EP1146148A3 - Cyanidfreies Pyrophosphorsäure-Bad zum elektrolytischen Abscheiden von Kupfer-Zinnlegierungsüberzügen - Google Patents

Cyanidfreies Pyrophosphorsäure-Bad zum elektrolytischen Abscheiden von Kupfer-Zinnlegierungsüberzügen Download PDF

Info

Publication number: EP1146148A3
Authority: EP; European Patent Office
Prior art keywords: bath; copper; pyrophosphoric acid; alloy plating; derivative
Prior art date: 2000-04-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP00305825A

Other languages

English (en)

French (fr)

Other versions

EP1146148B1 (de

EP1146148A2 (de

Inventor

Mitsuru c/o Nihon New Chrome Co. Ltd. Kaneko

Asao c/o Sakado Factory Hatta

Mitsuharu c/o Sakado Factory Kunii

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nihon New Chrome Co Ltd

Original Assignee

Nihon New Chrome Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-14

Filing date

2000-07-10

Publication date

2004-02-04

2000-07-10 Application filed by Nihon New Chrome Co Ltd filed Critical Nihon New Chrome Co Ltd

2001-10-17 Publication of EP1146148A2 publication Critical patent/EP1146148A2/de

2004-02-04 Publication of EP1146148A3 publication Critical patent/EP1146148A3/de

2011-08-24 Application granted granted Critical

2011-08-24 Publication of EP1146148B1 publication Critical patent/EP1146148B1/de

2020-07-10 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)

EP00305825A 2000-04-14 2000-07-10 Cyanidfreies Pyrophosphorsäure-Bad zum elektrolytischen Abscheiden von Kupfer-Zinnlegierungsüberzügen Expired - Lifetime EP1146148B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2000114282		2000-04-14
JP2000114282A JP3455712B2 (ja)	2000-04-14	2000-04-14	銅−スズ合金めっき用ピロリン酸浴

Publications (3)

Publication Number	Publication Date
EP1146148A2 EP1146148A2 (de)	2001-10-17
EP1146148A3 true EP1146148A3 (de)	2004-02-04
EP1146148B1 EP1146148B1 (de)	2011-08-24

Family

ID=18626109

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP00305825A Expired - Lifetime EP1146148B1 (de)	2000-04-14	2000-07-10	Cyanidfreies Pyrophosphorsäure-Bad zum elektrolytischen Abscheiden von Kupfer-Zinnlegierungsüberzügen

Country Status (4)

