EP2409096B2 - Kryogenfreie kühlvorrichtung und verfahren - Google Patents

Kryogenfreie kühlvorrichtung und verfahren Download PDF

Info

Publication number
EP2409096B2
EP2409096B2 EP10710389.7A EP10710389A EP2409096B2 EP 2409096 B2 EP2409096 B2 EP 2409096B2 EP 10710389 A EP10710389 A EP 10710389A EP 2409096 B2 EP2409096 B2 EP 2409096B2
Authority
EP
European Patent Office
Prior art keywords
holding device
sample holding
radiation shield
sample
cold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10710389.7A
Other languages
English (en)
French (fr)
Other versions
EP2409096B1 (de
EP2409096A2 (de
Inventor
John Garside
Simon Kingley
Gavin Crowther
Matthias Buehler
Doreen Wernicke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxford Instruments Nanotechnology Tools Ltd
Original Assignee
Oxford Instruments Nanotechnology Tools Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40637422&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2409096(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Oxford Instruments Nanotechnology Tools Ltd filed Critical Oxford Instruments Nanotechnology Tools Ltd
Priority to EP22154522.1A priority Critical patent/EP4027081B1/de
Priority to EP19187223.3A priority patent/EP3620732B2/de
Priority to EP22205298.7A priority patent/EP4148353B1/de
Publication of EP2409096A2 publication Critical patent/EP2409096A2/de
Application granted granted Critical
Publication of EP2409096B1 publication Critical patent/EP2409096B1/de
Publication of EP2409096B2 publication Critical patent/EP2409096B2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F25B9/145—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle pulse-tube cycle

