ES2304987T3 - Metodo y aparato para separar materiales no metalicos. - Google Patents

Metodo y aparato para separar materiales no metalicos. Download PDF

Info

Publication number
ES2304987T3
ES2304987T3 ES00980670T ES00980670T ES2304987T3 ES 2304987 T3 ES2304987 T3 ES 2304987T3 ES 00980670 T ES00980670 T ES 00980670T ES 00980670 T ES00980670 T ES 00980670T ES 2304987 T3 ES2304987 T3 ES 2304987T3
Authority
ES
Spain
Prior art keywords
substrate
laser
nozzle
laser beam
quenching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00980670T
Other languages
English (en)
Spanish (es)
Inventor
Brian Hoekstra
Roger Flannigan
David Wegerif
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Photonics Inc
Original Assignee
Applied Photonics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Photonics Inc filed Critical Applied Photonics Inc
Application granted granted Critical
Publication of ES2304987T3 publication Critical patent/ES2304987T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1423—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow-control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)
  • ing And Chemical Polishing (AREA)
ES00980670T 1999-11-24 2000-11-22 Metodo y aparato para separar materiales no metalicos. Expired - Lifetime ES2304987T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16728599P 1999-11-24 1999-11-24
US167285P 1999-11-24
PCT/US2000/032076 WO2001038039A1 (en) 1999-11-24 2000-11-22 Method and apparatus for separating non-metallic materials

Publications (1)

Publication Number Publication Date
ES2304987T3 true ES2304987T3 (es) 2008-11-01

Family

ID=22606723

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00980670T Expired - Lifetime ES2304987T3 (es) 1999-11-24 2000-11-22 Metodo y aparato para separar materiales no metalicos.

Country Status (11)

