanical parts having increased wear-resistance |
| US8338317B2 (en) * | 2011-04-06 | 2012-12-25 | Infineon Technologies Ag | Method for processing a semiconductor wafer or die, and particle deposition device |
| CN104233425B (zh) * | 2014-09-29 | 2017-01-25 | 河海大学常州校区 | 微弧渗硼催化溶液和微弧渗硼溶液以及微弧渗硼方法 |
| US10388524B2 (en) * | 2016-12-15 | 2019-08-20 | Tokyo Electron Limited | Film forming method, boron film, and film forming apparatus |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3677799A (en) * | 1970-11-10 | 1972-07-18 | Celanese Corp | Vapor phase boron deposition by pulse discharge |
| JPS5118944A (ja) * | 1974-08-07 | 1976-02-14 | Suwa Seikosha Kk | Kisohokaho |
| JPS56105627A (en) * | 1980-01-28 | 1981-08-22 | Fuji Photo Film Co Ltd | Manufacture of amorphous semiconductor |
| DE3322341A1 (de) | 1983-06-22 | 1985-01-03 | Siegfried Dr.-Ing. 5135 Selfkant Strämke | Verfahren und vorrichtung zur oberflaechenbehandlung von werkstuecken durch glimmentladung |
| DE3908200C1 (de) * | 1989-03-14 | 1989-09-07 | Degussa Ag, 6000 Frankfurt, De | |
| DE4003623A1 (de) | 1990-02-07 | 1991-08-08 | Kloeckner Ionon | Verfahren zur steuerung einer anlage zur plasmabehandlung von werkstuecken |
| US5286534A (en) * | 1991-12-23 | 1994-02-15 | Minnesota Mining And Manufacturing Company | Process for plasma deposition of a carbon rich coating |
| US5374456A (en) | 1992-12-23 | 1994-12-20 | Hughes Aircraft Company | Surface potential control in plasma processing of materials |
| US5354381A (en) * | 1993-05-07 | 1994-10-11 | Varian Associates, Inc. | Plasma immersion ion implantation (PI3) apparatus |
| FR2708624A1 (fr) * | 1993-07-30 | 1995-02-10 | Neuville Stephane | Procédé de dépôt d'un revêtement protecteur à base de pseudo carbone diamant amorphe ou de carbure de silicium modifié. |
| JPH07286254A (ja) * | 1994-04-21 | 1995-10-31 | Sumitomo Metal Ind Ltd | 耐二次加工脆性に優れた鋼板およびその製造方法 |
| JP3050361B2 (ja) * | 1994-07-19 | 2000-06-12 | 株式会社ライムズ | 金属部材のイオン窒化方法 |
| DE4427902C1 (de) * | 1994-08-06 | 1995-03-30 | Leybold Durferrit Gmbh | Verfahren zum Aufkohlen von Bauteilen aus kohlungsfähigen Werkstoffen mittels einer impulsförmig betriebenen Plasmaentladung |
| US5578725A (en) | 1995-01-30 | 1996-11-26 | Regents Of The University Of Minnesota | Delta opioid receptor antagonists |
| JPH0982495A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | プラズマ生成装置およびプラズマ生成方法 |
| US6306225B1 (en) * | 1996-01-25 | 2001-10-23 | Bor Tec Gmbh | Process for producing wear-resistant boride layers on metallic material surfaces |
| DE19602639A1 (de) * | 1996-01-25 | 1997-07-31 | Kempten Elektroschmelz Gmbh | Verfahren zur Herstellung von verschleißfesten Boridschichten auf metallischen Werkstoffoberflächen |
| DE19629877C1 (de) * | 1996-07-24 | 1997-03-27 | Schott Glaswerke | CVD-Verfahren und Vorrichtung zur Innenbeschichtung von Hohlkörpern |
| US5654043A (en) * | 1996-10-10 | 1997-08-05 | Eaton Corporation | Pulsed plate plasma implantation system and method |
| US6101971A (en) * | 1998-05-13 | 2000-08-15 | Axcelis Technologies, Inc. | Ion implantation control using charge collection, optical emission spectroscopy and mass analysis |
| US20040016402A1 (en) * | 2002-07-26 | 2004-01-29 | Walther Steven R. | Methods and apparatus for monitoring plasma parameters in plasma doping systems |
-
1998
- 1998-12-11 EP EP01110904A patent/EP1143031A3/de not_active Ceased
- 1998-12-11 JP JP2000539186A patent/JP4588213B2/ja not_active Expired - Fee Related
- 1998-12-11 DE DE59803574T patent/DE59803574D1/de not_active Expired - Lifetime
- 1998-12-11 AT AT98965249T patent/ATE215132T1/de not_active IP Right Cessation
- 1998-12-11 WO PCT/EP1998/008079 patent/WO1999031291A2/de not_active Ceased
- 1998-12-11 KR KR1020007006436A patent/KR100583262B1/ko not_active Expired - Fee Related
- 1998-12-11 EP EP98965249A patent/EP1044289B1/de not_active Expired - Lifetime
- 1998-12-11 CN CNB988121832A patent/CN1198953C/zh not_active Expired - Fee Related
-
2000
- 2000-06-15 US US09/594,905 patent/US6783794B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE59803574D1 (de) | 2002-05-02 |
| KR20010033075A (ko) | 2001-04-25 |
| WO1999031291A3 (de) | 1999-09-10 |
| US6783794B1 (en) | 2004-08-31 |
| CN1282383A (zh) | 2001-01-31 |
| EP1044289A2 (de) | 2000-10-18 |
| KR100583262B1 (ko) | 2006-05-25 |
| ATE215132T1 (de) | 2002-04-15 |
| JP2002508448A (ja) | 2002-03-19 |
| JP4588213B2 (ja) | 2010-11-24 |
| EP1143031A3 (de) | 2004-04-28 |
| EP1044289B1 (de) | 2002-03-27 |
| CN1198953C (zh) | 2005-04-27 |
| WO1999031291A2 (de) | 1999-06-24 |
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