ES2004369A6 - Metodo para obtener la interconexion mecanica electrica de dos cuerpos - Google Patents

Metodo para obtener la interconexion mecanica electrica de dos cuerpos

Info

Publication number
ES2004369A6
ES2004369A6 ES8700301A ES8700301A ES2004369A6 ES 2004369 A6 ES2004369 A6 ES 2004369A6 ES 8700301 A ES8700301 A ES 8700301A ES 8700301 A ES8700301 A ES 8700301A ES 2004369 A6 ES2004369 A6 ES 2004369A6
Authority
ES
Spain
Prior art keywords
bodies
coating
hole
electrical
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8700301A
Other languages
English (en)
Inventor
Luciano Benini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marelli Europe SpA
Original Assignee
Marelli Autronica SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Autronica SpA filed Critical Marelli Autronica SpA
Publication of ES2004369A6 publication Critical patent/ES2004369A6/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

METODO PARA OBTENER EL DIAFRAGMA ELECTRICO Y MECANICO Y EL SOPORTE DE UN SENSOR DE PRESION DE PELICULA GRUESA, Y DISPOSITIVOS OBTENIDOS CON ESTE METODO.EL METODO FACULTA LA INTERCONEXION MECANICA Y ELECTRICA, DE PRIMERO Y SEGUNDO CUERPOS (1, 2) DE LOS QUE EL PRIMERO (1) TIENE POR LO MENOS UN ELEMENTO CONDUCTOR (E) ESTANDO DESTINADA SU SUPERFICIE A ENFRENTARSE CON EL SEGUNDO (2) Y EL SEGUNDO (2) TIENE UN ORIFICIO PASANTE (F) O CONEXION ELECTRICA PROVISTO CON UN REVESTIMIENTO METALICO (C) PREVISTO PARA CONEXION ELECTRICA AL ELEMENTO CONDUCTOR (E) DEL PRIMER CUERPO (1). DE CONFORMIDAD CON EL METODO SE APLICAN CAPAS DE COLA VITREA (5,4) A LAS PORCIONES DE SUPERFICIE CORRESPONDIENTES DEL PRIMER Y SEGUNDO CUERPOS (1, 2). ADEMAS SE DEPOSITA UN REVESTIMIENTO (W) DE MATERIAL CONDUCTOR EN UNA MATRIZ VITREA CON LA TECNICA DE PELICULA GRUESA SOBRE LA SUPERFICIE (2A) DEL SEGUNDO CUERPO (2) DESTINADA A ENFRENTARSE AL PRIMERO, ADYACENTE A POR LO MENOS UN ORIFICIO (F). ESTE REVESTIMIENTO (W) SE EXTIENDE POR LO MENOS PARCIALMENTE EN EL ORIFICIO (F) Y SE CONECTA AL REVESTIMIENTO METALICO (C) DE ESTE ORIFICIO. LOS CUERPOS (1, 2) SE UNEN LUEGO LLEVANDOSE LAS CAPAS RESPECTIVAS DE COLA (5, 4) EN CONTACTO Y PONIENDOSE EN CONTACTO EL REVESTIMIENTO CONDUCTOR (W) DEL SEGUNDO CUERPO (2) CON EL ELEMENTO CONDUCTOR (E) DEL PRIMERO. LOS DOS CUERPOS ASI UNIDOS SE PASAN A TRAVES DE UN HORNO EN DONDE SE CALIENTAN DE MODO A OBTENER LA FUSION SIMULTANEA DE LAS CAPAS DE COLA (5, 4) Y LA SINTERIZACION DEL REVESTIMIENTO CONDUCTOR (W) APLICADO AL SEGUNDO CUERPO, Y LA ADHESION DE ESTE REVESTIMIENTO (W) AL ELEMENTO CONDUCTOR COMPORTADO (E) POR EL PRIMER CUERPO.
ES8700301A 1986-02-10 1987-02-09 Metodo para obtener la interconexion mecanica electrica de dos cuerpos Expired ES2004369A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT67095/86A IT1203535B (it) 1986-02-10 1986-02-10 Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento

Publications (1)

Publication Number Publication Date
ES2004369A6 true ES2004369A6 (es) 1989-01-01

Family

ID=11299527

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8700301A Expired ES2004369A6 (es) 1986-02-10 1987-02-09 Metodo para obtener la interconexion mecanica electrica de dos cuerpos

Country Status (12)

