EP2716147A4 - Dispositif de transfert thermique à profil vertical réduit - Google Patents

Dispositif de transfert thermique à profil vertical réduit

Info

Publication number
EP2716147A4
EP2716147A4 EP11867056.1A EP11867056A EP2716147A4 EP 2716147 A4 EP2716147 A4 EP 2716147A4 EP 11867056 A EP11867056 A EP 11867056A EP 2716147 A4 EP2716147 A4 EP 2716147A4
Authority
EP
European Patent Office
Prior art keywords
transfer device
thermal transfer
vertical profile
reduced vertical
reduced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP11867056.1A
Other languages
German (de)
English (en)
Other versions
EP2716147A1 (fr
Inventor
Sukhvinder Singh Kang
John Ralph Cennamo
Bradley Robert Whitney
Randolph S Cook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Thermalloy LLC
Original Assignee
Aavid Thermalloy LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy LLC filed Critical Aavid Thermalloy LLC
Publication of EP2716147A1 publication Critical patent/EP2716147A1/fr
Publication of EP2716147A4 publication Critical patent/EP2716147A4/fr
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/04—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP11867056.1A 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit Ceased EP2716147A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/038299 WO2012166086A1 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Publications (2)

Publication Number Publication Date
EP2716147A1 EP2716147A1 (fr) 2014-04-09
EP2716147A4 true EP2716147A4 (fr) 2015-08-26

Family

ID=47259642

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11867056.1A Ceased EP2716147A4 (fr) 2011-05-27 2011-05-27 Dispositif de transfert thermique à profil vertical réduit

Country Status (5)

Country Link
US (1) US20140345829A1 (fr)
EP (1) EP2716147A4 (fr)
JP (1) JP6078054B2 (fr)
CN (1) CN103733746B (fr)
WO (1) WO2012166086A1 (fr)

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WO2013140761A1 (fr) * 2012-03-22 2013-09-26 日本電気株式会社 Structure de refroidissement pour substrat électronique et dispositif électronique l'utilisant
JP6179145B2 (ja) * 2013-03-18 2017-08-16 富士通株式会社 電子機器システム
JP5986064B2 (ja) 2013-12-25 2016-09-06 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
KR102424963B1 (ko) 2015-07-30 2022-07-25 삼성전자주식회사 집적회로 소자 및 그 제조 방법
JP6309928B2 (ja) * 2015-09-24 2018-04-11 Ｎｅｃプラットフォームズ株式会社 冷却システムおよび電子機器
US10349561B2 (en) * 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN106231871B (zh) * 2016-08-23 2018-04-20 山东时风（集团）有限责任公司 一种电动车辆控制器的散热装置
CN113784599B (zh) * 2016-08-24 2024-08-27 台达电子工业股份有限公司 散热组件
US11236948B2 (en) 2016-08-24 2022-02-01 Delta Electronics, Inc. Heat dissipation assembly
US12439561B2 (en) 2017-03-12 2025-10-07 Zuta-Core Ltd. Systems and methods for heat exchange
US11778783B2 (en) 2017-03-12 2023-10-03 Zuta-Core Ltd. Cooling systems and methods
CN114423232A (zh) * 2017-04-28 2022-04-29 株式会社村田制作所 均热板、散热设备以及电子设备
CN107339900A (zh) * 2017-08-22 2017-11-10 无锡马山永红换热器有限公司 新型板翅式冷却器
CN109714931B (zh) * 2017-10-26 2020-08-18 深圳富泰宏精密工业有限公司 应用散热结构的电子设备
US11754344B2 (en) * 2018-01-19 2023-09-12 Sumitomo Precision Products Co., Ltd. Boiling cooler
US10568238B1 (en) * 2018-08-10 2020-02-18 Facebook, Inc. Modular network switch
TWI690686B (zh) * 2018-10-31 2020-04-11 英業達股份有限公司 冷卻裝置
CN113163683B (zh) * 2021-04-02 2023-05-30 西安易朴通讯技术有限公司 液冷散热设备、机柜及系统
WO2024019912A1 (fr) * 2022-07-20 2024-01-25 KYOCERA AVX Components Corporation Terminaisons de composants de dissipateur thermique
CN117848122A (zh) * 2023-12-18 2024-04-09 浙江台信应用科技有限公司 塔型冷媒两相变化虹吸式散热器

Citations (5)

