ES2031248T3 - Procedimiento de realizacion de una tarjeta de memoria electronica. - Google Patents

Procedimiento de realizacion de una tarjeta de memoria electronica.

Info

Publication number
ES2031248T3
ES2031248T3 ES198888400068T ES88400068T ES2031248T3 ES 2031248 T3 ES2031248 T3 ES 2031248T3 ES 198888400068 T ES198888400068 T ES 198888400068T ES 88400068 T ES88400068 T ES 88400068T ES 2031248 T3 ES2031248 T3 ES 2031248T3
Authority
ES
Spain
Prior art keywords
realization
electronic memory
procedure
memory card
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198888400068T
Other languages
English (en)
Inventor
Marc Brignet
Emile Droche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SCHLUMBERGER INDUSTRIES
Original Assignee
SCHLUMBERGER INDUSTRIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9346968&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2031248(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SCHLUMBERGER INDUSTRIES filed Critical SCHLUMBERGER INDUSTRIES
Application granted granted Critical
Publication of ES2031248T3 publication Critical patent/ES2031248T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Holo Graphy (AREA)
  • Electrically Operated Instructional Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Packaging For Recording Disks (AREA)
  • External Artificial Organs (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Compression, Expansion, Code Conversion, And Decoders (AREA)
  • Non-Volatile Memory (AREA)
  • Collating Specific Patterns (AREA)

Abstract

EL INVENTO TRATA DE LA REALIZACION DE TARJETAS DE MEMORIA ELECTRONICA. PARA REALIZAR EL CUERPO DE LA TARJETA EN MATERIAL PLASTICO SE PONE EN UN MOLDE (60,62) EL MODULO ELECTRONICO (14) CUYO RECUBRIMIENTO (50) PRESENTA RESISTENCIA AL DESPULLADO (54). EL MODULO SE MANTIENE EN SU LUGAR POR ASPIRACION (72). SE INYECTA EL MATERIAL PLASTICO EN EL MOLDE, REALIZANDO ASI UN SOBREMOLDEADO DEL MODULO ELECTRONICO.
ES198888400068T 1987-01-16 1988-01-14 Procedimiento de realizacion de una tarjeta de memoria electronica. Expired - Lifetime ES2031248T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8700446A FR2609821B1 (fr) 1987-01-16 1987-01-16 Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede

Publications (1)

Publication Number Publication Date
ES2031248T3 true ES2031248T3 (es) 1992-12-01

Family

ID=9346968

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198888400068T Expired - Lifetime ES2031248T3 (es) 1987-01-16 1988-01-14 Procedimiento de realizacion de una tarjeta de memoria electronica.

Country Status (18)