Definitions

  • the invention relates to a cryogen free cooling apparatus and a method for using such an apparatus.
  • a key challenge with these systems is that the sample is entered into the equipment at room temperature, typically around 300K and then moved to another position where thermal contact is made with a body at a much lower temperature which in some systems can be lower than 1K.
  • the sample and associated mounting and connection equipment is usually pre-cooled either by passing it through cold cryogen gas on its way in to the system or by passing cold cryogen gas or liquid through the sample transfer mechanism, this reduces the thermal shock both on the sample and on the equipment.
  • cryogenic systems that do not require the addition of liquid cryogens or that only require liquid nitrogen during initial cool down have been developed. These are generally known as cryogen free (or "cryofree") systems. These systems use a mechanical cooler such as a GM cooler, Stirling cooler or a pulse tube to provide the cooling power. Because the cooling power of commercially available coolers is somewhat lower than the cooling power available from a reservoir of liquid cryogen, these systems can typically take longer to warm up, change the sample and cool down. There is therefore a considerable need for a method of changing samples in cryogen free systems without the need to warm up the entire system.
  • cryogen free systems there are a number of technical challenges when attempting to load a warm sample in to a cold cryostat. Firstly, the internals of the system are usually contained within a sealed vacuum vessel to reduce heat load. Secondly, within that sealed vacuum vessel, the sample space is usually enclosed by one or more radiation shields to further reduce the heat load. Thirdly, there are no liquid cryogens available to pre-cool the sample as it moves from room temperature to the cold mounting body. Also, electrical contacts need to be remotely made to the sample when it is loaded in the cryostat. This invention seeks to provide solutions to these problems.
  • JP 2008-14878 A discloses a cryogen free cooling apparatus according to the preamble of claim 1.
  • the sample loading apparatus further includes a vacuum vessel in which the sample holding device and elongate probe are movably mounted, the vacuum vessel being connectable to the aperture of the vacuum chamber wall.
  • cryostat Although various cold bodies within the cryostat could be used, such as any cold surface coupled to the cooling stage of the cooling system or to an intermediate stage of a sub 4K cooler such as a still of a dilution refrigerator, it is most convenient to utilize the heat radiation shield already present.
  • more than one heat radiation shield could be provided within the vacuum chamber. One or more of these could therefore be used further to pre-cool the sample.
  • the apparatus further comprises a second heat radiation shield located inside the first radiation shield and surrounding the working region, the cryogen free cooling system having a second cooling stage, colder than the first cooling stage, coupled to the second heat radiation shield, the second radiation shield having an aperture aligned with the apertures of the first heat radiation shield and vacuum chamber wall so as to allow the sample holding device to pass therethrough, whereby the sample holding device can be releasably coupled for heat conduction to the second heat radiation shield.
  • precooling of the sample it is not necessary for precooling of the sample to be carried out by connecting to each shield.
  • precooling could be carried out solely on the innermost (typically 4K) shield. If three or more shields are provided, one or more could be used for precooling.
  • the first heat radiation shield will be held at a temperature of between 45K and 90K while the second radiation shield (if provided) will be held at a temperature of less than 6K or even less than 4.2K.
  • the heat radiation shield apertures may be left open but in order to reduce heat transfer, preferably each aperture is closable by a respective closure system.
  • An example of a suitable closure system comprises one or more flexible flaps, or hinged and sprung flaps.
  • the sample loading apparatus comprises two elongate probes, each coupled to the sample holding device, but in other embodiments a single elongate probe could be used. In both cases, preferably the or each probe is rotatable about its axis relative to the sample holding device. Of course, more than two probes could be used.
  • the connector is conveniently formed by providing a screw thread at one end of the or each rod, the first connector cooperating with a screw thread on the first or second heat radiation shield to achieve thermal connection therebetween.
  • the thermal connection can be achieved using a spring connection where the sample holding device is fitted with a or a plurality of thermally conductive springs which engage on an inner surface of the aperture of the radiation shield. That inner surface may be extended, for example by addition of a tube assembly or a thicker plate assembly to allow for engagement.
  • the spring connectors could also be fixed on the heat or radiation shield and the sample holding device pushed on to them.
  • the thermal connection could be via springs at the higher temperature shields and via screw contact at the lower temperature shields or any combination thereof.
  • the connector could be defined by cone or wedge-shaped mating parts to amplify the contact pressure from the mounting mechanism. This significantly improves performance.
  • the or each probe is releasably coupled to the sample holding device whereby a first operation of the probe(s) causes the sample holding device to be connected to a cold mounting body at the working region. A second operation enables the probe(s) to be released from the sample holding device and retracted. This enables the probe(s) to be removed from the vacuum chamber of the cryostat so as to reduce heat flow into the cryostat. Actuators to allow this could be provided on the probe or cold body.
  • the cryogen free cooling apparatus can be used for a variety of purposes such as, scientific cryogenic research, quantum computing, experimental analysis, material characterisation, device characterisation, detector cooling, device cooling, DNP, NMR or any other application where cooling of matter to cryogenic temperatures is required and in many cases a magnet may be located within the cryostat surrounding the working region.
  • FIG. 1 A first embodiment of the current invention is shown in more detail in Figures 1 to 5 .
  • a sample 1 is mounted on a sample carrier or sample loading device 2 supported on thermally conductive rods of two rod or probe assemblies 3.
  • the sample carrier 2 has space for a number of electrical and/or optical connectors (not shown) to allow connection to connectors on the primary cold body in the cryostat. This allows multiple push fit connectors to be used which gives high flexibility and optionally for the wiring to go through the cryostat rather than down the probe tube, which has significant thermal benefits.
  • the ends of the two rod assemblies 3 are free to rotate within the carrier.
  • a tube and flange assembly forms a vacuum vessel 6 surrounding the rod assemblies 3 and which is open at one end, this end being sealed against the bottom of a gate valve 5 when assembled to a cryostat 50.
  • the rod assemblies pass through a pair of o-ring seals 7.
  • the cryostat 50 comprises an outer vacuum vessel 4 which is closed except for a port 52 covered by a large diameter gate valve 5. Within the vacuum chamber 4 is located a first radiation shield 54 having an aperture 56 aligned with the aperture 52 of the vacuum chamber, and within the first radiation shield 54 is located a second radiation shield 10 having an aperture 58 aligned with the apertures 52,56.
  • the radiation shields 10,54 surround a working region 20 at which is located a cold mounting body 15.
  • the shields 10,54 are cooled by a conventional mechanical cooler such as a GM cooler, Stirling cooler, or pulse tube device. This is not shown in the drawings for reasons of clarity.
  • a first stage of the mechanical cooler is thermally coupled to the shield 54 and a second, colder stage to the shield 10.
  • the first shield 54 is cooled to a temperature of about 77K and the second shield 10 to a temperature of 6K or less, for example about 4.2K.
  • the second shield is held at a temperature higher than 6K.
  • each of the shields as well as the cold mounting body 15 held at the lowest temperature can be considered as "cold bodies".
  • the aperture 56 of the shield 54 is defined by a plate 12 with a cut-out 17.
  • the aperture 58 of the shield 10 is defined by another plate 12 and cut-out 17.
  • the apertures 56,58 can be closed by a suitable closure mechanism.
  • Figure 5 shows a close up cross-sectional view of one possible embodiment of such a mechanism.
  • a or a plurality of flaps 25 are connected to the radiation shield 10 via a sprung hinge arrangement 26. When the rod assembly 3 passes through the flap assembly, the flap or plurality thereof 25 open.
  • the flap or plurality thereof 25 may optionally be shaped or fitted with guide mechanisms to prevent the sample carrier, baffles or rod assemblies from catching on the flaps as the rod assembly and/or carrier is retracted.
  • a sample 1 is loaded on to the sample carrier 2 and electrical or optical connections are made.
  • the sample carrier 2 is then mounted on the end of the rod assemblies 3.
  • the rod assemblies 3 are then retracted through the sliding o-ring seals 7 until the sample carrier is fully within the vacuum vessel 6.
  • the vacuum vessel 6 is then attached to the gate valve 5 and air is pumped out of the vacuum vessel 6 through ports 8A,8B and valves 8.
  • the gate valve is opened.
