ES2128392T3 - Procedimiento de soldadura. - Google Patents

Procedimiento de soldadura.

Info

Publication number
ES2128392T3
ES2128392T3 ES93303157T ES93303157T ES2128392T3 ES 2128392 T3 ES2128392 T3 ES 2128392T3 ES 93303157 T ES93303157 T ES 93303157T ES 93303157 T ES93303157 T ES 93303157T ES 2128392 T3 ES2128392 T3 ES 2128392T3
Authority
ES
Spain
Prior art keywords
tin
welding
solder
gold
welding process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93303157T
Other languages
English (en)
Inventor
Mindaugas Fernand Dautartas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
AT&T Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Inc filed Critical AT&T Inc
Application granted granted Critical
Publication of ES2128392T3 publication Critical patent/ES2128392T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

SE PRESENTA UNA SOLDADURA DE ORO-ESTAÑO RICA EN ESTAÑO QUE ES PARTICULARMENTE VENTAJOSA PARA APLICACIONES DE AUTOALINEAMIENTO. CUANDO SE UTILIZA CON ZONAS DE UNION GALVANIZADAS CON ORO, LA DIFUSION DEL ESTAÑO DE LA SOLDADURA DURANTE EL CALENTAMIENTO FUNCIONA PARA DESPLAZAR LA COMPOSICION DE LA SOLDADURA RESTANTE MAS CERCA DEL VALOR EUTECTICO, PRESERVANDO DE ESTA FORMA EL ESTADO LIQUIDO DE LA SOLDADURA Y MEJORANDO SU CALIDAD DE REFLUJO CON RESPECTO A LA SOLDADURAS EUTECTICAS CONVENCIONALES.
ES93303157T 1992-05-01 1993-04-22 Procedimiento de soldadura. Expired - Lifetime ES2128392T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US87733592A 1992-05-01 1992-05-01

Publications (1)

Publication Number Publication Date
ES2128392T3 true ES2128392T3 (es) 1999-05-16

Family

ID=25369769

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93303157T Expired - Lifetime ES2128392T3 (es) 1992-05-01 1993-04-22 Procedimiento de soldadura.

Country Status (5)

Country Link
EP (1) EP0569166B1 (es)
KR (1) KR970009004B1 (es)
DE (1) DE69322994T2 (es)
ES (1) ES2128392T3 (es)
SG (1) SG46211A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6682608B2 (en) 1990-12-18 2004-01-27 Advanced Cardiovascular Systems, Inc. Superelastic guiding member
US6165292A (en) 1990-12-18 2000-12-26 Advanced Cardiovascular Systems, Inc. Superelastic guiding member
US5341818A (en) 1992-12-22 1994-08-30 Advanced Cardiovascular Systems, Inc. Guidewire with superelastic distal portion
WO1995019800A2 (en) * 1992-12-22 1995-07-27 Advanced Cardiovascular Systems, Inc. Guidewire with superelastic distal portion
DE19607104C1 (de) * 1996-02-24 1997-03-06 Degussa Verwendung einer Gold-Zinnlegierung als Dentallrot
JP2001517505A (ja) 1997-09-23 2001-10-09 ユナイテッド ステイツ サージカル コーポレーション 放射線治療のためのソースワイヤ
US6602272B2 (en) 2000-11-02 2003-08-05 Advanced Cardiovascular Systems, Inc. Devices configured from heat shaped, strain hardened nickel-titanium
US7976648B1 (en) 2000-11-02 2011-07-12 Abbott Cardiovascular Systems Inc. Heat treatment for cold worked nitinol to impart a shape setting capability without eventually developing stress-induced martensite
US6855161B2 (en) 2000-12-27 2005-02-15 Advanced Cardiovascular Systems, Inc. Radiopaque nitinol alloys for medical devices
US7942892B2 (en) 2003-05-01 2011-05-17 Abbott Cardiovascular Systems Inc. Radiopaque nitinol embolic protection frame
JP4285753B2 (ja) 2004-06-21 2009-06-24 田中貴金属工業株式会社 ハーメチックシールカバー及びその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1167162B (de) * 1961-05-16 1964-04-02 Siemens Ag Lot zum Verloeten von Teilen, von denen eines Gold enthaelt, und Verfahren zum Loeten mit diesem Lot
FR1320523A (fr) * 1962-04-24 1963-03-08 Du Pont Composition de soudure à l'or
US3660632A (en) * 1970-06-17 1972-05-02 Us Navy Method for bonding silicon chips to a cold substrate
US4214904A (en) * 1978-12-12 1980-07-29 The United States Of America As Represented By The Secretary Of The Air Force Gold-tin-silicon alloy for brazing silicon to metal
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements
US4875617A (en) * 1987-01-20 1989-10-24 Citowsky Elya L Gold-tin eutectic lead bonding method and structure

Also Published As

Publication number Publication date
SG46211A1 (en) 1998-02-20
KR930023107A (ko) 1993-12-18
DE69322994D1 (de) 1999-02-25
KR970009004B1 (ko) 1997-06-03
EP0569166A1 (en) 1993-11-10
DE69322994T2 (de) 1999-08-05
EP0569166B1 (en) 1999-01-13

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