ES2069837T3 - Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa. - Google Patents

Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa.

Info

Publication number
ES2069837T3
ES2069837T3 ES91311672T ES91311672T ES2069837T3 ES 2069837 T3 ES2069837 T3 ES 2069837T3 ES 91311672 T ES91311672 T ES 91311672T ES 91311672 T ES91311672 T ES 91311672T ES 2069837 T3 ES2069837 T3 ES 2069837T3
Authority
ES
Spain
Prior art keywords
transit
filling
dimensioners
multilayer
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91311672T
Other languages
English (en)
Inventor
Hal D Smith
Robert F Mcclanahan
Andrew A Shapiro
George Pelzman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of ES2069837T3 publication Critical patent/ES2069837T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/13—Energy storage using capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S174/00—Electricity: conductors and insulators
    • Y10S174/13—High voltage cable, e.g. above 10kv, corona prevention
    • Y10S174/33—Method of cable manufacture, assembly, repair, or splicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/916—Narrow band gap semiconductor material, <<1ev
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/928—Active solid-state devices, e.g. transistors, solid-state diodes with shorted PN or schottky junction other than emitter junction

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Thin Film Transistor (AREA)

Abstract

UNA ESTRUCTURA DE CONDENSADOR EN UN CIRCUITO MULTICAPA HIBRIDO CON VARIAS CAPAS AISLANTES (L3, L4), LA ESTRUCTURA DE CONDENSADOR QUE INCLUYE UN RELLENO DE TRANSITO DIELECTRICO (203A) EN UNA VIA FORMADA EN UNA DE LAS CAPAS AISLANTES, UN PRIMER ELEMENTO CONDUCTOR (103A) SUPERPUESTO AL RELLENO DE TRANSITO DIELECTRICO, Y UN SEGUNDO ELEMENTO CONDUCTOR (104A) SUBYACENTE A DICHO RELLENO DE TRANSITO DIELECTRICO. CADA UNO DE LOS ELEMENTOS PRIMERO Y CONDUCTOR INCLUYE UN RELLENO DE TRANSITO CONDUCTOR O UNA LINEA CONDUCTORA.
ES91311672T 1990-12-17 1991-12-16 Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa. Expired - Lifetime ES2069837T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/628,784 US5055966A (en) 1990-12-17 1990-12-17 Via capacitors within multi-layer, 3 dimensional structures/substrates

Publications (1)

Publication Number Publication Date
ES2069837T3 true ES2069837T3 (es) 1995-05-16

Family

ID=24520288

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91311672T Expired - Lifetime ES2069837T3 (es) 1990-12-17 1991-12-16 Condensadores de via dentro de estructuras/sustratos tridimensionales multicapa.

Country Status (9)

Country Link
US (1) US5055966A (es)
EP (1) EP0491542B1 (es)
JP (1) JP2874120B2 (es)
KR (1) KR950010022B1 (es)
CA (1) CA2056740C (es)
DE (1) DE69108365T2 (es)
DK (1) DK0491542T3 (es)
ES (1) ES2069837T3 (es)
MX (1) MX9102574A (es)