  • the rod assemblies 3 are then pushed to move the sample carrier through the gate valve and to the first pre-cool position.
  • Figure 2 shows the sample carrier 2 approaching the plate 12 of the shield 54 to thermally connect the sample carrier to a radiation shield pre-cool position defining a first cold body.
  • the rod assemblies 3 have a key 22 ( Figure 4 ) on the end which, when engaged, turns a screw thread 18.
  • the screw threads 18 are aligned with mating screw threads 19 on the plate 12 allowing the sample carrier 2 to be screwed to the plate 12 on the radiation shield 54, thereby making thermal contact.
  • An optional thermometer (not shown) is provided on the sample carrier or rod assembly to allow the temperature of the sample carrier to be monitored during cool down. When the sample carrier 2 is sufficiently cold, the rod assemblies 3 are again rotated to separate the two screw threads.
  • the entire rod and carrier assembly is then rotated by means of a rotating seal on the vacuum vessel 6 or gate valve 5, to allow the carrier 2 to pass through the cut-out 17.
  • the carrier is then optionally connected in a similar manner to a or a plurality of optional additional radiation shields, such as the shield 10 (forming additional cold bodies).
  • the rod assemblies 3 are pushed to their final position to allow connection of the sample carrier 2 to the cold body 15 which could by way of example be connected to the mixing chamber of a dilution refrigerator or a sample plate of a cryostat.
  • Figure 3 shows the sample carrier 2 contacting the cold plate 15.
  • the screw threads 18 are engaged in mating screw threads (not shown) on the cold plate 15.
  • a number of optional push fit electrical and optional optical connections can be made between the sample carrier 2 and the cold body 15. These connectors are not shown on this diagram. In this view, two baffle assemblies 14 are also visible.
  • baffle assemblies are free to slide on the rod assemblies 3 and are pushed or pulled towards the sample carrier by spring assemblies 21.
  • baffle assemblies 14 are shown here in a retracted position, in reality they will be forced by the spring assemblies to contact the plates on the radiation shield, thereby closing the cut-outs 17 and making thermal contact.
  • the baffle assemblies are also optionally connected to the rod assemblies using sliding thermal connections such as thermally conductive spring assemblies, thus allowing the heat passing down the rods from room temperature to be intercepted.
  • Figure 4 shows a close up cross sectional view of the sample carrier and rod assemblies.
  • the key 22 that inserts into a matching connection on the screw thread 18.
  • On the key and rod assembly there is a screw thread 23 and on the sample carrier there is a matching screw thread 24. This arrangement means that if the rod assemblies are retracted, the screw threads 23,24 will clash and the sample carrier will therefore also be retracted.
  • the rod assemblies can then be partially retracted to remove the key from the back of the screw thread 18 and reduce heat flow to the sample.
  • the rod assembly can then be rotated to allow the screw threads to pass through each other and then either be partially retracted from the cryostat, leaving the baffles in contact with the radiation shields, or be fully retracted from the cryostat in order to further reduce heat load.
  • the optional mechanism 11 can be fitted to close the cut outs in the radiation shields.
  • FIG. 6 A second embodiment of the current invention is shown in Figure 6 .
  • a single rod assembly 3 is used with a single large diameter screw thread 18.
  • an adapter 27 which connects the rod assembly to the sample carrier assembly 2.
  • an adapter 27 On the adapter there are a or a plurality of protrusions 28 that engage in slots or recesses 29 formed on the means 12 to allow the carrier to be thermally connected to the radiation shields.
  • the sample is loaded into the carrier and entered through the gate valve 5 as per the first embodiment.
  • the rod assembly is rotated to engage the protrusions 28 in the slots or recesses 28 and the rod assembly is then pushed towards the cryostat until the protrusions 28 meet an obstruction 30.
  • Thermal connection is then optionally made through the protrusions or through optional spring contacts 31.
  • the slot and obstruction are optional and serve to prevent the sample carrier from being accidentally pushed past the radiation shield prior to pre-cooling.
  • the sample rod When the sample is cooled adequately, the sample rod is optionally retracted slightly and rotated to allow the protrusions 28 to move past the obstruction 30. The rod assembly can then be further inserted to allow it to be thermally connected to the next radiation shield if so required.
  • the optional baffles 13 fitted with optional spring thermal contacts 14 engage in the assembly 12 so as to both close the port in the radiation shield and optionally to make thermal contact between the radiation shield and the rod assembly to intercept heat.
  • a similar optional process for pre-cooling on subsequent radiation shield(s) can then be included before moving the sample to the cold body.
  • Figure 7 shows a cross sectional view of the sample carrier assembly of the second embodiment engaged on the cold body.
  • the sample carrier 2 is enclosed in a tube 32 with a screw thread 18 on one end.
  • a means 33 of connecting the tube to the adapter on the end of the rod assembly is provided at the opposite end of the tube. This allows the tube to be inserted and retracted and to be rotated by the rod assembly.
  • the sample carrier is free to rotate inside the tube and is thermally connected to the adapter at the end of the rod assembly using a spring thermal contact 34.
  • the rod assembly is then rotated to pull the sample carrier on to the mating part, making the thermal contact and optional electrical and optical connections.
  • the rod assembly can then be retracted from the cryostat, disconnecting at the means of connecting the tube to the adapter on the end of the rod assembly.
  • Optional baffles can be fitted to close the ports in the radiation shields if the rod assembly is to be completely removed. Removal of the sample is essentially the reverse of the insertion process, with the exception that it is not usually necessary to leave the sample carrier at the radiation shields to warm up when retracting the sample.
  • the mechanism for connection to the radiation shields from being a screw connection to being a spring connection
  • the sample carrier is fitted with a or a plurality of thermally conductive springs which engage on an inner surface of the cut-out on the radiation shield. That inner surface may be extended, for example by addition of a tube assembly or a thicker plate assembly to allow for engagement.
  • the thermal connection could be via springs at the higher temperature shields and via screw contact at the lower temperature shields or any combination thereof.
  • Cone or wedge-shaped mating parts on either side of the releasable coupling could be used to amplify the contact pressure from the mounting mechanism. Pneumatic or piezo or other forms of releasable contact could also be used.
  • connection to the or each cold body can optionally be via thermally conductive spring contacts rather than screw connection.
  • connection to the radiation shields can optionally be via thermally conductive spring contacts or screw contacts.
  • thermal connection is or could be made to a radiation shield or shield
  • this thermal connection could alternatively be made to any other suitable cold surface.
  • thermally conductive spring contacts these can be made from a single material, such as Berillium Copper, or may be made from a laminate or composite of different materials to provide both a good spring force and a high thermal conductivity.
  • Dissimilar materials are preferred so as to reduce eddy currents and quench forces when used with a magnet. Examples of dissimilar materials could be copper for high thermal conductivity and stainless steel for high strength and lower electrical conductivity to reduce induced eddy currents.
  • Other possibilities could include titanium and copper or brass and copper or alumium alloy and copper. Generically, it is one material of high thermal conductivity and one of high strength and higher resistance.
  • the second material could also be a plastic or a composite.
  • an additional port or plurality thereof can be added to the second vacuum vessel to allow the sample and optionally the sample carrier to be removed without removal of the second vacuum vessel from the main vacuum vessel.
  • connection to the radiation shields it is possible to change the connection to the radiation shields to a screw thread on the outside of the rotating tube assembly. It is also possible to change the screw thread connection to the cold body to be an external thread, meaning the same thread can be used to connect to the radiation shields for pre-cooling and then to the cold body.
  • the tube assembly with the thread may optionally have a split in it to allow the diameter to change to compensate for thermal expansion and contraction.
  • a superconducting magnet could be located in the cryostat 50 as is known conventionally for dynamic nuclear polarisation and nuclear magnetic resonance and other cryogenic magnetic field applications.
  • the rods form actuators for connecting and disconnecting to the cold bodies and are demountable from the cryostat.
  • the rods (or other actuators) could form part of the cryostat and the sample carrier could be carried on a probe independent of the rods (or other actuators), the rods (or other actuators) being manipulated to engage the screw threads (or other connection mechanism) as before.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Separation By Low-Temperature Treatments (AREA)