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JPS53139274U (fr) * 1977-04-08 1978-11-04
US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20040069459A1 (en) * 2002-07-05 2004-04-15 Sony Corporation Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device
WO2005100897A1 (fr) * 2004-04-13 2005-10-27 Sony Corporation Appareil de transport de chaleur, procédé de fabrication de l’appareil de transport de chaleur, et équipement électronique
US20070006992A1 (en) * 2005-07-08 2007-01-11 Tay-Jian Liu Loop-type heat exchange module

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JPS5150448Y2 (fr) * 1972-05-19 1976-12-04
JPS57204156A (en) * 1981-06-09 1982-12-14 Mitsubishi Electric Corp Ebullition type cooling device
JPH0351697A (ja) * 1989-07-19 1991-03-06 Showa Alum Corp ヒートパイプ
JP2743022B2 (ja) * 1989-09-29 1998-04-22 昭和アルミニウム株式会社 ヒートパイプ
JPH11130410A (ja) * 1997-10-31 1999-05-18 Koa Corporation:Kk オゾン発生器用冷却装置
JP2002048447A (ja) * 2000-08-07 2002-02-15 Hitachi Ltd 車両用冷却装置
JP2002246782A (ja) * 2001-02-15 2002-08-30 Calsonic Kansei Corp 沸騰冷却装置
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
JP3909520B2 (ja) * 2002-08-29 2007-04-25 三菱電機株式会社 冷却装置
JP3977378B2 (ja) * 2004-03-11 2007-09-19 古河電気工業株式会社 半導体素子冷却用モジュール
JP4391351B2 (ja) * 2004-07-29 2009-12-24 古河電気工業株式会社 冷却装置
CA2561769C (fr) * 2004-03-31 2009-12-22 Belits Computer Systems, Inc. Systeme de refroidissement peu encombrant a thermosiphon destine a des ordinateurs et a d'autres dispositifs electroniques
JP2006125718A (ja) * 2004-10-28 2006-05-18 Sony Corp 熱輸送装置及び電子機器
JP2007010211A (ja) * 2005-06-30 2007-01-18 Hitachi Ltd 電子機器の冷却装置
US7686071B2 (en) * 2005-07-30 2010-03-30 Articchoke Enterprises Llc Blade-thru condenser having reeds and heat dissipation system thereof
CN101283177A (zh) * 2005-07-30 2008-10-08 艾提丘克事业有限责任公司 叶片穿过式冷凝器及其散热系统
JP2007103748A (ja) * 2005-10-06 2007-04-19 Seiko Epson Corp 熱交換器、液冷システム、光源装置、プロジェクタ、電子デバイスユニット、電子機器
US7422052B2 (en) * 2006-04-20 2008-09-09 Delphi Technologies, Inc. Low profile thermosiphon
CN103298320A (zh) * 2007-12-19 2013-09-11 集群系统公司 用于接触冷却电子模块的冷却系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139274U (fr) * 1977-04-08 1978-11-04
US20030128508A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
US20040069459A1 (en) * 2002-07-05 2004-04-15 Sony Corporation Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device
WO2005100897A1 (fr) * 2004-04-13 2005-10-27 Sony Corporation Appareil de transport de chaleur, procédé de fabrication de l’appareil de transport de chaleur, et équipement électronique
US20070006992A1 (en) * 2005-07-08 2007-01-11 Tay-Jian Liu Loop-type heat exchange module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012166086A1 *

Also Published As

Publication number Publication date
JP2014517906A (ja) 2014-07-24
EP2716147A1 (fr) 2014-04-09
US20140345829A1 (en) 2014-11-27
CN103733746B (zh) 2017-05-03
WO2012166086A1 (fr) 2012-12-06
CN103733746A (zh) 2014-04-16
JP6078054B2 (ja) 2017-02-08

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Inventor name: WHITNEY, BRADLEY, ROBERT

Inventor name: COOL, RANDOLPH H.

Inventor name: CENNAMO, JOHN, RALPH

Inventor name: KANG, SUKHVINDER, SINGH

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Inventor name: WHITNEY, BRADLEY, ROBERT

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Inventor name: CENNAMO, JOHN, RALPH

Inventor name: WHITNEY, BRADLEY, ROBERT

Inventor name: KANG, SUKHVINDER, SINGH

Inventor name: COOK, RANDOLPH S.

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