Country Link
US (2) US6489588B1 (de)
EP (1) EP1232038B1 (de)
JP (1) JP3895179B2 (de)
KR (1) KR100721391B1 (de)
CN (1) CN1413136A (de)
AT (1) ATE392984T1 (de)
AU (1) AU1790001A (de)
DE (1) DE60038692T2 (de)
ES (1) ES2304987T3 (de)
TR (1) TR200201402T2 (de)
WO (1) WO2001038039A1 (de)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19963939B4 (de) * 1999-12-31 2004-11-04 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
DE10041519C1 (de) * 2000-08-24 2001-11-22 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
US20020170318A1 (en) * 2001-04-02 2002-11-21 Andreas Gartner Brief summary of the invention
KR100676249B1 (ko) * 2001-05-23 2007-01-30 삼성전자주식회사 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치
KR100700997B1 (ko) * 2001-06-21 2007-03-28 삼성전자주식회사 기판 다중 절단 방법 및 이를 수행하기 위한 기판 다중절단 장치
US6864460B2 (en) * 2001-07-02 2005-03-08 Virtek Laser Systems, Inc. Method of ablating an opening in a hard, non-metallic substrate
TW542763B (en) * 2001-07-16 2003-07-21 Mitsuboshi Diamond Ind Co Ltd Scribing device for fragile material substrate
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
AU2003211763A1 (en) 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method for dicing substrate
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
WO2003076119A1 (fr) 2002-03-12 2003-09-18 Hamamatsu Photonics K.K. Procede de decoupe d'objet traite
US6919531B2 (en) * 2002-03-25 2005-07-19 Agilent Technologies, Inc. Methods for producing glass substrates for use in biopolymeric microarrays
FR2839508B1 (fr) * 2002-05-07 2005-03-04 Saint Gobain Vitrage decoupe sans rompage
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
EP1579970A4 (de) * 2002-11-06 2006-09-20 Mitsuboshi Diamond Ind Co Ltd Vorrichtung zur herstellung einer ritzlinie und verfahren zurherstellung einer ritzlinie
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
US20070164072A1 (en) * 2003-01-29 2007-07-19 Yoshitaka Nishio Substrate dividing apparatus and method for dividing substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
AU2003220847A1 (en) 2003-03-12 2004-09-30 Hamamatsu Photonics K.K. Laser beam machining method
DE10330179A1 (de) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Trennen flacher Werkstücke aus Keramik
ES2523432T3 (es) * 2003-07-18 2014-11-25 Hamamatsu Photonics K.K. Chip semiconductor cortado
US20050029240A1 (en) * 2003-08-07 2005-02-10 Translume, Inc. Dual light source machining method and system
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
WO2005054142A1 (ja) * 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
JP4598407B2 (ja) 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) * 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
KR20050100734A (ko) * 2004-04-14 2005-10-20 주식회사 탑 엔지니어링 비금속재 절단방법
KR20050100733A (ko) * 2004-04-14 2005-10-20 주식회사 탑 엔지니어링 비금속재 절단장치
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
WO2006002168A1 (en) * 2004-06-21 2006-01-05 Applied Photonics, Inc. Device, system and method for cutting, cleaving or separating a substrate material
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
US20090078370A1 (en) * 2004-08-31 2009-03-26 Vladislav Sklyarevich Method of separating non-metallic material using microwave radiation
WO2006062017A1 (ja) * 2004-12-08 2006-06-15 Laser Solutions Co., Ltd. 被分割体における分割起点形成方法、被分割体の分割方法、およびパルスレーザー光による被加工物の加工方法
WO2006083902A1 (en) * 2005-02-02 2006-08-10 Cardinal Ig Company Edge treatment for glass panes
JPWO2006129504A1 (ja) * 2005-06-03 2008-12-25 旭硝子株式会社 合わせガラスの切断方法および装置
DE102005027800A1 (de) * 2005-06-13 2006-12-14 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum mehrfachen Trennen eines flachen Werkstückes aus einem spröden Material mittels Laser
KR100978259B1 (ko) * 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
JP4815444B2 (ja) * 2005-08-12 2011-11-16 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
KR101081613B1 (ko) * 2005-09-13 2011-11-09 가부시키가이샤 레미 취성재료의 할단방법 및 장치
