JP4913902B2 - 電気・電子部品用銅合金材料の製造方法 - Google Patents

電気・電子部品用銅合金材料の製造方法 Download PDF

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Publication number
JP4913902B2
JP4913902B2 JP2010507744A JP2010507744A JP4913902B2 JP 4913902 B2 JP4913902 B2 JP 4913902B2 JP 2010507744 A JP2010507744 A JP 2010507744A JP 2010507744 A JP2010507744 A JP 2010507744A JP 4913902 B2 JP4913902 B2 JP 4913902B2
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Japan
Prior art keywords
compound
copper alloy
heat treatment
mass
dispersion density
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Japanese (ja)
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JPWO2010016429A1 (ja
Inventor
邦照 三原
亮佑 松尾
立彦 江口
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to JP2010507744A priority Critical patent/JP4913902B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
JP2010507744A 2008-08-05 2009-07-30 電気・電子部品用銅合金材料の製造方法 Active JP4913902B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010507744A JP4913902B2 (ja) 2008-08-05 2009-07-30 電気・電子部品用銅合金材料の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008202467 2008-08-05
JP2008202467 2008-08-05
JP2010507744A JP4913902B2 (ja) 2008-08-05 2009-07-30 電気・電子部品用銅合金材料の製造方法
PCT/JP2009/063615 WO2010016429A1 (fr) 2008-08-05 2009-07-30 Matière d'alliage de cuivre pour un composant électrique/électronique

Publications (2)

Publication Number Publication Date
JPWO2010016429A1 JPWO2010016429A1 (ja) 2012-01-19
JP4913902B2 true JP4913902B2 (ja) 2012-04-11

Family

ID=41663649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010507744A Active JP4913902B2 (ja) 2008-08-05 2009-07-30 電気・電子部品用銅合金材料の製造方法

Country Status (6)

Country Link
US (1) US20110200479A1 (fr)
EP (1) EP2333128A4 (fr)
JP (1) JP4913902B2 (fr)
KR (1) KR101570556B1 (fr)
CN (1) CN102112640B (fr)
WO (1) WO2010016429A1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60324711D1 (fr) 2003-03-03 2008-12-24 Mitsubishi Shindo Kk
WO2009081664A1 (fr) 2007-12-21 2009-07-02 Mitsubishi Shindoh Co., Ltd. Tube en alliage de cuivre hautement conducteur de chaleur et à haute résistance et son procédé de fabrication
EP2246448B1 (fr) 2008-02-26 2016-10-12 Mitsubishi Shindoh Co., Ltd. Fil de cuivre à haute résistance et haute conductivité
CA2706199C (fr) 2008-03-28 2014-06-10 Mitsubishi Shindoh Co., Ltd. Tuyau, barre, et fil machine en alliage de cuivre ayant une resistance mecanique elevee et une electroconductivite elevee
JP4851626B2 (ja) * 2009-01-09 2012-01-11 三菱伸銅株式会社 高強度高導電銅合金圧延板及びその製造方法
US10311991B2 (en) 2009-01-09 2019-06-04 Mitsubishi Shindoh Co., Ltd. High-strength and high-electrical conductivity copper alloy rolled sheet and method of manufacturing the same
JP4620173B1 (ja) * 2010-03-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金材
JP4672804B1 (ja) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4601085B1 (ja) * 2010-06-03 2010-12-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金圧延板及びそれを用いた電気部品
JP4834781B1 (ja) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP5718021B2 (ja) * 2010-10-29 2015-05-13 Jx日鉱日石金属株式会社 電子部品用チタン銅
JP2012144789A (ja) * 2011-01-13 2012-08-02 Jx Nippon Mining & Metals Corp Ｃｕ−Ｃｏ−Ｓｉ−Ｚｒ合金材
JP5544316B2 (ja) * 2011-02-14 2014-07-09 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金、伸銅品、電子部品、及びコネクタ
JP5628712B2 (ja) * 2011-03-08 2014-11-19 Jx日鉱日石金属株式会社 電子部品用チタン銅
JP5514762B2 (ja) * 2011-03-29 2014-06-04 Ｊｘ日鉱日石金属株式会社 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
JP6621650B2 (ja) * 2015-11-17 2019-12-18 株式会社フジコー 熱延プロセス用ロールおよびその製造方法
JP6461249B2 (ja) * 2017-07-06 2019-01-30 三菱アルミニウム株式会社 アルミニウム合金箔およびアルミニウム合金箔の製造方法
CN108414559B (zh) * 2018-04-16 2020-12-29 中国航发北京航空材料研究院 一种测试多元合金中不同相组成微区成分的定量分析方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187838A (ja) 1984-10-03 1986-05-06 Kobe Steel Ltd 熱間加工性の優れた銅合金
JPS63307232A (ja) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd 銅合金
JPH02129326A (ja) 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd 高力銅合金
JPH02277735A (ja) 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd リードフレーム用銅合金
JP3408021B2 (ja) * 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
JP3754011B2 (ja) * 2002-09-04 2006-03-08 デプト株式会社 電子部品用金属材料、電子部品、電子機器、金属材料の加工方法、電子部品の製造方法及び電子光学部品
JP3977376B2 (ja) * 2004-02-27 2007-09-19 古河電気工業株式会社 銅合金
JP2006265731A (ja) 2005-02-28 2006-10-05 Furukawa Electric Co Ltd:The 銅合金
JP5202812B2 (ja) * 2005-03-02 2013-06-05 古河電気工業株式会社 銅合金とその製造方法
EP1873267B1 (fr) * 2005-03-24 2014-07-02 JX Nippon Mining & Metals Corporation Alliage de cuivre pour materiel electronique
JP4068626B2 (ja) * 2005-03-31 2008-03-26 日鉱金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP4655834B2 (ja) * 2005-09-02 2011-03-23 日立電線株式会社 電気部品用銅合金材とその製造方法
JP4006467B1 (ja) 2006-09-22 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金
JP4006460B1 (ja) 2006-05-26 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法
JP4006468B1 (ja) 2006-09-22 2007-11-14 株式会社神戸製鋼所 高強度、高導電率および曲げ加工性に優れた銅合金
JP4943095B2 (ja) * 2006-08-30 2012-05-30 三菱電機株式会社 銅合金及びその製造方法
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
JP4876959B2 (ja) 2007-02-19 2012-02-15 株式会社Ｉｈｉ 過給機

Also Published As

Publication number Publication date
US20110200479A1 (en) 2011-08-18
CN102112640A (zh) 2011-06-29
KR101570556B1 (ko) 2015-11-19
EP2333128A1 (fr) 2011-06-15
EP2333128A4 (fr) 2012-07-04
CN102112640B (zh) 2013-03-27
WO2010016429A1 (fr) 2010-02-11
JPWO2010016429A1 (ja) 2012-01-19
KR20110039371A (ko) 2011-04-15

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