Claims (15)

  1. Kryogenfreie Kühlvorrichtung, umfassend:
    Eine Vakuumkammer (4);
    ein erstes Wärmestrahlungsschild (54), das einen Arbeitsbereich (20) umgibt und in der Vakuumkammern (4) positioniert ist;
    ein kryogenfreies Kühlsystem, zum Beispiel ein mechanischer wie ein GM-Kühler, Stirling-Kühler oder ein Pulsröhrengerät, mit einer Kühlstufe, die an das erste Wärmestrahlungsschild (54) gekoppelt ist;
    einen kalten Körper (12), der von einer Oberfläche gebildet ist, die mit einer kalten Platte verbunden ist, die an eine Kühlstufe des Kühlsystems gekoppelt ist;
    einen kalten Montagekörper (15), der im Arbeitsbereich (20) positioniert ist und auf einer niedrigeren Temperatur als der kalte Körper (12) gehalten wird;
    ausgerichtete Öffnungen (52, 56) im ersten Wärmestrahlungsschild (54) und der Vakuumkammerwand;
    Probenladevorrichtung mit einer oder mehreren Sonden (3) und ein Probenhaltegerät (2), das an die eine oder mehrere der länglichen Sonden angebracht ist, die eine oder mehrere längliche Sonden zum Einführen des Haltegeräts durch die ausgerichteten Öffnungen (52, 56) in den Arbeitsbereich (20); und
    einen thermischen Anschluss (18), wodurch das Probenhaltegerät (2) konfiguriert ist, über den Anschluss mit dem kalten Montagekörper (15) verbunden zu sein, und wobei die längliche Sonde oder jede der länglichen Sonden (3) lösbar an das Probenhaltegerät gekoppelt sind, um das Probehaltegerät freizugeben, wenn das Probenhaltegerät mit dem kalten Montagekörper verbunden ist, wobei ein erster Vorgang der einen oder mehreren länglichen Sonden bewirkt, dass das Probenhaltegerät mit dem kalten Montagekörper verbunden wird, und ein zweiter, nachfolgender Vorgang ermöglicht, dass die eine oder mehreren Sonden vom Probenhaltegerät gelöst und zurückgezogen werden;
    dadurch gekennzeichnet, dass das Probenhaltegerät (2) für Wärmeleitung über den Anschluss (18) lösbar mit dem kalten Körper (12) verbunden ist, um eine Probe (1) auf oder im Probenhaltegerät vorzukühlen, bevor das Probenhaltegerät an den kalten Montagekörper (15) angeschlossen wird.
  2. Vorrichtung nach Anspruch 1, wobei der kalte Körper durch das erste Wärmestrahlungsschild (54) gebildet wird, wodurch der Anschluss (18) lösbar für Wärmeleitung an das erste Wärmestrahlungsschild gekoppelt werden kann.
  3. Vorrichtung nach Anspruch 2, die ferner ein zweites Wärmestrahlungsschild (10) umfasst, das innerhalb des ersten Wärmeschilds (54) positioniert ist und den Arbeitsbereich (20) umgibt, wobei das kryogenfreie Kühlsystem eine zweite Kühlstufe aufweist, kälter als die erste Kühlstufe, die an das zweite Wärmestrahlungsschild gekoppelt ist, wobei das zweite Wärmeschild eine Öffnung (58) aufweist, die mit den Öffnungen (52, 56) des ersten Wärmestrahlungsschilds und der Vakuumkammerwand ausgerichtet ist, um dem Probenhaltegerät (2) zu erlauben dort hindurch zu gehen, wodurch das Probenhaltegerät für Wärmeleitung lösbar an das zweite Wärmestrahlungsschild gekoppelt werden kann.
  4. Vorrichtung nach Anspruch 3, wobei das erste Wärmestrahlungsschild (54) auf einer Temperatur von zwischen 45K und 90K gehalten wird und das zweite Wärmestrahlungsschild (10) vorzugsweise auf einer Temperatur von weniger als 6K gehalten wird.
  5. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei die ausgerichtete Öffnung (52) in der Vakuumkammerwand ein Verschlusssystem (5) wie beispielsweise ein Vakuumventil einschließt.
  6. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei die oder jede ausgerichtete Öffnung (56, 58) im ersten Wärmestrahlungsschild (54) und zweiten Wärmestrahlungsschild (10) durch ein jeweiliges Verschlusssystem (25), wie beispielsweise eine oder mehrere flexible Klappen oder scharnierte oder gefederte Klappen, schließbar ist.
  7. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei die eine oder die mehreren länglichen Sonden (3) zwei oder mehrere längliche Sonden umfassen, wobei jede an das Probenhaltegerät gekoppelt ist.
  8. Vorrichtung nach Anspruch 7, wobei jede Sonde um ihre Achse relativ zum Probenhaltegerät (2) drehbar ist, und wobei die oder jede Sonde vorzugsweise an einem Ende mit einem Schraubengewinde (18) versehen ist, um den thermischen Anschluss zu definieren, wobei der Anschluss mit einem Schraubengewinde (19) am kalten Körper kooperiert, um eine thermische Verbindung dazwischen zu erzielen.
  9. Vorrichtung nach einem der Ansprüche 1 bis 7, wobei der thermische Anschluss eine oder mehrere thermisch leitfähige Federn umfasst, die typisch Verbundmaterial mit hoher thermischer Leitfähigkeit und hoher Federkraft umfassen, angebracht zur Herstellung von thermischem Kontakt zwischen dem kalten Körper und dem Probenhaltegerät (2).
  10. Vorrichtung nach Anspruch 3, wobei die Probenladevorrichtung relativ zur Vakuumkammer (4) und den ersten und zweiten Wärmeschildern (10, 54) drehbar ist, um sich selektiv mit dem oder jedem thermischen Anschluss (18) oder mit der jeweiligen Öffnung (52, 56, 58) auszurichten, um dem Probenhaltegerät (2) dort hindurch geleitet zu werden.
  11. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei das Probenhaltegerät (2) einen oder mehrere elektrische Anschlüsse einschließt, um elektrische und thermische Anschlüsse zu einem kalten Körper (15) im Arbeitsbereich (20) herzustellen zu können.
  12. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei das Probenhaltegerät (2) einen oder mehrere optische Anschlüsse, wie beispielsweise Glasfaseranschlüsse, einschließt, um elektrische und thermische Anschlüsse zu einem kalten Körper (15) im Arbeitsbereich (20) herzustellen zu können.