TW200724276A (en) * 2005-12-26 2007-07-01 Foxsemicon Integrated Tech Inc Laser cutting apparatus
DE102006012582B4 (de) * 2006-03-16 2010-01-21 Schott Ag Vorrichtung und Verfahren zum Abtrennen von Abschnitten von Glasstangen
US20090050661A1 (en) * 2006-03-24 2009-02-26 Youn-Ho Na Glass Cutting Apparatus With Bending Member and Method Using Thereof
JP4977391B2 (ja) * 2006-03-27 2012-07-18 日本電気株式会社 レーザ切断方法、表示装置の製造方法、および表示装置
TWI298280B (en) * 2006-09-06 2008-07-01 Nat Applied Res Laboratories Method for cutting non-metal material
JP4869002B2 (ja) * 2006-09-26 2012-02-01 株式会社東芝 セラミックス基板の製造方法およびセラミックス回路基板の製造方法
JP2008183599A (ja) * 2007-01-31 2008-08-14 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
DK2131994T3 (da) * 2007-02-28 2013-12-02 Ceramtec Gmbh Fremgangsmåde til fremstilling af en komponent under anvendelse af en asymmetrisk energitilførsel langs skillelinien eller den tilsigtede brudlinie
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
US8011207B2 (en) * 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
US8035901B2 (en) * 2008-04-30 2011-10-11 Corning Incorporated Laser scoring with curved trajectory
US8895892B2 (en) * 2008-10-23 2014-11-25 Corning Incorporated Non-contact glass shearing device and method for scribing or cutting a moving glass sheet
US20110300692A1 (en) * 2008-10-29 2011-12-08 Oerlikon Solar Ag, Trubbach Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
DE102008058310B3 (de) * 2008-11-18 2010-06-17 Jenoptik Automatisierungstechnik Gmbh Vorrichtung zum Randentschichten beschichteter Substrate und Trennen in einzelne Module
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
WO2010108061A2 (en) 2009-03-20 2010-09-23 Corning Incorporated Precision laser scoring
TWI517922B (zh) * 2009-05-13 2016-01-21 康寧公司 切割脆性材料之方法
DE102009023602B4 (de) * 2009-06-02 2012-08-16 Grenzebach Maschinenbau Gmbh Vorrichtung zum industriellen Herstellen elastisch verformbarer großflächiger Glasplatten in hoher Stückzahl
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
JP2013505890A (ja) * 2009-09-29 2013-02-21 ピコドリル エスアー 基板を切断する方法及び切断のための装置
US8171753B2 (en) * 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
EP2507182B1 (de) 2009-11-30 2014-03-05 Corning Incorporated Verfahren zum schneiden und teilen von glasubstraten mittels laservorrichtung
US8946590B2 (en) * 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US8887529B2 (en) 2010-10-29 2014-11-18 Corning Incorporated Method and apparatus for cutting glass ribbon
US8461480B2 (en) 2010-11-30 2013-06-11 Electro Scientific Industries, Inc. Orthogonal integrated cleaving device
KR101800224B1 (ko) * 2011-06-08 2017-11-22 니폰 덴키 가라스 가부시키가이샤 판형상 유리의 절단방법 및 그 절단장치
US9090383B2 (en) 2011-12-01 2015-07-28 Sealstrip Corporation Tape sealed reclosable bag
US20130193617A1 (en) * 2012-02-01 2013-08-01 Electro Scientific Industries, Inc. Systems and methods for separating non-metallic materials
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
CN102749746B (zh) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 液晶基板切割装置及液晶基板切割方法
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US10017411B2 (en) 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
US9533813B1 (en) * 2015-09-27 2017-01-03 Sealstrip Corporation Re-closable, tamper-resistant, stand-up package
CN107520541B (zh) * 2016-06-20 2020-05-15 南京魔迪多维数码科技有限公司 激光切割脆性材料的方法
JP7134182B2 (ja) 2017-03-22 2022-09-09 コーニング インコーポレイテッド ガラスウェブを分割する方法
CN106938884B (zh) * 2017-04-19 2019-04-26 重庆坤秀门窗有限公司 一种用于玻璃门切割的玻璃切割机
FR3066488B1 (fr) * 2017-05-19 2022-03-04 Saint Gobain Procede de rompage d'une feuille de verre
JP7184455B2 (ja) * 2018-06-27 2022-12-06 株式会社ディスコ ウェーハの加工方法
TW202035321A (zh) * 2019-01-29 2020-10-01 美商康寧公司 用於撓性薄玻璃的自由形式切割的方法及設備
US11517983B2 (en) * 2019-08-23 2022-12-06 II John Tyson Methods, system and devices for panel marking and formability measurements, including autonomous methods and devices
WO2021107168A1 (ko) * 2019-11-26 2021-06-03 이석준 레이저 절단 장치 및 방법

