ES2087604T3 - Tarjeta que comprende al menos un elemento electronico, y procedimiento de fabricacion de tal tarjeta. - Google Patents
Tarjeta que comprende al menos un elemento electronico, y procedimiento de fabricacion de tal tarjeta.Info
- Publication number
- ES2087604T3 ES2087604T3 ES93107491T ES93107491T ES2087604T3 ES 2087604 T3 ES2087604 T3 ES 2087604T3 ES 93107491 T ES93107491 T ES 93107491T ES 93107491 T ES93107491 T ES 93107491T ES 2087604 T3 ES2087604 T3 ES 2087604T3
- Authority
- ES
- Spain
- Prior art keywords
- card
- electronic element
- procedure
- manufacture
- concerns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Coils Or Transformers For Communication (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
Abstract
UN OBJETO DE LA INVENCION CONCIERNE A UNA TARJETA QUE COMPRENDE UN ELEMENTO ELECTRONICO (2) Y UNA BOBINA (42) EN LA CUAL LOS EXTREMOS ESTAN UNIDOS DIRECTAMENTE AL ELEMENTO ELECTRONICO, ESTE ULTIMO Y LA BOBINA ESTAN ENVUELTOS EN UN LIGANTE (10). OTRO OBJETO DE LA INVENCION CONCIERNE A UNA TARJETA QUE COMPRENDE UN ELEMENTO ELECTRONICO (2) ENVUELTO EN UN LIGANTE (10) Y UNA ESTRUCTURA DE POSICIONAMIENTO (46) DEL ELEMENTO ELECTRONICO, ESTA ESTRUCTURA ESTA SITUADA EN UNA CAPA (38) FORMADA POR EL LIGANTE. LA PRESENTE INVENCION CONCIERNE TAMBIEN UN PROCESO DE FABRICACION DE TARJETAS SEGUN LA INVENCINON.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9206169 | 1992-05-19 | ||
| FR9206169A FR2691563B1 (fr) | 1992-05-19 | 1992-05-19 | Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2087604T3 true ES2087604T3 (es) | 1996-07-16 |
| ES2087604T5 ES2087604T5 (es) | 2005-04-01 |
Family
ID=9430009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES93107491T Expired - Lifetime ES2087604T5 (es) | 1992-05-19 | 1993-05-08 | Tarjeta que comprende al menos un elemento electronico, y procedimiento de fabricacion de tal tarjeta. |
Country Status (15)
| Country | Link |
|---|---|
| US (2) | US5399847A (es) |
| EP (1) | EP0570784B2 (es) |
| JP (1) | JP3326568B2 (es) |
| KR (1) | KR100301315B1 (es) |
| AT (1) | ATE135479T1 (es) |
| AU (1) | AU673667B2 (es) |
| CA (1) | CA2095594C (es) |
| DE (1) | DE69301760T3 (es) |
| DK (1) | DK0570784T4 (es) |
| ES (1) | ES2087604T5 (es) |
| FI (1) | FI102222B1 (es) |
| FR (1) | FR2691563B1 (es) |
| HK (1) | HK1007015A1 (es) |
| MY (1) | MY109784A (es) |
| NO (1) | NO308274B1 (es) |
Families Citing this family (129)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158031B2 (en) * | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
| HK1007815A1 (en) * | 1993-03-18 | 1999-04-23 | Nagraid S.A. | Method for producing a card with at least one electronic component, and card thereby obtained |
| FR2716555B1 (fr) * | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
| DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
| US5451763A (en) * | 1994-07-05 | 1995-09-19 | Alto Corporation | Personal medical IC card and read/write unit |
| US5837992A (en) * | 1994-07-15 | 1998-11-17 | Shinko Nameplate Co., Ltd. | Memory card and its manufacturing method |
