ES2171274T3 - Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada. - Google Patents

Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada.

Info

Publication number
ES2171274T3
ES2171274T3 ES97942853T ES97942853T ES2171274T3 ES 2171274 T3 ES2171274 T3 ES 2171274T3 ES 97942853 T ES97942853 T ES 97942853T ES 97942853 T ES97942853 T ES 97942853T ES 2171274 T3 ES2171274 T3 ES 2171274T3
Authority
ES
Spain
Prior art keywords
chip card
contact
chip
card module
procedure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97942853T
Other languages
English (en)
Inventor
Detlef Houdeau
Robert Wilm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
PAV Card GmbH
Original Assignee
Infineon Technologies AG
PAV Card GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, PAV Card GmbH filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of ES2171274T3 publication Critical patent/ES2171274T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

LA INVENCION ESTA RELACIONADA CON UN MODULO DE TARJETAS DE CHIP (1), QUE COMPRENDE UN SOPORTE (2) CON UN PRIMER PLANO DE CONTACTO (3) Y UN CHIP SEMICONDUCTOR (4), ASI COMO CONEXIONES CONDUCTIVAS ELECTRICAMENTE (5) ENTRE EL CHIP SEMICONDUCTOR Y EL PRIMER PLANO DE CONTACTO. ADEMAS DEL PRIMER PLANO DE CONTACTO, EL MODULO DE TARJETAS DE CHIP PRESENTA EN LA OTRA CARA DEL SOPORTE (2), OTRO PLANO DE CONEXION (6), QUE SE CONECTA ELECTRICAMENTE CON EL CHIP SEMICONDUCTOR (4). EL OTRO PLANO DE CONEXION (6) PUEDE SERVIR, POR EJEMPLO, PARA EL CONTACTO DE UNA BOBINA DE INDUCCION INTEGRADA EN UN CUERPO DE TARJETA PARA LA TRANSMISION DE DATOS SIN CONTACTO. POR OTRA PARTE, LA INVENCION ESTA RELACIONADA CON UNA TARJETA COMBINADA PARA LA TRANSMISION DE DATOS CON O SIN CONTACTO, QUE COMPRENDE EL MODULO DE TARJETAS DE CHIP (1) SEGUN LA INVENCION, ASI COMO UN PROCEDIMIENTO PARA LA FABRICACION DEL MODULO DE TARJETAS DE CHIP Y DE LA TARJETA COMBINADA.
ES97942853T 1996-08-14 1997-08-12 Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada. Expired - Lifetime ES2171274T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19632813A DE19632813C2 (de) 1996-08-14 1996-08-14 Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte

Publications (1)

Publication Number Publication Date
ES2171274T3 true ES2171274T3 (es) 2002-09-01

Family

ID=7802649

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97942853T Expired - Lifetime ES2171274T3 (es) 1996-08-14 1997-08-12 Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada.

Country Status (13)

Country Link
US (1) US6095423A (es)
EP (1) EP0919041B1 (es)
JP (1) JP3262804B2 (es)
KR (1) KR100358578B1 (es)
CN (1) CN1143381C (es)
AT (1) ATE209800T1 (es)
BR (1) BR9711161A (es)
DE (2) DE19632813C2 (es)
ES (1) ES2171274T3 (es)
IN (1) IN191477B (es)
RU (1) RU2161331C2 (es)
UA (1) UA52673C2 (es)
WO (1) WO1998007115A1 (es)

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US10977539B1 (en) 2019-12-20 2021-04-13 Capital One Services, Llc Systems and methods for use of capacitive member to prevent chip fraud
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Also Published As

Publication number Publication date
WO1998007115A1 (de) 1998-02-19
DE19632813C2 (de) 2000-11-02
ATE209800T1 (de) 2001-12-15
BR9711161A (pt) 2000-01-11
CN1233334A (zh) 1999-10-27
CN1143381C (zh) 2004-03-24
RU2161331C2 (ru) 2000-12-27
IN191477B (es) 2003-12-06
EP0919041A1 (de) 1999-06-02
JP2000501535A (ja) 2000-02-08
KR20000029989A (ko) 2000-05-25
DE19632813A1 (de) 1998-02-19
KR100358578B1 (ko) 2002-10-25
UA52673C2 (uk) 2003-01-15
DE59705575D1 (de) 2002-01-10
US6095423A (en) 2000-08-01
JP3262804B2 (ja) 2002-03-04
EP0919041B1 (de) 2001-11-28

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