EP2333128A4 - Matière d'alliage de cuivre pour un composant électrique/électronique - Google Patents

Matière d'alliage de cuivre pour un composant électrique/électronique

Info

Publication number
EP2333128A4
EP2333128A4 EP09804913A EP09804913A EP2333128A4 EP 2333128 A4 EP2333128 A4 EP 2333128A4 EP 09804913 A EP09804913 A EP 09804913A EP 09804913 A EP09804913 A EP 09804913A EP 2333128 A4 EP2333128 A4 EP 2333128A4
Authority
EP
European Patent Office
Prior art keywords
electrical
electronic component
copper alloy
alloy material
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09804913A
Other languages
German (de)
English (en)
Other versions
EP2333128A1 (fr
Inventor
Kuniteru Mihara
Ryosuke Matsuo
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2333128A1 publication Critical patent/EP2333128A1/fr
Publication of EP2333128A4 publication Critical patent/EP2333128A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09804913A 2008-08-05 2009-07-30 Matière d'alliage de cuivre pour un composant électrique/électronique Withdrawn EP2333128A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008202467 2008-08-05
PCT/JP2009/063615 WO2010016429A1 (fr) 2008-08-05 2009-07-30 Matière d'alliage de cuivre pour un composant électrique/électronique

Publications (2)

Publication Number Publication Date
EP2333128A1 EP2333128A1 (fr) 2011-06-15
EP2333128A4 true EP2333128A4 (fr) 2012-07-04

Family

ID=41663649

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09804913A Withdrawn EP2333128A4 (fr) 2008-08-05 2009-07-30 Matière d'alliage de cuivre pour un composant électrique/électronique

Country Status (6)

Country Link
US (1) US20110200479A1 (fr)
EP (1) EP2333128A4 (fr)
JP (1) JP4913902B2 (fr)
KR (1) KR101570556B1 (fr)
CN (1) CN102112640B (fr)
WO (1) WO2010016429A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60324711D1 (fr) 2003-03-03 2008-12-24 Mitsubishi Shindo Kk
WO2009081664A1 (fr) 2007-12-21 2009-07-02 Mitsubishi Shindoh Co., Ltd. Tube en alliage de cuivre hautement conducteur de chaleur et à haute résistance et son procédé de fabrication
EP2246448B1 (fr) 2008-02-26 2016-10-12 Mitsubishi Shindoh Co., Ltd. Fil de cuivre à haute résistance et haute conductivité
CA2706199C (fr) 2008-03-28 2014-06-10 Mitsubishi Shindoh Co., Ltd. Tuyau, barre, et fil machine en alliage de cuivre ayant une resistance mecanique elevee et une electroconductivite elevee
JP4851626B2 (ja) * 2009-01-09 2012-01-11 三菱伸銅株式会社 高強度高導電銅合金圧延板及びその製造方法
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
JP4620173B1 (ja) * 2010-03-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金材
JP4672804B1 (ja) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4601085B1 (ja) * 2010-06-03 2010-12-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP4834781B1 (ja) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5718021B2 (ja) * 2010-10-29 2015-05-13 Jx日鉱日石金属株式会社 電子部品用チタン銅
JP2012144789A (ja) * 2011-01-13 2012-08-02 Jx Nippon Mining & Metals Corp Ｃｕ−Ｃｏ−Ｓｉ−Ｚｒ合金材
JP5544316B2 (ja) * 2011-02-14 2014-07-09 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金、伸銅品、電子部品、及びコネクタ
JP5628712B2 (ja) * 2011-03-08 2014-11-19 Jx日鉱日石金属株式会社 電子部品用チタン銅
JP5514762B2 (ja) * 2011-03-29 2014-06-04 Ｊｘ日鉱日石金属株式会社 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
JP6621650B2 (ja) * 2015-11-17 2019-12-18 株式会社フジコー 熱延プロセス用ロールおよびその製造方法
JP6461249B2 (ja) * 2017-07-06 2019-01-30 三菱アルミニウム株式会社 アルミニウム合金箔およびアルミニウム合金箔の製造方法
CN108414559B (zh) * 2018-04-16 2020-12-29 中国航发北京航空材料研究院 一种测试多元合金中不同相组成微区成分的定量分析方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
JP2006161148A (ja) * 2004-02-27 2006-06-22 Furukawa Electric Co Ltd:The 銅合金
US20080056930A1 (en) * 2006-08-30 2008-03-06 Mitsubishi Electric Corporation Copper alloy and method of producing same
JP2008088512A (ja) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187838A (ja) 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
JPS63307232A (ja) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金
JPH02129326A (ja) 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd 高力銅合金
JPH02277735A (ja) 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
JP2006265731A (ja) 2005-02-28 2006-10-05 Furukawa Electric Co Ltd:The 銅合金
JP5202812B2 (ja) * 2005-03-02 2013-06-05 古河電気工業株式会社 銅合金とその製造方法
EP1873267B1 (fr) * 2005-03-24 2014-07-02 JX Nippon Mining & Metals Corporation Alliage de cuivre pour materiel electronique
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP4655834B2 (ja) * 2005-09-02 2011-03-23 日立電線株式会社 電気部品用銅合金材とその製造方法
JP4006467B1 (ja) 2006-09-22 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金
JP4006460B1 (ja) 2006-05-26 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法
JP4006468B1 (ja) 2006-09-22 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金
JP4876959B2 (ja) 2007-02-19 2012-02-15 株式会社Ｉｈｉ 過給機