Country Link
US (1) US4771261A (es)
JP (2) JPS62190627A (es)
BE (1) BE1001888A3 (es)
BR (1) BR8700718A (es)
CH (1) CH670000A5 (es)
DE (1) DE3703925C2 (es)
ES (1) ES2004369A6 (es)
FR (1) FR2594286B1 (es)
GB (1) GB2186438B (es)
IT (1) IT1203535B (es)
NL (1) NL8700311A (es)
PT (1) PT84261B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US5436795A (en) * 1994-03-28 1995-07-25 Texas Instruments Incorporated Pressure transducer apparatus and method for making same
FR2738705B1 (fr) * 1995-09-07 1997-11-07 Sagem Dispositif capteur electromecanique et procede de fabrication d'un tel dispositif
AU2059597A (en) * 1996-02-28 1997-09-16 Sigma-Netics, Inc. Improved strain gauge and method of manufacture
DE19708325B4 (de) * 1997-03-03 2007-06-14 Sokymat Gmbh Klebeverbindung von elektrisch leitenden Fügeteilen
JP3462494B2 (ja) * 2001-02-16 2003-11-05 ケイテックデバイシーズ株式会社 応力センサ
DE102006031344A1 (de) * 2006-07-06 2008-01-10 Epcos Ag Elektrisches Bauelement mit einem Sensorelement, Verfahren zur Verkapselung eines Sensorelements und Verfahren zur Herstellung einer Plattenanordnung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS5550131A (en) * 1978-10-06 1980-04-11 Hitachi Ltd Electronic transmitter
JPS574531A (en) * 1980-06-10 1982-01-11 Matsushita Electric Ind Co Ltd Manufacture of electrostatic capacity type pressure sensor
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
JPS58162099A (ja) * 1982-03-23 1983-09-26 日本電信電話株式会社 多層印刷配線板の製造方法
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
DE3316017A1 (de) * 1983-05-03 1984-11-08 Siegert GmbH, 8501 Cadolzburg Verfahren zur herstellung elektrischer verbindungen an multisubstratschaltungen, sowie hiernach hergestellte multisubstratschaltungen
JPS6033308A (ja) * 1983-08-04 1985-02-20 Nippon Soda Co Ltd 鉄鋼改質剤
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
GB8403968D0 (en) * 1984-02-15 1984-03-21 Heraeus Gmbh W C Chip resistors
US4670733A (en) * 1985-07-01 1987-06-02 Bell Microsensors, Inc. Differential pressure transducer

Also Published As

Publication number Publication date
GB8702241D0 (en) 1987-03-11
BE1001888A3 (fr) 1990-04-10
DE3703925A1 (de) 1987-08-13
PT84261A (en) 1987-03-01
FR2594286A1 (fr) 1987-08-14
DE3703925C2 (de) 1998-12-10
CH670000A5 (es) 1989-04-28
US4771261A (en) 1988-09-13
GB2186438A (en) 1987-08-12
JPS62190627A (ja) 1987-08-20
JPH09346U (ja) 1997-06-10
FR2594286B1 (fr) 1991-09-13
GB2186438B (en) 1989-02-01
PT84261B (pt) 1989-09-14
BR8700718A (pt) 1987-12-08
IT1203535B (it) 1989-02-15
IT8667095A0 (it) 1986-02-10
NL8700311A (nl) 1987-09-01

Similar Documents

Publication Publication Date Title
US5050035A (en) Capacitive pressure sensor and method of manufacturing same
GB2090071B (en) Bonding with a conductive adhesive
EP0362404A4 (en) Method of producing laminated ceramic electronic parts
EP0905763A3 (en) Multilayer wiring substrate and method for producing the same
MY112280A (en) Electrically connecting structure
ES2004369A6 (es) Metodo para obtener la interconexion mecanica electrica de dos cuerpos
EP0803558A3 (en) Conductive adhesive bonding means
JPS6436001A (en) Electric film resistor and its manufacture
EP0154443A3 (en) Colour member and method of manufacturing same
EP0138673A3 (en) Method of making a printed circuit board
JPS56131219A (en) Energy-confined type piezoelectric filter
JPS6476608A (en) Aeolotropic conductive adhesive film
EP0232983A3 (en) Multilayer systems and their method of production
JPS5670000A (en) Ultrasonic wave transducer using high molecular piezoelectric body
EP0138672A3 (en) Method of making a printed circuit board
JPS61116881A (ja) 電極の接続方法
EP0395301A3 (en) Electroconductive heated window and manufacture thereof
ATE74480T1 (de) Elektrischer kontakt zwischen elementen mit verschiedenem spezifischen widerstand.
JPH02155257A (ja) 半導体実装装置
EP0308980A3 (en) Flat wire in silicone rubber or matrix moe
JPS56128001A (en) Multilayer unification method of triplate strip line
EP0398364A3 (en) Thick-film element having flattened resistor layer
JPS6428889A (en) Manufacture of composite circuit board
JPH03227559A (ja) セラミック製チップキャリヤの製造方法
JPS575028A (en) Joining method of transparent substrate to crystal plate

Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 20020304