ES2048734T3 - Elaboracion de obleas semiconductoras. - Google Patents

Elaboracion de obleas semiconductoras.

Info

Publication number
ES2048734T3
ES2048734T3 ES87303454T ES87303454T ES2048734T3 ES 2048734 T3 ES2048734 T3 ES 2048734T3 ES 87303454 T ES87303454 T ES 87303454T ES 87303454 T ES87303454 T ES 87303454T ES 2048734 T3 ES2048734 T3 ES 2048734T3
Authority
ES
Spain
Prior art keywords
semiconductor
elaboration
waves
sleeve
curved surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES87303454T
Other languages
English (en)
Inventor
Martin Feldman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Application granted granted Critical
Publication of ES2048734T3 publication Critical patent/ES2048734T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/949—Energy beam treating radiation resist on semiconductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)
  • Electron Beam Exposure (AREA)

Abstract

UN MANGUITO (10) PARA MANTENER UNA PIEZA (TAL COMO UNA LAMINA DE SEMICONDUCTOR) EN EL VACIO QUE COMPRENDE UNA SUPERFICIE CURVADA (13). EMPALMANDO LOS EJES DE LA PIEZA Y MANTENIENDO SU PARTE POSTERIOR CONTRA LA SUPERFICIE CURVADA LA PARTE FRONTAL DE LA MISMA PUEDE SER ESTABLECIDA EN UNA RELACION EQUIDISTANTE PRECISA CON RESPECTO A LA SUPERFICIE DE REFERENCIA. ESTE MANGUITO ES ADECUADO PARA MANTENER LAMINAS QUE VAN A SER LITOGRAFIADAS EN ALTA RESOLUCION POR UN HAZ DE ELECTRONES, UNA HAZ DE IONES O UN HAZ DE RAYOS X.
ES87303454T 1986-04-28 1987-04-21 Elaboracion de obleas semiconductoras. Expired - Lifetime ES2048734T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/856,175 US4724222A (en) 1986-04-28 1986-04-28 Wafer chuck comprising a curved reference surface

Publications (1)

Publication Number Publication Date
ES2048734T3 true ES2048734T3 (es) 1994-04-01

Family

ID=25323001

Family Applications (1)

Application Number Title Priority Date Filing Date
ES87303454T Expired - Lifetime ES2048734T3 (es) 1986-04-28 1987-04-21 Elaboracion de obleas semiconductoras.

Country Status (6)

Country Link
US (1) US4724222A (es)
EP (1) EP0244137B1 (es)
JP (1) JPS62260326A (es)
CA (1) CA1255814A (es)
DE (1) DE3789069T2 (es)
ES (1) ES2048734T3 (es)

