ES2024672B3 - Procedimiento para deposito de siliciuro de metal refractario para la fabricacion de circuitos. - Google Patents

Procedimiento para deposito de siliciuro de metal refractario para la fabricacion de circuitos.

Info

Publication number
ES2024672B3
ES2024672B3 ES88402620T ES88402620T ES2024672B3 ES 2024672 B3 ES2024672 B3 ES 2024672B3 ES 88402620 T ES88402620 T ES 88402620T ES 88402620 T ES88402620 T ES 88402620T ES 2024672 B3 ES2024672 B3 ES 2024672B3
Authority
ES
Spain
Prior art keywords
refractory metal
metal silicide
circuits
deposit
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88402620T
Other languages
English (en)
Inventor
Ikuo Hirase
Denis Rufin
Tooru Sumiya
Masamichi Matsuura
Michael Schack
Sadayuki Ukishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
Air Liquide SA
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide SA, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical Air Liquide SA
Application granted granted Critical
Publication of ES2024672B3 publication Critical patent/ES2024672B3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/42—Silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
    • H10D64/0111—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors
    • H10D64/0112—Manufacture or treatment of electrodes ohmically coupled to a semiconductor to Group IV semiconductors using conductive layers comprising silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/412—Deposition of metallic or metal-silicide materials
    • H10P14/414—Deposition of metallic or metal-silicide materials of metal-silicide materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Silicon Compounds (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Catalysts (AREA)
ES88402620T 1987-10-19 1988-10-18 Procedimiento para deposito de siliciuro de metal refractario para la fabricacion de circuitos. Expired - Lifetime ES2024672B3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8714383A FR2622052B1 (fr) 1987-10-19 1987-10-19 Procede de depot de siliciure de metal refractaire pour la fabrication de circuits integres

Publications (1)

Publication Number Publication Date
ES2024672B3 true ES2024672B3 (es) 1992-03-01

Family

ID=9355934

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88402620T Expired - Lifetime ES2024672B3 (es) 1987-10-19 1988-10-18 Procedimiento para deposito de siliciuro de metal refractario para la fabricacion de circuitos.

Country Status (11)

Country Link
US (1) US4981723A (es)
EP (1) EP0313452B1 (es)
JP (1) JPH027423A (es)
KR (1) KR890007388A (es)
AT (1) ATE67629T1 (es)
CA (1) CA1337547C (es)
DE (1) DE3864971D1 (es)
ES (1) ES2024672B3 (es)
FI (1) FI884788A7 (es)
FR (1) FR2622052B1 (es)
NO (1) NO884603L (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930002673B1 (ko) * 1990-07-05 1993-04-07 삼성전자 주식회사 고융점금속 성장방법
TW396646B (en) 1997-09-11 2000-07-01 Lg Semicon Co Ltd Manufacturing method of semiconductor devices
KR100425147B1 (ko) * 1997-09-29 2004-05-17 주식회사 하이닉스반도체 반도체소자의제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5860640A (ja) * 1981-10-01 1983-04-11 Hoya Corp 光学ガラス
DE3141567C2 (de) * 1981-10-20 1986-02-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von aus Tantal, Wolfram oder Molybdän bestehenden Schichten bei niedrigen Temperaturen und Verwendung dieser Schichten
US4557943A (en) * 1983-10-31 1985-12-10 Advanced Semiconductor Materials America, Inc. Metal-silicide deposition using plasma-enhanced chemical vapor deposition
JPS60170234A (ja) * 1984-02-15 1985-09-03 Semiconductor Energy Lab Co Ltd 気相反応装置および気相反応被膜作製方法
US4629635A (en) * 1984-03-16 1986-12-16 Genus, Inc. Process for depositing a low resistivity tungsten silicon composite film on a substrate
JPS61276976A (ja) * 1985-05-31 1986-12-06 Res Dev Corp Of Japan 中間状態種を用いた熱ｃｖｄ法によるシリコン含有高品質薄膜の製造方法及び装置
US4684542A (en) * 1986-08-11 1987-08-04 International Business Machines Corporation Low pressure chemical vapor deposition of tungsten silicide

Also Published As

Publication number Publication date
US4981723A (en) 1991-01-01
CA1337547C (fr) 1995-11-14
NO884603D0 (no) 1988-10-17
NO884603L (no) 1989-04-20
FR2622052A1 (fr) 1989-04-21
EP0313452A1 (fr) 1989-04-26
JPH027423A (ja) 1990-01-11
FI884788L (fi) 1989-04-20
FR2622052B1 (fr) 1990-02-16
FI884788A0 (fi) 1988-10-17
KR890007388A (ko) 1989-06-19
ATE67629T1 (de) 1991-10-15
FI884788A7 (fi) 1989-04-20
EP0313452B1 (fr) 1991-09-18
DE3864971D1 (de) 1991-10-24

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