EP1574800A3 - Sytème de refroidissement à circuit à pompage capillaire - Google Patents

Sytème de refroidissement à circuit à pompage capillaire Download PDF

Info

Publication number
EP1574800A3
EP1574800A3 EP05007905A EP05007905A EP1574800A3 EP 1574800 A3 EP1574800 A3 EP 1574800A3 EP 05007905 A EP05007905 A EP 05007905A EP 05007905 A EP05007905 A EP 05007905A EP 1574800 A3 EP1574800 A3 EP 1574800A3
Authority
EP
European Patent Office
Prior art keywords
liquid
cooling system
vapor
energy
wicking structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05007905A
Other languages
German (de)
English (en)
Other versions
EP1574800B1 (fr
EP1574800A2 (fr
Inventor
Jason Chesser
Barrett Faneuf
Stephen Montgomery
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP1574800A2 publication Critical patent/EP1574800A2/fr
Publication of EP1574800A3 publication Critical patent/EP1574800A3/fr
Application granted granted Critical
Publication of EP1574800B1 publication Critical patent/EP1574800B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Insulating Materials (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
  • External Artificial Organs (AREA)
  • Sampling And Sample Adjustment (AREA)
EP05007905A 2001-09-20 2002-08-29 Condenseur à profile mince Expired - Lifetime EP1574800B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/957,792 US6981543B2 (en) 2001-09-20 2001-09-20 Modular capillary pumped loop cooling system
US957792 2001-09-20
EP02757536A EP1427971B1 (fr) 2001-09-20 2002-08-29 Systeme de refroidissement modulaire a circuit a pompage capillaire

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP02757536.4 Division 2002-08-29
EP02757536A Division EP1427971B1 (fr) 2001-09-20 2002-08-29 Systeme de refroidissement modulaire a circuit a pompage capillaire

Publications (3)

Publication Number Publication Date
EP1574800A2 EP1574800A2 (fr) 2005-09-14
EP1574800A3 true EP1574800A3 (fr) 2006-05-10
EP1574800B1 EP1574800B1 (fr) 2009-06-03

Family

ID=25500141

Family Applications (3)

Application Number Title Priority Date Filing Date
EP05007905A Expired - Lifetime EP1574800B1 (fr) 2001-09-20 2002-08-29 Condenseur à profile mince
EP05007906A Ceased EP1559982A3 (fr) 2001-09-20 2002-08-29 Système de refroidissement modulaire à circuit à pompage capillaire
EP02757536A Expired - Lifetime EP1427971B1 (fr) 2001-09-20 2002-08-29 Systeme de refroidissement modulaire a circuit a pompage capillaire

Family Applications After (2)

Application Number Title Priority Date Filing Date
EP05007906A Ceased EP1559982A3 (fr) 2001-09-20 2002-08-29 Système de refroidissement modulaire à circuit à pompage capillaire
EP02757536A Expired - Lifetime EP1427971B1 (fr) 2001-09-20 2002-08-29 Systeme de refroidissement modulaire a circuit a pompage capillaire

Country Status (7)

Country Link
US (4) US6981543B2 (fr)
EP (3) EP1574800B1 (fr)
CN (2) CN100368757C (fr)
AT (2) ATE323266T1 (fr)
AU (1) AU2002323548A1 (fr)
DE (2) DE60210640T2 (fr)
WO (1) WO2003025475A2 (fr)

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* Cited by examiner, † Cited by third party
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US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6227286B1 (en) * 1997-02-24 2001-05-08 Fujitsu Limited Heat sink and information processor using heat sink
US6257323B1 (en) * 2000-06-12 2001-07-10 Ching-Sung Kuo Heat dissipating device

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WO2003025475A3 (fr) 2003-06-19
US20030051859A1 (en) 2003-03-20
US20040050533A1 (en) 2004-03-18
EP1559982A2 (fr) 2005-08-03
CN100568496C (zh) 2009-12-09
WO2003025475A2 (fr) 2003-03-27
EP1427971B1 (fr) 2006-04-12
CN101093818A (zh) 2007-12-26
EP1559982A3 (fr) 2006-04-26
ATE433089T1 (de) 2009-06-15
US7770630B2 (en) 2010-08-10
US6776221B2 (en) 2004-08-17
EP1427971A2 (fr) 2004-06-16
DE60232555D1 (de) 2009-07-16
AU2002323548A1 (en) 2003-04-01
CN1556911A (zh) 2004-12-22
ATE323266T1 (de) 2006-04-15
DE60210640T2 (de) 2007-04-05
US6981543B2 (en) 2006-01-03
DE60210640D1 (de) 2006-05-24
US20040040695A1 (en) 2004-03-04
EP1574800B1 (fr) 2009-06-03
EP1574800A2 (fr) 2005-09-14
US20030051860A1 (en) 2003-03-20
CN100368757C (zh) 2008-02-13

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