  13. Vorrichtung nach einem der vorhergehenden Ansprüche, wobei die Probenladevorrichtung ferner ein Vakuumgefäß (6) einschließt, in dem die Probenhaltevorrichtung (2) und die längliche(n) Sonde oder Sonden (3) verschiebbar montiert ist/sind, wobei das Vakuumgefäß an die Öffnung (52) der Vakuumkammerwand anschließbar ist.
  14. Verfahren zum Laden einer Probe (1) in den Arbeitsbereich (20) der kryogenfreien Kühlvorrichtung, wobei die kryogenfreie Kühlvorrichtung umfasst:
    eine Vakuumkammer (4);
    ein erstes Wärmestrahlungsschild (54), das einen Arbeitsbereich (20) umgibt und in der Vakuumkammer (4) positioniert ist;
    ein kryogenfreies Kühlsystem, beispielsweise einen mechanischen Kühler, wie einen GM-Kühler, Stirling-Kühler oder ein Pulsröhrengerät, mit einer Kühlstufe, die an das erste Wärmestrahlungsschild (54) gekoppelt ist;
    einen kalten Körper (12), der von einer Oberfläche gebildet ist, die mit einer kalten Platte verbunden ist, die an eine Kühlstufe des Kühlsystems gekoppelt ist;
    einen kalten Montagekörper (15), der im Arbeitsbereich (20) positioniert ist und auf einer niedrigeren Temperatur als der kalte Körper (12) gehalten wird;
    ausgerichtete Öffnungen (52, 56) im ersten Wärmestrahlungsschild (54) und der Vakuumkammerwand, wobei die ausgerichtete Öffnung (52) in der Vakuumkammerwand ein Verschlusssystem (5) wie beispielsweise ein Vakuumventil einschließt;
    Probenladevorrichtung mit einer oder mehreren Sonden (3) und ein Probenhaltegerät (2), das an die eine oder mehrere der länglichen Sonden angebracht ist, die eine oder mehrere längliche Sonden zum Einführen des Probenhaltegeräts durch die ausgerichteten Öffnungen (52, 56) in den Arbeitsbereich (20), wobei das Probenhaltegerät ferner ein Vakuumgefäß (6) einschließt, in dem die Probenladevorrichtung (2) und die längliche(n) Sonde oder Sonden(3) verschiebbar montiert ist/sind, wobei das Vakuumgefäß an die Öffnung (52) der Vakuumwand anschließbar ist; und
    einen thermischen Anschluss (18), wodurch das Probenhaltegerät (2) konfiguriert ist, über den Anschluss mit dem kalten Montagekörper (15) verbunden zu sein, und wobei die längliche Sonde oder jede der länglichen Sonden (3) lösbar an das Probenhaltegerät gekoppelt sind, um das Probenhaltegerät freizugeben, wenn das Probenhaltegerät mit dem kalten Montagekörper verbunden ist;
    wobei das Probenhaltegerät (2) für Wärmeleitung über den Anschluss (18) lösbar mit dem kalten Montagekörper (12) verbunden ist, um eine Probe (1) auf oder im Probenhaltegerät vorzukühlen, bevor das Probenhaltegerät an den kalten Montagekörper (15) angeschlossen wird;
    wobei das Verfahren umfasst:
    Platzieren einer Probe (1) in oder auf das Probenhaltegerät (2);
    Befestigen des Vakuumgefäßes (6) der Probenladevorrichtung an die Vakuumkammer (4) und ausgerichtet mit der Öffnung (52) der Vakuumkammer;
    Evakuieren des Vakuumgefäßes (6);
    Öffnen der Öffnung (52) der Vakuumkammer (4) und Betätigen der oder jeder länglichen Sonde (3), um das Probenhaltegerät (2) durch die geöffnete Öffnung einzuführen, sodass das Probenhaltegerät thermisch an den kalten Körper gekoppelt ist;
    Ermöglichen, dass die Probe (1) im oder auf dem Probenhaltegerät (2) infolge von Wärmeleitung zum kalten Körper gekühlt wird;
    Trennen des Probenhaltegeräts (2) vom kalten Körper;
    Betätigen der oder jeder länglichen Sonde (3), um das Probenhaltegerät (2) in den Arbeitsbereich (20) einzuführen;
    Verbinden des Probenhaltegeräts (2) mit dem kalten Montagekörper (15) über den Anschluss; und
    Lösen und Zurückziehen der länglichen Sonde oder jeder der länglichen Sonden (3) aus dem Probenhaltegerät, wenn das Probenhaltegerät an den kalten Montagekörper angeschlossen ist.
  15. Verfahren nach Anspruch 14, wobei die Vorrichtung ferner ein zweites Wärmestrahlungsschild (10) umfasst, das innerhalb des ersten Wärmestrahlungsschilds (54) positioniert ist und den Arbeitsbereich (20) umgibt, wobei das kryogenfreie Kühlsystem eine zweite Kühlstufe, kälter als die erste Kühlstufe, aufweist, die an das zweite Wärmestrahlungsschild gekoppelt ist, wobei das zweite Wärmestrahlungsschild eine Öffnung (58) aufweist, die mit den Öffnungen des ersten Wärmestrahlungsschilds und der Vakuumkammerwand (52, 54) ausgerichtet ist, um dem Probenhaltegerät (2) zu erlauben dort hindurch zu gehen, wodurch das Probenhaltegerät für Wärmeleitung lösbar an das zweite Wärmestrahlungsschild gekoppelt werden kann, und wobei vor dem Erreichen des Arbeitsbereichs, das Probenhaltegerät thermisch an das zweite Wärmestrahlungsschild gekoppelt wird, gekühlt durch Erlauben, dass Wärme zum zweiten Strahlungsschild, getrennt vom zweiten Strahlungsschild, fließt und das Probenhaltegerät danach in den Arbeitsbereich eingeführt wird.
EP10710389.7A 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren Active EP2409096B2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP22154522.1A EP4027081B1 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP19187223.3A EP3620732B2 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP22205298.7A EP4148353B1 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0904500.6A GB0904500D0 (en) 2009-03-16 2009-03-16 Cryofree cooling apparatus and method
PCT/GB2010/000454 WO2010106309A2 (en) 2009-03-16 2010-03-15 Cryogen free cooling apparatus and method