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0920943A (ja) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The 電子電気部品用銅合金およびその製造方法
JP2006161148A (ja) * 2004-02-27 2006-06-22 Furukawa Electric Co Ltd:The 銅合金
US20080056930A1 (en) * 2006-08-30 2008-03-06 Mitsubishi Electric Corporation Copper alloy and method of producing same
JP2008088512A (ja) * 2006-10-03 2008-04-17 Nikko Kinzoku Kk 電子材料用銅合金の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010016429A1 *

Also Published As

Publication number Publication date
US20110200479A1 (en) 2011-08-18
CN102112640A (zh) 2011-06-29
KR101570556B1 (ko) 2015-11-19
EP2333128A1 (fr) 2011-06-15
CN102112640B (zh) 2013-03-27
WO2010016429A1 (fr) 2010-02-11
JP4913902B2 (ja) 2012-04-11
JPWO2010016429A1 (ja) 2012-01-19
KR20110039371A (ko) 2011-04-15

Similar Documents

Publication Publication Date Title
EP2333128A4 (fr) Matière d'alliage de cuivre pour un composant électrique/électronique
EP2333127A4 (fr) Matière d'alliage de cuivre pour un composant électrique/électronique
EP2319947A4 (fr) Materiau en alliage de cuivre pour composants electriques et electroniques et procede de fabrication associe
EP2169093A4 (fr) Matériel métallique pour composants électriques électroniques
EP2143810A4 (fr) Alliage de cuivre pour un dispositif électrique/électronique et son procédé de fabrication
EP2256219A4 (fr) Matériau d'alliage de cuivre
GB0612879D0 (en) Electrical circuit arrangement
EP2339038B8 (fr) Feuille d'alliage de cuivre pour pièce électrique et électronique
PL2279537T3 (pl) Metoda hermetyzacji układu elektronicznego
EP2270242A4 (fr) Matériau d'alliage de cuivre destiné à des appareils électriques et électroniques, et composants électriques et électroniques
EP2223754A4 (fr) Procédé de fabrication de produits d'alliage de cuivre et équipement associé
TWI351039B (en) High electrical conductive composite material
EP2221391A4 (fr) Matériau en feuille en alliage de cuivre
GB0814705D0 (en) Electrical connection circuit
GB0821784D0 (en) Cooling electronic circuits
PL2443642T3 (pl) Elektroniczny wyłącznik ochronny
GB0608944D0 (en) Encapsulating arrangement for an electrical component
EP2263316A4 (fr) Configuration de composant électronique
EP2374907A4 (fr) Matériau à base d'alliage de cuivre pour composants électriques ou électroniques et procédé de fabrication associé
EP2306795A4 (fr) Structure de circuit électrique
GB2448066B (en) Ram circuit
TWI367552B (en) Soldering process for electrical component and apparatus thereof
EP2301065A4 (fr) Procédé de fabrication d'ensemble électronique
GB0714969D0 (en) Electrical terminal
TWI347720B (en) Electronic device with current limit circuit

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110216

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
RIC1 Information provided on ipc code assigned before grant

Ipc: C22F 1/08 20060101ALI20120524BHEP

Ipc: C22C 9/06 20060101AFI20120524BHEP

Ipc: H01B 1/02 20060101ALI20120524BHEP

A4 Supplementary search report drawn up and despatched

Effective date: 20120604

17Q First examination report despatched

Effective date: 20130212

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20130703

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20130917