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DE3639346A1 (de) * 1986-11-18 1988-05-26 Siemens Ag Verfahren und anordnung zur aenderung des abbildungsmassstabes in der roentgenlithografie
US4982153A (en) * 1989-02-06 1991-01-01 Cray Research, Inc. Method and apparatus for cooling an integrated circuit chip during testing
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US5147828A (en) * 1989-12-14 1992-09-15 Applied Materials, Inc. Method of handling magnetic semiconductor wafers
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
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DE69610821T2 (de) * 1995-02-10 2001-06-07 Advanced Micro Devices, Inc. Chemisch-mechanisch polieren mit gebogenen traegern
US5700725A (en) * 1995-06-26 1997-12-23 Lucent Technologies Inc. Apparatus and method for making integrated circuits
US5905566A (en) * 1997-04-10 1999-05-18 International Business Machines Corporation Laser ablation top surface reference chuck
WO2000055686A1 (en) * 1997-05-21 2000-09-21 Joseph Lyons Passive shaped chuck for correcting field curvature
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
JP3406488B2 (ja) * 1997-09-05 2003-05-12 東京エレクトロン株式会社 真空処理装置
US6207006B1 (en) 1997-09-18 2001-03-27 Tokyo Electron Limited Vacuum processing apparatus
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
US6873087B1 (en) 1999-10-29 2005-03-29 Board Of Regents, The University Of Texas System High precision orientation alignment and gap control stages for imprint lithography processes
KR100862301B1 (ko) 2000-07-16 2008-10-13 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 임프린트 리소그래피를 위한 고분해능 오버레이 정렬 방법 및 시스템
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EP2270592B1 (en) * 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
CN1696826A (zh) * 2000-08-01 2005-11-16 得克萨斯州大学系统董事会 用对激活光透明的模板在衬底上形成图案的方法及半导体器件
EP1352295B1 (en) * 2000-10-12 2015-12-23 Board of Regents, The University of Texas System Template for room temperature, low pressure micro- and nano-imprint lithography
US20050274219A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US20060005657A1 (en) * 2004-06-01 2006-01-12 Molecular Imprints, Inc. Method and system to control movement of a body for nano-scale manufacturing
US6513796B2 (en) 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
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US7037639B2 (en) * 2002-05-01 2006-05-02 Molecular Imprints, Inc. Methods of manufacturing a lithography template
US7179079B2 (en) * 2002-07-08 2007-02-20 Molecular Imprints, Inc. Conforming template for patterning liquids disposed on substrates
US7019819B2 (en) * 2002-11-13 2006-03-28 Molecular Imprints, Inc. Chucking system for modulating shapes of substrates
US7077992B2 (en) * 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7070405B2 (en) * 2002-08-01 2006-07-04 Molecular Imprints, Inc. Alignment systems for imprint lithography
US8349241B2 (en) * 2002-10-04 2013-01-08 Molecular Imprints, Inc. Method to arrange features on a substrate to replicate features having minimal dimensional variability
US6929762B2 (en) * 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6980282B2 (en) * 2002-12-11 2005-12-27 Molecular Imprints, Inc. Method for modulating shapes of substrates
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US6871558B2 (en) * 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
TW200500811A (en) * 2002-12-13 2005-01-01 Molecular Imprints Inc Magnification correction employing out-of-plane distortion of a substrate
US7452574B2 (en) * 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US20040168613A1 (en) * 2003-02-27 2004-09-02 Molecular Imprints, Inc. Composition and method to form a release layer
US7122079B2 (en) * 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US20070131563A1 (en) * 2003-04-14 2007-06-14 Asm Nutool, Inc. Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
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US6805054B1 (en) 2003-05-14 2004-10-19 Molecular Imprints, Inc. Method, system and holder for transferring templates during imprint lithography processes
US7157036B2 (en) * 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US20050160934A1 (en) * 2004-01-23 2005-07-28 Molecular Imprints, Inc. Materials and methods for imprint lithography
US7150622B2 (en) * 2003-07-09 2006-12-19 Molecular Imprints, Inc. Systems for magnification and distortion correction for imprint lithography processes
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US20050084804A1 (en) * 2003-10-16 2005-04-21 Molecular Imprints, Inc. Low surface energy templates
US7301623B1 (en) * 2003-12-16 2007-11-27 Nanometrics Incorporated Transferring, buffering and measuring a substrate in a metrology system
US8076386B2 (en) * 2004-02-23 2011-12-13 Molecular Imprints, Inc. Materials for imprint lithography
US20050189676A1 (en) * 2004-02-27 2005-09-01 Molecular Imprints, Inc. Full-wafer or large area imprinting with multiple separated sub-fields for high throughput lithography
US7906180B2 (en) * 2004-02-27 2011-03-15 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
US20050276919A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US20050275311A1 (en) * 2004-06-01 2005-12-15 Molecular Imprints, Inc. Compliant device for nano-scale manufacturing
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US20060145398A1 (en) * 2004-12-30 2006-07-06 Board Of Regents, The University Of Texas System Release layer comprising diamond-like carbon (DLC) or doped DLC with tunable composition for imprint lithography templates and contact masks
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TWI437672B (zh) 2011-12-16 2014-05-11 印能科技股份有限公司 利用氣體充壓以抑制載板翹曲的載板固定方法
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KR102507283B1 (ko) 2015-12-22 2023-03-07 삼성전자주식회사 기판 척 및 이를 포함하는 기판 접합 시스템
JP7114269B2 (ja) * 2018-02-23 2022-08-08 三菱重工業株式会社 被加工物の支持装置及び被加工物の支持方法
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Also Published As

Publication number Publication date
US4724222A (en) 1988-02-09
EP0244137A3 (en) 1989-05-03
JPS62260326A (ja) 1987-11-12
DE3789069T2 (de) 1994-05-19
EP0244137A2 (en) 1987-11-04
EP0244137B1 (en) 1994-02-16
DE3789069D1 (de) 1994-03-24
CA1255814A (en) 1989-06-13

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