Country	Link
US (1)	US6416571B1 (de)
EP (1)	EP1146148B1 (de)
JP (1)	JP3455712B2 (de)
AT (1)	ATE521734T1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3455712B2 (ja) *	2000-04-14	2003-10-14	日本ニュークローム株式会社	銅−スズ合金めっき用ピロリン酸浴
US6773573B2 (en) *	2001-10-02	2004-08-10	Shipley Company, L.L.C.	Plating bath and method for depositing a metal layer on a substrate
AU2003244119A1 (en) *	2002-06-13	2003-12-31	Nihon New Chrome Co., Ltd.	Copper-tin-oxygen based alloy plating
US7867625B2 (en) *	2002-06-13	2011-01-11	Nihon New Chrome Co., Ltd.	Copper-tin-oxygen alloy plating
JP4249438B2 (ja) *	2002-07-05	2009-04-02	日本ニュークローム株式会社	銅―錫合金めっき用ピロリン酸浴
JP4535786B2 (ja) *	2004-06-18	2010-09-01	三井金属鉱業株式会社	含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト
US7296370B2 (en) *	2004-09-24	2007-11-20	Jarden Zinc Products, Inc.	Electroplated metals with silvery-white appearance and method of making
EP1791693B1 (de) *	2004-09-24	2012-06-27	Jarden Zinc Products, LLC	Galvanisierte metalle von silbrigweissem aussehen und herstellungsverfahren dafür
EP1819848A1 (de) *	2004-11-29	2007-08-22	Technic, Incorporated	Lösung zur galvanischen abscheidung von zinn mit nahezu neutralem ph-wert
JP4681936B2 (ja) *	2005-05-20	2011-05-11	福田金属箔粉工業株式会社	プラズマディスプレイ電磁波シールドフィルター用銅箔
DE502007002479D1 (de)	2007-02-14	2010-02-11	Umicore Galvanotechnik Gmbh	Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
CN101270492B (zh) *	2007-03-21	2010-12-29	来明工业(厦门)有限公司	锡铜合金镀层的电镀液及电镀方法
PL2103717T3 (pl)	2008-02-29	2010-07-30	Atotech Deutschland Gmbh	Kąpiel oparta na pirofosforanach do nakładania warstw stopów cyny
PL2116634T3 (pl) *	2008-05-08	2011-04-29	Umicore Galvanotechnik Gmbh	Zmodyfikowany elektrolit miedziowo-cynowy i sposób osadzania warstw brązu
DE502008002080D1 (de)	2008-06-02	2011-02-03	Autotech Deutschland Gmbh	Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
DE102008032398A1 (de) *	2008-07-10	2010-01-14	Umicore Galvanotechnik Gmbh	Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
CN101768768B (zh) *	2008-12-26	2012-01-25	比亚迪股份有限公司	一种铝合金无氰无镍电镀方法及其电镀产品
JP5569718B2 (ja) *	2009-08-21	2014-08-13	キザイ株式会社	シアンフリー光沢銅−スズ合金めっき浴
DE102009041250B4 (de)	2009-09-11	2011-09-01	Umicore Galvanotechnik Gmbh	Verfahren zur elektrolytischen Verkupferung von Zinkdruckguss mit verringerter Neigung zur Blasenbildung
DE102011008836B4 (de)	2010-08-17	2013-01-10	Umicore Galvanotechnik Gmbh	Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
JP5731802B2 (ja) *	2010-11-25	2015-06-10	ローム・アンド・ハース電子材料株式会社	金めっき液
JP5595301B2 (ja) *	2011-02-22	2014-09-24	Ｊｘ日鉱日石金属株式会社	銅電解液
CN102220610B (zh) *	2011-07-29	2012-12-05	福州大学	一种无氰型铜锡合金电镀液
DE102011121799B4 (de)	2011-12-21	2013-08-29	Umicore Galvanotechnik Gmbh	Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
DE102011121798B4 (de)	2011-12-21	2013-08-29	Umicore Galvanotechnik Gmbh	Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle
CN103668359B (zh) *	2012-09-06	2016-03-02	上海造币有限公司	一种多层无氰电镀铜-锡合金镀层的电镀液、电镀工艺及其硬币
CN103668402B (zh) *	2013-10-08	2016-06-08	常州大学	一种纳米复合高锡铜合金电镀材料的制备方法
CN104152955A (zh) *	2014-07-17	2014-11-19	广东致卓精密金属科技有限公司	碱性溶液电镀光亮白铜锡电镀液及工艺
KR101636361B1 (ko) *	2014-07-31	2016-07-06	주식회사 에이피씨티	과불소화알킬 계면활성제를 함유하는 솔더범프용 주석합금 전기도금액
JP6491989B2 (ja) *	2014-10-10	2019-03-27	日本ニュークローム株式会社	表面の虹色着色処理方法
CN104480501A (zh) *	2014-11-28	2015-04-01	广东致卓精密金属科技有限公司	一种用于滚镀的高锡铜锡合金电镀液和工艺
JP6631349B2 (ja)	2015-03-26	2020-01-15	三菱マテリアル株式会社	アンモニウム塩を用いためっき液
JP6531217B2 (ja) *	2015-04-28	2019-06-12	ロームアンドハースエレクトロニックマテリアルズエルエルシーＲｏｈｍａｎｄＨａａｓＥｌｅｃｔｒｏｎｉｃＭａｔｅｒｉａｌｓＬＬＣ	電気めっき浴の添加剤としてのモノアミン及びビス無水物の反応生成物とのジアミンの反応生成物
CN110357059A (zh) *	2019-08-01	2019-10-22	江苏海洋大学	一种水热制备焦磷酸锡自组装微米球的方法
CN110644021B (zh) *	2019-09-16	2021-07-06	铜陵市华创新材料有限公司	一种锂离子电池用4.5μm电解铜箔、制备方法及添加剂