Related Child Applications (6)

Application Number Title Priority Date Filing Date
EP22154522.1A Division-Into EP4027081B1 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP22154522.1A Division EP4027081B1 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP19187223.3A Division-Into EP3620732B2 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP19187223.3A Division EP3620732B2 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP22205298.7A Division-Into EP4148353B1 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren
EP22205298.7A Division EP4148353B1 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren

Publications (3)

Publication Number Publication Date
EP2409096A2 EP2409096A2 (de) 2012-01-25
EP2409096B1 EP2409096B1 (de) 2019-08-21
EP2409096B2 true EP2409096B2 (de) 2024-06-19

Family

ID=40637422

Family Applications (4)

Application Number Title Priority Date Filing Date
EP19187223.3A Active EP3620732B2 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP22205298.7A Active EP4148353B1 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren
EP10710389.7A Active EP2409096B2 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren
EP22154522.1A Active EP4027081B1 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP19187223.3A Active EP3620732B2 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung
EP22205298.7A Active EP4148353B1 (de) 2009-03-16 2010-03-15 Kryogenfreie kühlvorrichtung und verfahren

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP22154522.1A Active EP4027081B1 (de) 2009-03-16 2010-03-15 Vorrichtung und verfahren zur kryogenfreien kühlung

Country Status (7)

Country Link
US (1) US20120102975A1 (de)
EP (4) EP3620732B2 (de)
JP (1) JP2012520987A (de)
ES (2) ES2935698T3 (de)
FI (4) FI4027081T3 (de)
GB (1) GB0904500D0 (de)
WO (1) WO2010106309A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2493553B (en) * 2011-08-11 2017-09-13 Oxford Instr Nanotechnology Tools Ltd Cryogenic cooling apparatus and method
CN102967834B (zh) * 2012-11-23 2014-10-15 中国科学院武汉物理与数学研究所 一种磁共振引擎装置及方法
WO2014102669A1 (en) * 2012-12-27 2014-07-03 Koninklijke Philips N.V. System and method for quench protection of a cryo-free super conducting magnet
DE102015215919B4 (de) 2015-08-20 2017-06-22 Bruker Biospin Gmbh Verfahren und Vorrichtung zur Vorkühlung eines Kryostaten
EP3163222B1 (de) 2015-10-28 2018-07-18 Technische Universität München Kältemittelfreie kühlvorrichtung
CN109488720B (zh) * 2018-12-27 2024-04-26 仪晟科学仪器(嘉兴)有限公司 闭循环液氦制冷机的机械隔离式震动屏蔽系统
DE102019203341A1 (de) 2019-03-12 2020-09-17 Pressure Wave Systems Gmbh Kryostat
EP3734303B1 (de) * 2019-05-03 2024-04-03 Afore Oy Kryogener wafertester mit beladevorrichtung
GB2592415A (en) * 2020-02-27 2021-09-01 Oxford Instruments Nanotechnology Tools Ltd Insert for a cryogenic cooling system
FI129268B (fi) 2020-05-13 2021-10-29 Bluefors Oy Laite ja menetelmä lämpöä johtavan kytkennän tekemiseksi
US11360140B1 (en) 2020-12-18 2022-06-14 Microsoft Technology Licensing, Llc RF functional probe
US11630172B2 (en) * 2021-03-15 2023-04-18 Bruker Biospin Corp. NMR magnet system with Stirling cooler
US20240159450A1 (en) * 2021-03-16 2024-05-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Easy access via a partial lateral opening system
GB2616318B (en) 2022-05-16 2024-05-15 Oxford Instruments Nanotechnology Tools Ltd Cryogenic cooling system
DE102023111606A1 (de) * 2023-05-04 2024-11-07 eleQtron GmbH Vakuumkammer, Quantencomputeranordnung und Kühlverfahren
CN116951817B (zh) * 2023-06-27 2025-09-30 南方科技大学 一种纺锤形低温预冷装置以及制冷机
US20250380384A1 (en) * 2024-06-07 2025-12-11 International Business Machines Corporation Quick-loading cryogenic cooling systems