| JP2829494B2 (ja) * | 1994-07-15 | 1998-11-25 | 新光ネームプレート株式会社 | メモリカード及びその製造方法 |
| DE4425736C2 (de) * | 1994-07-21 | 1997-12-18 | Micro Sensys Gmbh | Einbauschale für Daten- oder Codeträger |
| FR2723228B1 (fr) * | 1994-07-26 | 1996-09-20 | Bourgogne Grasset | Jeton de jeu perfectionne |
| FR2724477B1 (fr) * | 1994-09-13 | 1997-01-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
| DE4437721A1 (de) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Kontaktloses elektronisches Modul |
| DE4437844C2 (de) * | 1994-10-22 | 2001-03-08 | Cubit Electronics Gmbh | Kontaktloser Datenträger und Verfahren zu seiner Herstellung |
| FR2727542B1 (fr) * | 1994-11-25 | 1997-01-03 | Droz Francois | Carte incorporant au moins un element electronique |
| FR2727541B1 (fr) * | 1994-11-25 | 1997-01-17 | Droz Francois | Carte incorporant au moins une bobine |
| FR2730576B1 (fr) * | 1995-02-15 | 1997-04-04 | Gemplus Card Int | Procede de fabrication de cartes electroniques et cartes obtenues par un tel procede |
| DE19521111C2 (de) * | 1995-06-09 | 1997-12-18 | Wendisch Karl Heinz | Ausweis-Chipkarte mit Antennenwicklungsinlet |
| JP4015717B2 (ja) * | 1995-06-29 | 2007-11-28 | 日立マクセル株式会社 | 情報担体の製造方法 |
| DE19529640A1 (de) * | 1995-08-11 | 1997-02-13 | Giesecke & Devrient Gmbh | Spulenelement für einen Datenträger mit integriertem Schaltkreis und nichtberührender Kopplung |
| FR2739587B1 (fr) * | 1995-10-09 | 1997-11-07 | Bourgogne Grasset | Jeton de jeu |
| DE19538233A1 (de) * | 1995-10-13 | 1997-04-17 | Siemens Ag | Trägerelement zum Einbau in eine Chipkarte |
| US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
| WO1997021118A1 (en) * | 1995-12-05 | 1997-06-12 | Michel Bisson | Contactless electronic transponder with printed loop antenna circuit |
| WO1997042598A1 (en) * | 1996-05-09 | 1997-11-13 | Atmel Corporation | Smart card formed with two joined sheets |
| US6027027A (en) * | 1996-05-31 | 2000-02-22 | Lucent Technologies Inc. | Luggage tag assembly |
| DE19630947C2 (de) * | 1996-07-31 | 2000-08-24 | Ods Landis & Gyr Gmbh & Co Kg | Kontaktlose Chipkarte |
| JPH10193849A (ja) * | 1996-12-27 | 1998-07-28 | Rohm Co Ltd | 回路チップ搭載カードおよび回路チップモジュール |
| JPH10203066A (ja) * | 1997-01-28 | 1998-08-04 | Hitachi Ltd | 非接触icカード |
| FR2760113B1 (fr) | 1997-02-24 | 1999-06-04 | Gemplus Card Int | Procede de fabrication de carte sans contact a antenne bobinee |
| FR2760331B1 (fr) * | 1997-03-10 | 1999-04-30 | Bourgogne Grasset | Jeton a puce electronique |
| ATE235847T1 (de) * | 1997-03-10 | 2003-04-15 | Bourgogne Grasset | Marke mit elektronischen chip |
| US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
| JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
| US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
| US6025054A (en) * | 1997-09-08 | 2000-02-15 | Cardxx, Inc. | Smart cards having glue-positioned electronic components |
| AT408384B (de) * | 1998-01-30 | 2001-11-26 | Skidata Ag | Datenträger in kartenform |
| US6208019B1 (en) * | 1998-03-13 | 2001-03-27 | Kabushiki Kaisha Toshiba | Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein |