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3940319A (en) *	1974-06-24	1976-02-24	Nasglo International Corporation	Electrodeposition of bright tin-nickel alloy
US4582576A (en) *	1985-03-26	1986-04-15	Mcgean-Rohco, Inc.	Plating bath and method for electroplating tin and/or lead
JPH10102278A (ja) *	1996-09-30	1998-04-21	Nippon New Chrome Kk	銅−スズ合金メッキ用ピロリン酸浴
EP1001054A2 (de) *	1998-11-05	2000-05-17	C. Uyemura & Co, Ltd	Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4046648A (en) *	1975-09-29	1977-09-06	E. I. Du Pont De Nemours And Company	Polyamine additives in alkaline zinc electroplating
US4076600A (en) *	1976-12-20	1978-02-28	R. O. Hull & Company, Inc.	Leveling agent for acid zinc electroplating baths and method
US4146441A (en) *	1977-10-06	1979-03-27	R. O. Hull & Company, Inc.	Additive compositions, baths, and methods for electrodepositing bright zinc deposits
JPS5672196A (en) *	1979-11-19	1981-06-16	Shimizu Shoji Kk	Bright plating bath for copper-tin alloy
JPS5818996B2 (ja) *	1980-02-21	1983-04-15	キザイ株式会社	緻密なめっき被膜を得るための中性錫電気めっき浴
JPS5782491A (en) *	1980-11-11	1982-05-22	Seiko Instr & Electronics Ltd	Copper-tin alloy plating bath
US4526968A (en) *	1981-08-24	1985-07-02	M&T Chemicals Inc.	Quaternary aminehydroxypropane sulfobetaines
JPS59215492A (ja) *	1983-05-19	1984-12-05	Nippon Kagaku Sangyo Kk	亜鉛合金の電気鍍金浴
JPS6029482A (ja) *	1983-07-28	1985-02-14	Nippon Kagaku Sangyo Kk	錫及び錫合金電気めつき液
DE3339541C2 (de) *	1983-11-02	1986-08-07	Degussa Ag, 6000 Frankfurt	Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JPS60181293A (ja) *	1984-02-27	1985-09-14	Nippon Hyomen Kagaku Kk	アルカリ性浴からの電気亜鉛−鉄合金めつき法
JPS6169997A (ja) *	1984-09-13	1986-04-10	Nippon Kagaku Sangyo Kk	金属塩水溶液
JP3336621B2 (ja) *	1991-12-17	2002-10-21	ユケン工業株式会社	めっき用組成液とめっき方法
DE4324995C2 (de) *	1993-07-26	1995-12-21	Demetron Gmbh	Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JPH0827590A (ja) *	1994-07-13	1996-01-30	Okuno Chem Ind Co Ltd	光沢銅−錫合金めっき浴
JPH1046385A (ja) *	1996-08-02	1998-02-17	Daiwa Kasei Kenkyusho:Kk	電気・電子回路部品
JPH10245694A (ja) *	1997-03-03	1998-09-14	Murata Mfg Co Ltd	錫又は錫合金電気メッキ浴、およびそれを用いた電気メッキ方法
JP4132247B2 (ja) *	1998-07-09	2008-08-13	株式会社大和化成研究所	電気・電子回路部品
JP4249292B2 (ja) *	1998-07-10	2009-04-02	株式会社大和化成研究所	錫及び錫合金メッキ浴
JP2000265294A (ja) *	1999-03-15	2000-09-26	Matsushita Electric Ind Co Ltd	錫及び錫合金めっき浴、めっき皮膜及び半導体装置用のリードフレーム
JP3455712B2 (ja) *	2000-04-14	2003-10-14	日本ニュークローム株式会社	銅−スズ合金めっき用ピロリン酸浴

2000
- 2000-04-14 JP JP2000114282A patent/JP3455712B2/ja not_active Expired - Lifetime
- 2000-06-29 US US09/606,269 patent/US6416571B1/en not_active Expired - Lifetime
- 2000-07-10 EP EP00305825A patent/EP1146148B1/de not_active Expired - Lifetime
- 2000-07-10 AT AT00305825T patent/ATE521734T1/de not_active IP Right Cessation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3940319A (en) *	1974-06-24	1976-02-24	Nasglo International Corporation	Electrodeposition of bright tin-nickel alloy
US4582576A (en) *	1985-03-26	1986-04-15	Mcgean-Rohco, Inc.	Plating bath and method for electroplating tin and/or lead
JPH10102278A (ja) *	1996-09-30	1998-04-21	Nippon New Chrome Kk	銅−スズ合金メッキ用ピロリン酸浴
EP1001054A2 (de) *	1998-11-05	2000-05-17	C. Uyemura & Co, Ltd	Zinn-Kupfer-Legierung Elektroplattierungsbad und Plattierungsverfahren mit diesem Bad

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *

Also Published As

Publication number	Publication date
US6416571B1 (en)	2002-07-09
ATE521734T1 (de)	2011-09-15
EP1146148B1 (de)	2011-08-24
JP3455712B2 (ja)	2003-10-14
EP1146148A2 (de)	2001-10-17
JP2001295092A (ja)	2001-10-26

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