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007101305A1 (en) † 2006-03-07 2007-09-13 Cambridge Magnetic Refrigeration Limited Low temperature heatsinking system

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9027A (en) * 1852-06-15 Improvement in preparations of archil
US4251123A (en) 1979-05-04 1981-02-17 The United States Of America As Represented By The United States Department Of Energy Glove box shield
US4446702A (en) 1983-02-14 1984-05-08 Helix Technology Corporation Multiport cryopump
US4577465A (en) 1984-05-11 1986-03-25 Helix Technology Corporation Oil free vacuum system
JPS60260833A (ja) * 1984-06-07 1985-12-24 Hoxan Corp クライオスタツト
JPS6270461U (de) * 1985-10-21 1987-05-02
US4872321A (en) 1988-04-27 1989-10-10 Biomagnetic Technologies, Inc. Nonimmersive cryogenic cooler
US5077523A (en) 1989-11-03 1991-12-31 John H. Blanz Company, Inc. Cryogenic probe station having movable chuck accomodating variable thickness probe cards
JP2821241B2 (ja) * 1990-06-08 1998-11-05 株式会社日立製作所 液化冷凍機付きクライオスタツト
US5237825A (en) * 1991-11-08 1993-08-24 Gte Laboratories Incorporated Method and apparatus for cryogenically cooling samples
US5611207A (en) 1995-06-29 1997-03-18 Hess; John Cryogenic interface for perpendicular loading of independent measurement inserts
JP2946195B2 (ja) 1995-08-18 1999-09-06 セイコーインスツルメンツ株式会社 非破壊検査装置
US5727392A (en) 1996-12-19 1998-03-17 Helix Technology Corporation Convection-shielded cryopump
US5806319A (en) 1997-03-13 1998-09-15 Wary; John Method and apparatus for cryogenically cooling a deposition chamber
JPH11162269A (ja) * 1997-11-27 1999-06-18 Toshiba Corp 超電導機器
JP2001255252A (ja) 2000-03-10 2001-09-21 Jeol Ltd 試料搬送装置
JP3580531B2 (ja) 2000-04-20 2004-10-27 大陽東洋酸素株式会社 希釈冷凍機
JP4163447B2 (ja) 2002-05-22 2008-10-08 日本電子株式会社 スキャナ保持装置および走査型プローブ顕微鏡
EP1585999A4 (de) 2002-08-02 2008-09-17 E A Fischione Instr Inc Verfahren und vorrichtung zur vorbereitung von proben für die mikroskopie
GB0408425D0 (en) 2004-04-15 2004-05-19 Oxford Instr Superconductivity Cooling apparatus
JP4319650B2 (ja) 2005-07-29 2009-08-26 株式会社日立製作所 Ｎｍｒ用低温プローブおよびｎｍｒ装置
US8307665B2 (en) 2006-04-06 2012-11-13 National Institute Of Advanced Industrial Science And Technology Sample cooling apparatus
JP4431793B2 (ja) * 2006-07-07 2010-03-17 国立大学法人九州大学 クライオスタット
US8069675B2 (en) * 2006-10-10 2011-12-06 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler
JP2008098415A (ja) * 2006-10-12 2008-04-24 Toshiba Corp 超電導機器
US8082741B2 (en) 2007-05-15 2011-12-27 Brooks Automation, Inc. Integral facet cryopump, water vapor pump, or high vacuum pump
DE102007028865B3 (de) * 2007-06-22 2009-01-29 Vericold Technologies Gmbh Tieftemperaturvorrichtung
JP2009074774A (ja) 2007-09-25 2009-04-09 Kyushu Univ 無冷媒冷凍機及び機能性熱結合体
US8291717B2 (en) * 2008-05-02 2012-10-23 Massachusetts Institute Of Technology Cryogenic vacuum break thermal coupler with cross-axial actuation
NL2001755C2 (nl) 2008-07-03 2010-01-05 Giorgio Frossati Houder voor een tot een lage temperatuur in een vacuümruimte af te koelen preparaat en 3he-4he mengkoelmachine ingericht voor het opnemen van een dergelijke houder.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007101305A1 (en) † 2006-03-07 2007-09-13 Cambridge Magnetic Refrigeration Limited Low temperature heatsinking system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H. Kambara, T. Matsui, Y. Niimi, and Hiroshi Fukuyama:"Construction of a versatile ultralow temperature scanning tunneling microscope', Review of Scientific Instruments 78,073703, published online 2 July 2007 †
J.E.RIX ET AL.: "Automated sample exchange and tracking system for neutron research at cryogenic temperatures", REVIEW OF SCIENTIFIC INSTRUMENTS, vol. 78, 2007, XP012103606, DOI: 10.1063/1.2426878 †

Also Published As

Publication number Publication date
JP2012520987A (ja) 2012-09-10
US20120102975A1 (en) 2012-05-03
EP4148353B1 (de) 2024-05-22
EP4148353C0 (de) 2024-05-22
EP4027081B1 (de) 2022-12-21
EP3620732A1 (de) 2020-03-11
FI2409096T4 (fi) 2024-06-20
FI4027081T3 (fi) 2023-01-13
WO2010106309A8 (en) 2011-10-13
EP2409096B1 (de) 2019-08-21
EP4027081A2 (de) 2022-07-13
EP4027081A3 (de) 2022-08-31
EP2409096A2 (de) 2012-01-25
WO2010106309A2 (en) 2010-09-23
WO2010106309A3 (en) 2011-05-19
ES2909009T3 (es) 2022-05-04
ES2909009T5 (en) 2025-02-10
GB0904500D0 (en) 2009-04-29
FI4148353T1 (fi) 2023-03-29
EP3620732B1 (de) 2022-02-16
ES2935698T3 (es) 2023-03-09
FI3620732T4 (fi) 2024-11-22
EP4148353A1 (de) 2023-03-15
EP3620732B2 (de) 2024-10-09

