ES2104778T3 - Procedimiento para soldar y montar placas de circuitos impresos con componentes. - Google Patents

Procedimiento para soldar y montar placas de circuitos impresos con componentes.

Info

Publication number
ES2104778T3
ES2104778T3 ES92113750T ES92113750T ES2104778T3 ES 2104778 T3 ES2104778 T3 ES 2104778T3 ES 92113750 T ES92113750 T ES 92113750T ES 92113750 T ES92113750 T ES 92113750T ES 2104778 T3 ES2104778 T3 ES 2104778T3
Authority
ES
Spain
Prior art keywords
welding
printed circuit
circuit boards
procedure
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92113750T
Other languages
English (en)
Inventor
Werner Dipl-Physiker Maiwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Application granted granted Critical
Publication of ES2104778T3 publication Critical patent/ES2104778T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

SOBRE UNA PLACA DE CIRCUITO IMPRESO SE APLICAN DEPOSITOS DE SOLDADURA SOBRE ZONAS TERMINALES A SOLDAR QUE DESPUES SE FUNDEN CONVIRTIENDOSE EN CAPAS DE SOLDADURA. SE PROPONE UNIR A CONTINUACION LOS ELEMENTOS CONSTRUCTIVOS (5) CON AYUDA DE UN ADHESIVO (6) CON LA PLACA DEL CIRCUITO IMPRESO (1), EL CUAL SE APLICA ENTRE LAS ZONAS TERMINALES A SOLDAR (2) ASIGNADAS A CADA UNO DE LOS ELEMENTOS CONSTRUCTIVOS (5), A CONTINUACION SE APLICA UN FUNDENTE Y FINALMENTE SE REALIZA EL PROCESO DE SOLDADURA. EL PROCESO HACE POSIBLE PUNTOS DE SOLDADURA SEGUROS TAMBIEN CON EQUIPADO CON PLACAS DE CIRCUITO IMPRESO POR AMBAS CARAS Y EL EMPLEO DE UN FUNDENTE LS, POR LO CUAL SE PUEDE PRESCINDIR DE UN PROCESO DE LAVADO.
ES92113750T 1991-08-14 1992-08-12 Procedimiento para soldar y montar placas de circuitos impresos con componentes. Expired - Lifetime ES2104778T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4126913A DE4126913A1 (de) 1991-08-14 1991-08-14 Verfahren zum beloten und montieren von leiterplatten mit bauelementen

Publications (1)

Publication Number Publication Date
ES2104778T3 true ES2104778T3 (es) 1997-10-16

Family

ID=6438306

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92113750T Expired - Lifetime ES2104778T3 (es) 1991-08-14 1992-08-12 Procedimiento para soldar y montar placas de circuitos impresos con componentes.

Country Status (4)

Country Link
US (1) US5271548A (es)
EP (1) EP0528350B1 (es)
DE (2) DE4126913A1 (es)
ES (1) ES2104778T3 (es)

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GB2268628B (en) * 1992-07-07 1995-10-11 Northern Telecom Ltd Affixing dielectric resonator on p.c.b.
US5852397A (en) 1992-07-09 1998-12-22 Raychem Corporation Electrical devices
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
DE4410739A1 (de) * 1994-03-28 1995-10-05 Bosch Gmbh Robert Verfahren zum elektrisch leitfähigen Verbinden von Kontakten
DE69504333T2 (de) 1994-05-16 1999-05-12 Raychem Corp., Menlo Park, Calif. Elektrisches bauteil mit einem ptc-widerstandselement
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US5499756A (en) * 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
DE19509786A1 (de) * 1995-03-17 1996-09-19 Herbert Streckfus Gmbh Verfahren zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
ATE224634T1 (de) 1996-03-18 2002-10-15 Krone Gmbh Leiterplatte und verfahren zum lagegegenauen bestücken und löten von elektronischen bauelementen auf der oberfläche der leiterplatte
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
FR2781974B1 (fr) * 1998-07-30 2000-08-25 Air Liquide Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
US6276593B1 (en) * 1999-07-12 2001-08-21 Agere Systems Guardian Corp. Apparatus and method for solder attachment of high powered transistors to base heatsink
US6798191B1 (en) 1999-08-09 2004-09-28 Power Measurement Ltd. Revenue meter with a graphic user interface being operative to display scalable objects
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6854176B2 (en) 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
DE10201209B4 (de) * 2002-01-14 2005-12-01 Endress + Hauser Gmbh + Co. Kg Lotformteil und Verfahren zur Bestückung desselben
US7830022B2 (en) * 2007-10-22 2010-11-09 Infineon Technologies Ag Semiconductor package
CA2708014C (en) 2007-12-07 2012-05-22 Allen-Vanguard Technologies Inc. Apparatus and method for measuring and recording data from violent events
US8717007B2 (en) * 2008-10-10 2014-05-06 Electro Industries/Gauge Tech Intelligent electronic device having a terminal assembly for coupling to a meter mounting socket
JP5533199B2 (ja) * 2010-04-28 2014-06-25 ソニー株式会社 素子の基板実装方法、および、その基板実装構造
US9897461B2 (en) 2015-02-27 2018-02-20 Electro Industries/Gauge Tech Intelligent electronic device with expandable functionality
US11009922B2 (en) 2015-02-27 2021-05-18 Electro Industries/Gaugetech Wireless intelligent electronic device
US10048088B2 (en) 2015-02-27 2018-08-14 Electro Industries/Gauge Tech Wireless intelligent electronic device
JP6858688B2 (ja) 2017-10-24 2021-04-14 三菱電機株式会社 半導体装置
US20190206821A1 (en) * 2017-12-29 2019-07-04 Intel Corporation Substrate assembly with spacer element
FR3090264B1 (fr) * 2018-12-13 2022-01-07 St Microelectronics Grenoble 2 Procédé de montage de composant
DE102021131099A1 (de) * 2021-11-26 2023-06-01 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device
JPS55115344A (en) * 1979-02-28 1980-09-05 Hitachi Ltd Method of forming projected electrode
US4738732A (en) * 1987-02-04 1988-04-19 Hughes Aircraft Co. Self cleaning liquid solder flux
US4752027A (en) * 1987-02-20 1988-06-21 Hewlett-Packard Company Method and apparatus for solder bumping of printed circuit boards
JPH01100993A (ja) * 1987-10-14 1989-04-19 Oki Electric Ind Co Ltd 混成集積回路の製造方法
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
WO1989006584A1 (fr) * 1988-01-12 1989-07-27 Kerner Rudolf A Procede de fabrication de composants electroniques au moyen d'un fluide de brasage tendre a base d'acide carboxylique
DE3810653C1 (es) * 1988-03-29 1989-05-18 Dieter Dr.-Ing. Friedrich
US4821948A (en) * 1988-04-06 1989-04-18 American Telephone And Telegraph Company Method and apparatus for applying flux to a substrate
JPH02113596A (ja) * 1988-10-21 1990-04-25 Nec Corp プリント回路基板
JPH02251196A (ja) * 1989-03-24 1990-10-08 Matsushita Electric Ind Co Ltd マウント方法
JPH03255650A (ja) * 1990-03-05 1991-11-14 Ngk Spark Plug Co Ltd Ｉｃパッケージ
US5145531A (en) * 1990-10-31 1992-09-08 Hughes Aircraft Company Fluxing apparatus and method

Also Published As

Publication number Publication date
DE4126913A1 (de) 1993-02-18
US5271548A (en) 1993-12-21
EP0528350B1 (de) 1997-07-02
DE59208656D1 (de) 1997-08-07
EP0528350A1 (de) 1993-02-24

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