ES2106194T3 - Metodo de fabricacion de perlas de soldadura y perlas de soldadura formadas mediante el mismo. - Google Patents

Metodo de fabricacion de perlas de soldadura y perlas de soldadura formadas mediante el mismo.

Info

Publication number
ES2106194T3
ES2106194T3 ES92919808T ES92919808T ES2106194T3 ES 2106194 T3 ES2106194 T3 ES 2106194T3 ES 92919808 T ES92919808 T ES 92919808T ES 92919808 T ES92919808 T ES 92919808T ES 2106194 T3 ES2106194 T3 ES 2106194T3
Authority
ES
Spain
Prior art keywords
welding
contact terminal
combination
pearls
intermetallic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92919808T
Other languages
English (en)
Inventor
Edward K Yung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MCNC
Original Assignee
MCNC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MCNC filed Critical MCNC
Application granted granted Critical
Publication of ES2106194T3 publication Critical patent/ES2106194T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01255—Changing the shapes of bumps by using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01257—Changing the shapes of bumps by reflowing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01261—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01951—Changing the shapes of bond pads
    • H10W72/01953—Changing the shapes of bond pads by etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Ceramic Products (AREA)
  • Arc Welding In General (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

LA BASE DE LAS COMBAS DE SOLDADURA SE PRESERVA CONVIERTIENDO EL METAL DE DEBAJO DE LA COMBADURA ENTRE LA COMBADURA DE SOLDADURA Y EL TERMINAL DE CONTACTO EN UN MATERIAL INTERMETALICO ENTRE LA SOLDADURA Y EL COMPONENTE SOLDABLE DEL METAL DE DEBAJO DE LA COMBADURA ANTES DE EFECTUAR EL ATAQUE QUIMICO A LA PARTE METALICO DE DEBAJO DE LA SOLDADURA. EL MATERIAL INTERMETALICO ES RESISTENTE A LOS AGENTES DE ATAQUE QUIMICO QUE SE UTILIZAN PARA ATACAR QUIMICAMENTE EL METAL DE DEBAJO DE LA SOLDADURA ENTRE LOS TERMINALES DE CONTACTO. DE ESTA FORMA, SE PRODUCE UN RECORTE MINIMO DE LAS COMBADURAS DE LA SOLDADURA, Y SE PRESERVA SU TAMAÑO. LA SOLDADURA PUEDE ELECTRODEPOSITARSE SOBRE EL MATERIAL METALICO DE DEBAJO DE LA COMBADURA POR ENCIMA DEL TERMINAL DE CONTACTO A TRAVES DE UNA CAPA DE DAMA DE SOLDADURA CONFORMADA QUE TENGA UNA REGION DE ACUMULACION DE SOLDADURA SOBRE LA MISMA. LA DAMA DE SOLDADURA ES PREFERIBLEMENTE UNA CAPA DE PELICULA FINA QUE PUEDE ALINEARSE EXACTAMENTE CON EL TERMINAL DE CONTACTO INFERIOR PARA CONFINAR LA MOJADURA DE LA SOLDADURA FUNDIDA DURANTE EL REFLUJO. DE ESTA FORMA PUEDE REDUCIRSE EL DESALINEAMIENTO ENTRE LA COMBADURA DE SOLDADURA Y EL TERMINAL DE CONTACTO. LAS COMBADURAS DE SOLDADURA ASI FORMADAS INCLUYEN UNA CAPA DE MATERIAL INTERMETALICO QUE SE EXTIENDE MAS ALLA DE LA COMBADURA PARA FORMAR UN LABIO ALREDEDOR DE LA BASE DE LA COMBADURA. EL LABIO SUMINISTRA UNA PROTECCION EXTRA PARA LA COMBADURA DE SOLDADURA.
ES92919808T 1991-09-13 1992-09-11 Metodo de fabricacion de perlas de soldadura y perlas de soldadura formadas mediante el mismo. Expired - Lifetime ES2106194T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/759,450 US5162257A (en) 1991-09-13 1991-09-13 Solder bump fabrication method

Publications (1)

Publication Number Publication Date
ES2106194T3 true ES2106194T3 (es) 1997-11-01

Family

ID=25055684

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92919808T Expired - Lifetime ES2106194T3 (es) 1991-09-13 1992-09-11 Metodo de fabricacion de perlas de soldadura y perlas de soldadura formadas mediante el mismo.

Country Status (10)

Country Link
US (2) US5162257A (es)
EP (1) EP0603296B1 (es)
JP (1) JP2842692B2 (es)
KR (1) KR0186061B1 (es)
AT (1) ATE156935T1 (es)
CA (1) CA2116766C (es)
DE (1) DE69221627T2 (es)
ES (1) ES2106194T3 (es)
TW (1) TW200417B (es)
WO (1) WO1993006620A1 (es)

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EP0603296B1 (en) 1997-08-13
TW200417B (es) 1993-02-21
DE69221627T2 (de) 1998-01-08
WO1993006620A1 (en) 1993-04-01
JP2842692B2 (ja) 1999-01-06
EP0603296A1 (en) 1994-06-29
JPH07502147A (ja) 1995-03-02
US5162257A (en) 1992-11-10
DE69221627D1 (de) 1997-09-18
CA2116766A1 (en) 1993-04-01
ATE156935T1 (de) 1997-08-15
KR0186061B1 (ko) 1999-04-15
KR940702644A (ko) 1994-08-20
US5293006A (en) 1994-03-08
CA2116766C (en) 1999-02-16

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