EP3564993A4 - Composant de dissipation de chaleur pour élément semiconducteur - Google Patents

Composant de dissipation de chaleur pour élément semiconducteur Download PDF

Info

Publication number: EP3564993A4
Authority: EP; European Patent Office
Prior art keywords: heat dissipation; dissipation component; semiconductive element; semiconductive; component
Prior art date: 2016-12-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP17888860.8A

Other languages

German (de)

English (en)

Other versions

EP3564993A1 (fr

EP3564993B1 (fr

Inventor

Yosuke Ishihara

Takeshi Miyakawa

Hiroaki Ota

Hideo Tsukamoto

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Denka Co Ltd

Original Assignee

Denka Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-12-28

Filing date

2017-11-24

Publication date

2020-09-02

2017-11-24 Application filed by Denka Co Ltd filed Critical Denka Co Ltd

2019-11-06 Publication of EP3564993A1 publication Critical patent/EP3564993A1/fr

2020-09-02 Publication of EP3564993A4 publication Critical patent/EP3564993A4/fr

2021-09-29 Application granted granted Critical

2021-09-29 Publication of EP3564993B1 publication Critical patent/EP3564993B1/fr

Status Active legal-status Critical Current

2037-11-24 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/04—Amorphous alloys with nickel or cobalt as the major constituent
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
- C22C2026/006—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes with additional metal compounds being carbides
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Electrochemistry (AREA)

EP17888860.8A 2016-12-28 2017-11-24 Composant de dissipation de chaleur pour élément semiconducteur Active EP3564993B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2016255584		2016-12-28
PCT/JP2017/042209 WO2018123380A1 (fr)	2016-12-28	2017-11-24	Composant de dissipation de chaleur pour élément semiconducteur

Publications (3)

Publication Number	Publication Date
EP3564993A1 EP3564993A1 (fr)	2019-11-06
EP3564993A4 true EP3564993A4 (fr)	2020-09-02
EP3564993B1 EP3564993B1 (fr)	2021-09-29

Family

ID=62707486

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP17888860.8A Active EP3564993B1 (fr)	2016-12-28	2017-11-24	Composant de dissipation de chaleur pour élément semiconducteur

Country Status (4)

Country	Link
US (1)	US10541189B2 (fr)
EP (1)	EP3564993B1 (fr)
JP (1)	JP7000347B2 (fr)
WO (1)	WO2018123380A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2021127253A1 (fr)	2019-12-18	2021-06-24	Hypertherm, Inc.	Systèmes et procédés de capteur de tête de coupe à jet de liquide
CN111334795B (zh) *	2020-03-12	2022-04-19	成都四威高科技产业园有限公司	一种金刚石铝复合材料表面镀覆工艺
JP7587570B2 (ja) *	2020-03-26	2024-11-20	デンカ株式会社	セラミックス回路基板、放熱部材及びアルミニウム－ダイヤモンド系複合体
TWI792148B (zh) *	2021-01-08	2023-02-11	艾姆勒科技股份有限公司	具鍍層結構之散熱基材
US12017297B2 (en) *	2021-12-22	2024-06-25	Spirit Aerosystems, Inc.	Method for manufacturing metal matrix composite parts
KR102884605B1 (ko) *	2022-05-25	2025-11-13	주식회사 더굿시스템	복합재료 및 이 복합재료를 포함하는 방열부품
CN118522707B (zh) *	2024-07-23	2024-09-20	合肥阿基米德电子科技有限公司	衬板结构、集成pcb驱动结构及其双面散热模块封装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2013015158A1 (fr) *	2011-07-28	2013-01-31	電気化学工業株式会社	Composant de dissipation de chaleur pour élément semi-conducteur
WO2015163395A1 (fr) *	2014-04-25	2015-10-29	電気化学工業株式会社	Composite d'aluminium-diamant et élément de dissipation thermique l'utilisant
WO2016002925A1 (fr) *	2014-07-03	2016-01-07	電気化学工業株式会社	Corps composite, et procédé de fabrication de celui-ci

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH01132072A (ja)	1987-11-18	1989-05-24	Yazaki Corp	端子、接点等の金メッキ部品
JPH04294009A (ja) *	1991-03-22	1992-10-19	Aisin Seiki Co Ltd	電気接点材料
JPH09157773A (ja)	1995-10-03	1997-06-17	Hitachi Metals Ltd	低熱膨張・高熱伝導性アルミニウム複合材料及びその製造方法
JP2000303126A (ja)	1999-04-15	2000-10-31	Sumitomo Electric Ind Ltd	ダイヤモンド−アルミニウム系複合材料およびその製造方法
KR101721818B1 (ko)	2008-07-17	2017-03-30	덴카 주식회사	알루미늄-다이아몬드계 복합체 및 그 제조 방법
JP2010176863A (ja) *	2009-01-27	2010-08-12	Alps Electric Co Ltd	電気接点及びその製造方法
JP6105262B2 (ja)	2012-11-29	2017-03-29	デンカ株式会社	アルミニウム−ダイヤモンド系複合体放熱部品
JP7010592B2 (ja) *	2014-09-02	2022-02-10	デンカ株式会社	半導体素子用放熱部品

2017
- 2017-11-24 WO PCT/JP2017/042209 patent/WO2018123380A1/fr not_active Ceased
- 2017-11-24 EP EP17888860.8A patent/EP3564993B1/fr active Active
- 2017-11-24 JP JP2018558914A patent/JP7000347B2/ja active Active
- 2017-11-24 US US16/474,690 patent/US10541189B2/en active Active

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2013015158A1 (fr) *	2011-07-28	2013-01-31	電気化学工業株式会社	Composant de dissipation de chaleur pour élément semi-conducteur
US20140182824A1 (en) *	2011-07-28	2014-07-03	Denki Kagaku Kogyo Kabushiki Kaisha	Heat dissipating component for semiconductor element
WO2015163395A1 (fr) *	2014-04-25	2015-10-29	電気化学工業株式会社	Composite d'aluminium-diamant et élément de dissipation thermique l'utilisant
WO2016002925A1 (fr) *	2014-07-03	2016-01-07	電気化学工業株式会社	Corps composite, et procédé de fabrication de celui-ci
US20170130300A1 (en) *	2014-07-03	2017-05-11	Denka Company Limited	Composite body and method for manufacturing same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Modern Tribology Handbook Volume One", 28 December 2000, CRC PRESS, ISBN: 978-0-8493-7787-7, article BHARAT BHUSHAN: "Chapter 2 - Surface Roughness Analysis and Measurement Techniques", pages: 49 - 119, XP055365111 *
See also references of WO2018123380A1 *

Also Published As

Publication number	Publication date
EP3564993A1 (fr)	2019-11-06
EP3564993B1 (fr)	2021-09-29
JPWO2018123380A1 (ja)	2019-11-21
WO2018123380A1 (fr)	2018-07-05
JP7000347B2 (ja)	2022-01-19
US10541189B2 (en)	2020-01-21
US20190341330A1 (en)	2019-11-07

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