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US5208726A (en) * 1992-04-03 1993-05-04 Teledyne Monolithic Microwave Metal-insulator-metal (MIM) capacitor-around-via structure for a monolithic microwave integrated circuit (MMIC) and method of manufacturing same
JPH05343855A (ja) * 1992-06-08 1993-12-24 Cmk Corp 多層プリント配線板およびその製造方法
US5396397A (en) * 1992-09-24 1995-03-07 Hughes Aircraft Company Field control and stability enhancement in multi-layer, 3-dimensional structures
US5780375A (en) * 1993-10-19 1998-07-14 E. I. Du Pont De Nemours And Company Thick film composition for modifying the electrical properties of a dielectric layer
JP3363651B2 (ja) * 1994-04-21 2003-01-08 キヤノン株式会社 プリント配線板およびその設計方法
US5745333A (en) * 1994-11-21 1998-04-28 International Business Machines Corporation Laminar stackable circuit board structure with capacitor
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
JPH08228064A (ja) * 1994-12-22 1996-09-03 Kanto Kasei Kogyo Kk プリント回路基板
US5633785A (en) * 1994-12-30 1997-05-27 University Of Southern California Integrated circuit component package with integral passive component
US5708570A (en) * 1995-10-11 1998-01-13 Hughes Aircraft Company Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures
US6004839A (en) * 1996-01-17 1999-12-21 Nec Corporation Semiconductor device with conductive plugs
DE19638195A1 (de) * 1996-09-19 1998-04-02 Bosch Gmbh Robert Dielektrische Paste
JP3629348B2 (ja) * 1997-04-16 2005-03-16 新光電気工業株式会社 配線基板
US6261872B1 (en) 1997-09-18 2001-07-17 Trw Inc. Method of producing an advanced RF electronic package
JP3322199B2 (ja) * 1998-01-06 2002-09-09 株式会社村田製作所 多層セラミック基板およびその製造方法
USRE38519E1 (en) * 1998-08-24 2004-05-18 Panduit Corp. Low crosstalk modular communication connector
US6371793B1 (en) 1998-08-24 2002-04-16 Panduit Corp. Low crosstalk modular communication connector
JP3656484B2 (ja) * 1999-03-03 2005-06-08 株式会社村田製作所 セラミック多層基板の製造方法
WO2001019149A1 (en) 1999-09-02 2001-03-15 Ibiden Co., Ltd. Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board
KR100890475B1 (ko) * 1999-09-02 2009-03-26 이비덴 가부시키가이샤 프린트배선판 및 그 제조방법
DE60103490T2 (de) 2000-01-14 2005-06-30 Panduit Corp., Tinley Park Modularer kommunikationsverbinder mit niedrigem übersprechen
JP2001257471A (ja) * 2000-03-10 2001-09-21 Ngk Insulators Ltd 多層配線基板及びその製造方法
US6525922B2 (en) * 2000-12-29 2003-02-25 Intel Corporation High performance via capacitor and method for manufacturing same
US6621012B2 (en) * 2001-02-01 2003-09-16 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board
US6976238B1 (en) * 2001-06-03 2005-12-13 Cadence Design Systems, Inc. Circular vias and interconnect-line ends
US7334326B1 (en) * 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
JP2003332749A (ja) * 2002-01-11 2003-11-21 Denso Corp 受動素子内蔵基板、その製造方法及び受動素子内蔵基板形成用素板
US7052328B2 (en) 2002-11-27 2006-05-30 Panduit Corp. Electronic connector and method of performing electronic connection
US6908809B1 (en) 2004-04-02 2005-06-21 Harris Corporation Embedded capacitors using conductor filled vias
US20060213686A1 (en) * 2004-12-28 2006-09-28 Shin-Hsien Wu Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors
US20060162844A1 (en) * 2005-01-26 2006-07-27 Needes Christopher R Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof
US7349196B2 (en) * 2005-06-17 2008-03-25 Industrial Technology Research Institute Composite distributed dielectric structure
US8169014B2 (en) 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
WO2007095533A1 (en) * 2006-02-13 2007-08-23 Panduit Corp. Connector with crosstalk compensation
US7656236B2 (en) 2007-05-15 2010-02-02 Teledyne Wireless, Llc Noise canceling technique for frequency synthesizer
DE102007026880A1 (de) * 2007-06-08 2008-11-20 Siemens Ag Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
KR101124277B1 (ko) * 2007-07-26 2012-03-27 가부시키가이샤 무라타 세이사쿠쇼 다층 세라믹 기판 및 그 제조 방법
DE102007051316B4 (de) * 2007-10-26 2010-12-02 Continental Automotive Gmbh Schaltungsträger mit hoher Bauteildichte
US8179045B2 (en) 2008-04-22 2012-05-15 Teledyne Wireless, Llc Slow wave structure having offset projections comprised of a metal-dielectric composite stack
US8405135B2 (en) 2010-10-05 2013-03-26 International Business Machines Corporation 3D via capacitor with a floating conductive plate for improved reliability
JP6282388B2 (ja) * 2011-10-24 2018-02-21 デクセリアルズ株式会社 静電容量素子、及び共振回路
US9202660B2 (en) 2013-03-13 2015-12-01 Teledyne Wireless, Llc Asymmetrical slow wave structures to eliminate backward wave oscillations in wideband traveling wave tubes
US10014843B2 (en) * 2013-08-08 2018-07-03 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Multilayer electronic structures with embedded filters
US9852941B2 (en) 2014-10-03 2017-12-26 Analog Devices, Inc. Stacked conductor structure and methods for manufacture of same
US9496326B1 (en) 2015-10-16 2016-11-15 International Business Machines Corporation High-density integrated circuit via capacitor
TWI656815B (zh) * 2016-06-21 2019-04-11 中華精測科技股份有限公司 具有過孔電容結構的電路板及其製造方法
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Also Published As

Publication number Publication date
EP0491542B1 (en) 1995-03-22
DK0491542T3 (da) 1995-06-06
DE69108365T2 (de) 1995-10-05
JPH04299889A (ja) 1992-10-23
KR950010022B1 (ko) 1995-09-04
CA2056740A1 (en) 1992-06-18
JP2874120B2 (ja) 1999-03-24
KR920013500A (ko) 1992-07-29
EP0491542A1 (en) 1992-06-24
DE69108365D1 (de) 1995-04-27
US5055966A (en) 1991-10-08
MX9102574A (es) 1992-06-01
CA2056740C (en) 1996-09-03

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