Country Link
EP (1) EP0277854B1 (es)
JP (1) JPS63239097A (es)
KR (1) KR880009317A (es)
AT (1) ATE74456T1 (es)
AU (1) AU600785B2 (es)
BR (1) BR8800135A (es)
CA (1) CA1306058C (es)
DE (1) DE3869635D1 (es)
DK (1) DK16988A (es)
ES (1) ES2031248T3 (es)
FI (1) FI93156C (es)
FR (1) FR2609821B1 (es)
GR (1) GR3004900T3 (es)
IN (1) IN170183B (es)
NO (1) NO178089C (es)
NZ (1) NZ223192A (es)
PT (1) PT86557A (es)
ZA (1) ZA88279B (es)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0825349B2 (ja) * 1987-10-22 1996-03-13 日本ユーロテック株式会社 カードの製造法
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
FR2636755B1 (fr) * 1988-09-16 1992-05-22 Schlumberger Ind Sa Procede de realisation de cartes a memoire et cartes obtenues par ledit procede
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
EP0361194A3 (de) * 1988-09-30 1991-06-12 Siemens Aktiengesellschaft Verfahren zum Umhüllen von elektrischen oder elektronischen Bauelementen oder Baugruppen und Umhüllung für elektrische oder elektronische Bauelemente oder Baugruppen
JP2559834B2 (ja) * 1989-01-12 1996-12-04 三菱電機株式会社 Ｉｃカード
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
US5244840A (en) * 1989-05-23 1993-09-14 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing an encapsulated IC card having a molded frame and a circuit board
FR2647571B1 (fr) * 1989-05-26 1994-07-22 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
FR2666687A1 (fr) * 1990-09-06 1992-03-13 Sgs Thomson Microelectronics Circuit integre a boitier moule comprenant un dissipateur thermique et procede de fabrication.
IT1243817B (it) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
DE4038126C2 (de) * 1990-11-27 1993-12-16 Mannesmann Ag Verfahren und Vorrichtung zur Herstellung einer dekorierten Chip-Karte
FI913357A7 (fi) * 1991-07-10 1993-01-11 Valtion Teknillinen Tutkimuskeskus Menetelmä ja muotti ruiskupuristetun elektroniikkamodulin valmistamiseksi
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
DE4401588C2 (de) * 1994-01-20 2003-02-20 Gemplus Gmbh Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul
DE9422424U1 (de) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chipkarte mit einem elektronischen Modul
JPH0890600A (ja) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ｉｃカード製造金型
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
JP3409943B2 (ja) * 1995-05-25 2003-05-26 昭和電工株式会社 輸液容器用口栓体及びその製法
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
DE19625228C2 (de) * 1996-06-24 1998-05-14 Siemens Ag Systemträger für die Montage einer integrierten Schaltung in einem Spritzgußgehäuse
EP0890928A3 (en) * 1997-07-10 2001-06-13 Sarnoff Corporation Transmission apparatus and remotely identifying an electronically coded article
EP0938060A1 (de) * 1998-02-20 1999-08-25 ESEC Management SA Verfahren zur Herstellung eines Chipobjektes und Chipobjekt
WO2000019513A1 (de) * 1998-09-29 2000-04-06 Tyco Electronics Logistics Ag Verfahren zum eingiessen eines flachen elektronikmoduls in einem kunststoffkartenkörper durch thermoplastisches spritzgiessen
FR2895547B1 (fr) * 2005-12-26 2008-06-06 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit
ATE551668T1 (de) 2006-11-17 2012-04-15 Oberthur Technologies Verfahren zur herstellung einer entität und entsprechende vorrichtung
ES2928212T3 (es) 2016-07-27 2022-11-16 Composecure Llc Componentes electrónicos sobremoldeados para tarjetas de transacción y procedimientos de fabricación de las mismas
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
AU2018330181B2 (en) 2017-09-07 2022-03-31 Composecure, Llc Transaction card with embedded electronic components and process for manufacture
KR102931665B1 (ko) 2017-10-18 2026-02-26 컴포시큐어 엘.엘.씨. 윈도우 또는 윈도우 패턴 및 선택적인 백라이팅을 갖는 금속, 세라믹, 또는 세라믹 코팅된 트랜잭션 카드
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
CN116852632A (zh) * 2023-07-04 2023-10-10 中国银行股份有限公司 卡片制作装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
JPS6086850A (ja) * 1983-10-18 1985-05-16 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS60146383A (ja) * 1984-01-10 1985-08-02 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS61222712A (ja) * 1985-03-28 1986-10-03 Mitsubishi Electric Corp 樹脂封止成形体の製造方法
JPS6232094A (ja) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Ｉｃカ−ド

Also Published As

Publication number Publication date
AU600785B2 (en) 1990-08-23
DE3869635D1 (de) 1992-05-07
FR2609821B1 (fr) 1989-03-31
GR3004900T3 (es) 1993-04-28
EP0277854A1 (fr) 1988-08-10
BR8800135A (pt) 1988-08-23
DK16988A (da) 1988-07-17
AU1016088A (en) 1988-07-21
PT86557A (pt) 1989-01-30
FI93156B (fi) 1994-11-15
DK16988D0 (da) 1988-01-14
FI880152L (fi) 1988-07-17
NO880166D0 (no) 1988-01-15
EP0277854B1 (fr) 1992-04-01
ZA88279B (en) 1988-07-01
NO178089C (no) 1996-01-17
CA1306058C (en) 1992-08-04
KR880009317A (ko) 1988-09-14
NO880166L (no) 1988-07-18
NO178089B (no) 1995-10-09
IN170183B (es) 1992-02-22
FI93156C (fi) 1995-02-27
ATE74456T1 (de) 1992-04-15
FI880152A0 (fi) 1988-01-14
JPS63239097A (ja) 1988-10-05
NZ223192A (en) 1989-09-27
FR2609821A1 (fr) 1988-07-22

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