ES2104023T3 - Procedimiento de fabricacion de placa de cableado impreso multicapa. - Google Patents

Procedimiento de fabricacion de placa de cableado impreso multicapa.

Info

Publication number
ES2104023T3
ES2104023T3 ES93118943T ES93118943T ES2104023T3 ES 2104023 T3 ES2104023 T3 ES 2104023T3 ES 93118943 T ES93118943 T ES 93118943T ES 93118943 T ES93118943 T ES 93118943T ES 2104023 T3 ES2104023 T3 ES 2104023T3
Authority
ES
Spain
Prior art keywords
printed wiring
multilayer printed
manufacturing procedure
wiring plate
conductive layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93118943T
Other languages
English (en)
Inventor
Kazuo Yamashita
Eiki Takahashi
Osamu Teshigawara
Masaki Kinoshita
Takeshi Eimura
Takao Ohiwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Original Assignee
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63332013A external-priority patent/JPH0614598B2/ja
Priority claimed from JP1077480A external-priority patent/JPH0736471B2/ja
Priority claimed from JP1149972A external-priority patent/JPH0671144B2/ja
Priority claimed from JP1194928A external-priority patent/JPH0360096A/ja
Priority claimed from JP1237478A external-priority patent/JPH071830B2/ja
Application filed by Japan Radio Co Ltd filed Critical Japan Radio Co Ltd
Application granted granted Critical
Publication of ES2104023T3 publication Critical patent/ES2104023T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

UN METODO PARA FABRICAR UN TABLERO DE CABLEADO IMPRESO DE VARIAS CAPAS COMPRENDE: FIJAR LOS MIEMBROS CONDUCTORES SOBRE CAPAS CONDUCTORAS; SUPERPONER VARIOS TABLEROS DE CABLEADO IMPRESO Y; CONECTAR ELECTRICAMENTE LAS CAPAS CONDUCTORAS UNA A OTRA MEDIANTE LOS MIEMBROS CONDUCTORES. SE INCLUYE A SU VEZ, UN AISLAMIENTO UNITARIO ENTRE LAS CAPAS CONDUCTORAS.
ES93118943T 1988-12-29 1989-12-28 Procedimiento de fabricacion de placa de cableado impreso multicapa. Expired - Lifetime ES2104023T3 (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP63332013A JPH0614598B2 (ja) 1988-12-29 1988-12-29 多層プリント基板の製造方法
JP1077480A JPH0736471B2 (ja) 1989-03-29 1989-03-29 多層基板の接合方法
JP1149972A JPH0671144B2 (ja) 1989-06-13 1989-06-13 多層高密度実装モジュール
JP1194928A JPH0360096A (ja) 1989-07-27 1989-07-27 多層プリント配線基板の製造方法
JP1237478A JPH071830B2 (ja) 1989-09-13 1989-09-13 多層プリント配線基板の接続方法

Publications (1)

Publication Number Publication Date
ES2104023T3 true ES2104023T3 (es) 1997-10-01

Family

ID=27524672

Family Applications (3)

Application Number Title Priority Date Filing Date
ES93118943T Expired - Lifetime ES2104023T3 (es) 1988-12-29 1989-12-28 Procedimiento de fabricacion de placa de cableado impreso multicapa.
ES93118917T Expired - Lifetime ES2085098T3 (es) 1988-12-29 1989-12-28 Procedimiento de fabricacion de un circuito impreso multicapa.
ES89124088T Expired - Lifetime ES2069570T3 (es) 1988-12-29 1989-12-28 Procedimiento de fabricacion de una placa de conexionado impreso de multiples capas.

Family Applications After (2)

Application Number Title Priority Date Filing Date
ES93118917T Expired - Lifetime ES2085098T3 (es) 1988-12-29 1989-12-28 Procedimiento de fabricacion de un circuito impreso multicapa.
ES89124088T Expired - Lifetime ES2069570T3 (es) 1988-12-29 1989-12-28 Procedimiento de fabricacion de una placa de conexionado impreso de multiples capas.

Country Status (6)

Country Link
US (1) US5031308A (es)
EP (3) EP0607532B1 (es)
KR (1) KR940009175B1 (es)
CA (1) CA2006776C (es)
DE (3) DE68921732T2 (es)
ES (3) ES2104023T3 (es)

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IT1203535B (it) * 1986-02-10 1989-02-15 Marelli Autronica Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento
JPH07112041B2 (ja) * 1986-12-03 1995-11-29 シャープ株式会社 半導体装置の製造方法
US4763403A (en) * 1986-12-16 1988-08-16 Eastman Kodak Company Method of making an electronic component
US4788766A (en) * 1987-05-20 1988-12-06 Loral Corporation Method of fabricating a multilayer circuit board assembly

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Publication number Publication date
ES2069570T3 (es) 1995-05-16
DE68926055T2 (de) 1996-10-24
US5031308A (en) 1991-07-16
EP0607532A3 (en) 1994-09-28
DE68928150T2 (de) 1997-11-27
EP0607532A2 (en) 1994-07-27
EP0607532B1 (en) 1996-03-20
DE68921732D1 (de) 1995-04-20
EP0607534A2 (en) 1994-07-27
DE68926055D1 (de) 1996-04-25
ES2085098T3 (es) 1996-05-16
KR900011360A (ko) 1990-07-11
CA2006776A1 (en) 1990-06-29
DE68921732T2 (de) 1995-07-13
DE68928150D1 (de) 1997-08-07
EP0607534B1 (en) 1997-07-02
KR940009175B1 (ko) 1994-10-01
EP0379736B1 (en) 1995-03-15
EP0379736A1 (en) 1990-08-01
CA2006776C (en) 1995-01-17
EP0607534A3 (en) 1994-09-28

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