| US6256873B1 (en) | 1998-03-17 | 2001-07-10 | Cardxx, Inc. | Method for making smart cards using isotropic thermoset adhesive materials |
| US6175124B1 (en) * | 1998-06-30 | 2001-01-16 | Lsi Logic Corporation | Method and apparatus for a wafer level system |
| DE19843425A1 (de) * | 1998-09-22 | 2000-03-23 | Kunz Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
| US6630370B2 (en) * | 1998-10-02 | 2003-10-07 | Shinko Electric Industries Co., Ltd. | Process for manufacturing IC card |
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| FR2805067B1 (fr) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | Jeton a puce electronique et procedes de fabrication d'un tel jeton |
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-
1992
- 1992-05-19 FR FR9206169A patent/FR2691563B1/fr not_active Expired - Lifetime
-
1993
- 1993-05-05 CA CA002095594A patent/CA2095594C/en not_active Expired - Lifetime
- 1993-05-06 KR KR1019930007725A patent/KR100301315B1/ko not_active Expired - Lifetime
- 1993-05-08 AT AT93107491T patent/ATE135479T1/de active
- 1993-05-08 DK DK93107491T patent/DK0570784T4/da active
- 1993-05-08 EP EP93107491A patent/EP0570784B2/fr not_active Expired - Lifetime
- 1993-05-08 DE DE69301760T patent/DE69301760T3/de not_active Expired - Lifetime
- 1993-05-08 ES ES93107491T patent/ES2087604T5/es not_active Expired - Lifetime
- 1993-05-11 MY MYPI93000869A patent/MY109784A/en unknown
- 1993-05-12 US US08/059,664 patent/US5399847A/en not_active Expired - Lifetime
- 1993-05-18 AU AU38606/93A patent/AU673667B2/en not_active Expired
- 1993-05-18 NO NO931788A patent/NO308274B1/no not_active IP Right Cessation
- 1993-05-18 FI FI932257A patent/FI102222B1/fi not_active IP Right Cessation
- 1993-05-19 JP JP13924093A patent/JP3326568B2/ja not_active Expired - Lifetime
-
1994
- 1994-11-02 US US08/333,349 patent/US5741392A/en not_active Expired - Lifetime
-
1998
- 1998-06-23 HK HK98106232A patent/HK1007015A1/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DK0570784T3 (da) | 1996-07-22 |
| DE69301760D1 (de) | 1996-04-18 |
| CA2095594C (en) | 2007-03-13 |
| FR2691563A1 (fr) | 1993-11-26 |
| NO308274B1 (no) | 2000-08-21 |
| DE69301760T2 (de) | 1996-09-26 |
| MY109784A (en) | 1997-06-30 |
| DK0570784T4 (da) | 2005-01-10 |
| NO931788L (no) | 1993-11-22 |
| ES2087604T5 (es) | 2005-04-01 |
| HK1007015A1 (en) | 1999-03-26 |
| CA2095594A1 (en) | 1993-11-20 |
| FI102222B (fi) | 1998-10-30 |
| NO931788D0 (no) | 1993-05-18 |
| AU673667B2 (en) | 1996-11-21 |
| KR940006062A (ko) | 1994-03-23 |
| EP0570784A1 (fr) | 1993-11-24 |
| FI932257L (fi) | 1993-11-20 |
| US5741392A (en) | 1998-04-21 |
| DE69301760T3 (de) | 2006-03-30 |
| EP0570784B2 (fr) | 2004-09-01 |
| JPH0652374A (ja) | 1994-02-25 |
| AU3860693A (en) | 1993-11-25 |
| FI932257A0 (fi) | 1993-05-18 |
| FI102222B1 (fi) | 1998-10-30 |
| US5399847A (en) | 1995-03-21 |
| FR2691563B1 (fr) | 1996-05-31 |
| KR100301315B1 (ko) | 2001-10-22 |
| ATE135479T1 (de) | 1996-03-15 |
| EP0570784B1 (fr) | 1996-03-13 |
| JP3326568B2 (ja) | 2002-09-24 |
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