Similar Documents

Publication Publication Date Title
EP2409096B2 (de) Kryogenfreie kühlvorrichtung und verfahren
DK2742299T3 (en) CRYOGEN REFRIGERATOR AND PROCEDURE
EP3282269B1 (de) Nmr-apparatur mit durch eine vakuumschleuse in den kryostaten einer supraleitenden magnetanordnung einführbaren gekühlten probenkopfkomponenten sowie verfahren zu deren ein- und ausbau
DE102016214731B3 (de) NMR-Apparatur mit supraleitender Magnetanordnung sowie gekühlten Probenkopfkomponenten
EP1760480A1 (de) NMR-Apparatur mit gemeinsam gekühltem Probenkopf und Kryobehälter
JP2019502888A (ja) 無寒剤冷却装置
US6441711B2 (en) Magnetizing magnet
US20250012685A1 (en) Refrigeration system and method for loading such a refrigeration system
Pagliarone et al. The cuore fast cooling system
US20250380384A1 (en) Quick-loading cryogenic cooling systems
DE19813211A1 (de) Supraleitende Einrichtung mit Leitern aus Hoch-Tc-Supraleitermaterial
Teleberg et al. Sample loading and accelerated cooling of cryogen-free dilution refrigerators
Steinmeyer et al. Towards the invisible cryogenic system for magnetic resonance imaging
Hollister Cryostat Options for 9.4 Tesla x 800 mm Solenoid
GB2339889A (en) Magnetising a superconductor at cryogenic temperatures
Holmes et al. A Sub-Kelvin Cooler for the Background Limited Infrared Submillimeter Spectrometer BLISS on SPICA
Shirron et al. A Rapid Turnaround Two‐Stage Adiabatic Demagnetization Refrigerator for Cooling to 50 mK

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20111006

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
TPAC Observations filed by third parties

Free format text: ORIGINAL CODE: EPIDOSNTIPA

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20170915

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20190320

RIN1 Information on inventor provided before grant (corrected)

Inventor name: GARSIDE, JOHN

Inventor name: KINGLEY, SIMON

Inventor name: CROWTHER, GAVIN

Inventor name: WERNICKE, DOREEN

Inventor name: BUEHLER, MATTHIAS

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602010060646

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1170228

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190915

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191121

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191223

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191121

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191221

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20191122

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1170228

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200224

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

REG Reference to a national code

Ref country code: DE

Ref legal event code: R026

Ref document number: 602010060646

Country of ref document: DE

PLBI Opposition filed

Free format text: ORIGINAL CODE: 0009260

PLAX Notice of opposition and request to file observation + time limit sent

Free format text: ORIGINAL CODE: EPIDOSNOBS2

REG Reference to a national code

Ref country code: FI

Ref legal event code: MDE

Opponent name: BLUEFORS OY

26 Opposition filed

Opponent name: BLUEFORS OY

Effective date: 20200601

PG2D Information on lapse in contracting state deleted

Ref country code: IS

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PLBB Reply of patent proprietor to notice(s) of opposition received

Free format text: ORIGINAL CODE: EPIDOSNOBS3

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20200331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200315

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200315

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200331

APBM Appeal reference recorded

Free format text: ORIGINAL CODE: EPIDOSNREFNO

APBP Date of receipt of notice of appeal recorded

Free format text: ORIGINAL CODE: EPIDOSNNOA2O

APAH Appeal reference modified

Free format text: ORIGINAL CODE: EPIDOSCREFNO

APBM Appeal reference recorded

Free format text: ORIGINAL CODE: EPIDOSNREFNO

APBP Date of receipt of notice of appeal recorded

Free format text: ORIGINAL CODE: EPIDOSNNOA2O

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190821

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230516

APBU Appeal procedure closed

Free format text: ORIGINAL CODE: EPIDOSNNOA9O

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240226

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FI

Payment date: 20240315

Year of fee payment: 15

Ref country code: DE

Payment date: 20240220

Year of fee payment: 15

Ref country code: GB

Payment date: 20240222

Year of fee payment: 15

PUAH Patent maintained in amended form

Free format text: ORIGINAL CODE: 0009272

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: PATENT MAINTAINED AS AMENDED

27A Patent maintained in amended form

Effective date: 20240619

AK Designated contracting states

Kind code of ref document: B2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: DE

Ref legal event code: R102

Ref document number: 602010060646

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: NL

Ref legal event code: PD

Owner name: OXFORD NANOSCIENCE LIMITED; GB

Free format text: DETAILS ASSIGNMENT: CHANGE OF OWNER(S), ASSIGNMENT; FORMER OWNER NAME: OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED

Effective date: 20250815

REG Reference to a national code

Ref country code: GB

Ref legal event code: 732E

Free format text: REGISTERED BETWEEN 20250828 AND 20250903

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602010060646

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250315

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20250401

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20250315

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20251001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20250315

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 602010060646

Country of ref document: DE

Owner name: OXFORD NANOSCIENCE LIMITED, ABINGDON, GB

Free format text: FORMER OWNER: OXFORD INSTRUMENTS NANOTECHNOLOGY TOOLS LIMITED, ABINGDON, OXON, GB

REG Reference to a national code

Ref country code: FI

Ref legal event code: PCE

Owner name: OXFORD NANOSCIENCE LIMITED