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1720883A (en) 1926-11-27 1929-07-16 Bessie L Gregg Apparatus for severing glass or the like
NL299821A (de) 1962-10-31 1900-01-01
DE1244346B (de) 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
US3597578A (en) 1967-03-16 1971-08-03 Nat Res Dev Thermal cutting apparatus and method
US3629545A (en) 1967-12-19 1971-12-21 Western Electric Co Laser substrate parting
GB1246481A (en) 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3589883A (en) 1968-05-28 1971-06-29 Ppg Industries Inc Method and apparatus for thermally fracturing a ribbon of glass
US3604890A (en) 1969-10-15 1971-09-14 Boeing Co Multibeam laser-jet cutting apparatus
US3610871A (en) 1970-02-19 1971-10-05 Western Electric Co Initiation of a controlled fracture
US3695497A (en) 1970-08-26 1972-10-03 Ppg Industries Inc Method of severing glass
US3790362A (en) 1970-09-15 1974-02-05 Ppg Industries Inc Directional control for thermal severing of glass
US3800991A (en) 1972-04-10 1974-04-02 Ppg Industries Inc Method of and an apparatus for cutting glass
US3795502A (en) 1972-05-26 1974-03-05 Ppg Industries Inc Method of cutting glass
AT342232B (de) 1972-10-12 1978-03-28 Glaverbel Verfahren und vorrichtung zum trennen eines korpers aus einem glasartigen oder vitrokristallinen material
US4045201A (en) 1976-07-09 1977-08-30 American Atomics Corporation Method and apparatus for subdividing a gas filled glass tube
DE2813302C2 (de) 1978-03-28 1979-09-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V., 8000 Muenchen Verfahren und Vorrichtung zum geradlinigen Schneiden von Flachglas mit Hilfe von thermisch induzierten Spannungen
US4467168A (en) 1981-04-01 1984-08-21 Creative Glassworks International Method of cutting glass with a laser and an article made therewith
JPS5987996A (ja) 1982-11-10 1984-05-21 Ishikawajima Harima Heavy Ind Co Ltd レ−ザ・ガス切断装置
US4546231A (en) 1983-11-14 1985-10-08 Group Ii Manufacturing Ltd. Creation of a parting zone in a crystal structure
JPS6046892A (ja) 1984-07-19 1985-03-13 Toshiba Corp レ−ザ−光照射方法
SU1231813A1 (ru) 1984-10-02 1991-04-23 Организация П/Я Р-6007 Установка дл резки листовых материалов, преимущественно стекл нных пластин
JPS61229487A (ja) 1985-04-03 1986-10-13 Sasaki Glass Kk レ−ザビ−ムによるガラス切断方法
SU1430931A1 (ru) 1985-11-04 1988-10-15 Институт Машиноведения Им.А.А.Благонравова Сканатор дл лазерных технологических установок
JPS6453794A (en) 1987-08-20 1989-03-01 Sumitomo Electric Industries Optical lens for large output laser
EP0329787A4 (en) 1987-08-28 1990-09-05 Tsentralnoe Konstruktorskoe Bjuro Unikalnogo Priborostroenia Akademii Nauk Ssr Method and device for laser processing of an object
JPS6462294A (en) 1987-09-01 1989-03-08 Sumitomo Electric Industries Laser beam machining method
JPH0767633B2 (ja) 1987-11-30 1995-07-26 三菱重工業株式会社 同軸多焦点式レーザビーム集光装置
JP2615093B2 (ja) 1987-11-30 1997-05-28 三菱重工業株式会社 異軸多焦点式レーザビーム集光装置
JPH01306088A (ja) 1988-06-01 1989-12-11 Nippei Toyama Corp 可変ビームレーザ加工装置
JP2724192B2 (ja) 1989-02-17 1998-03-09 株式会社アマダ フィルムコーティング材のレーザ加工方法
JPH02263590A (ja) 1989-04-04 1990-10-26 Matsushita Electric Ind Co Ltd レーザ加工機
JPH02295688A (ja) 1989-05-01 1990-12-06 Amada Co Ltd フィルムコーティング材のレーザ加工方法およびその方法に用いるレーザ加工ヘッド
DE69008927T2 (de) 1989-05-08 1994-12-01 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
DE69013047T2 (de) 1989-05-08 1995-04-13 Philips Nv Verfahren zum Spalten einer Platte aus sprödem Werkstoff.
EP0407969B1 (de) 1989-07-14 1993-10-06 MAHO Aktiengesellschaft Verfahren und Vorrichtung zum Herstellen von Hohlräumen in Werkstücken mittels Laserstrahls
JP2712723B2 (ja) 1990-03-07 1998-02-16 松下電器産業株式会社 レーザ切断方法
US5132505A (en) 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
DE4016199A1 (de) 1990-05-19 1991-11-21 Linde Ag Verfahren und vorrichtung zum laserstrahlschneiden
JPH04118190A (ja) 1990-09-07 1992-04-20 Nagasaki Pref Gov ウェハの割断方法
JPH0639572A (ja) 1991-01-11 1994-02-15 Souei Tsusho Kk ウェハ割断装置
US5223692A (en) 1991-09-23 1993-06-29 General Electric Company Method and apparatus for laser trepanning
WO1993009909A1 (de) 1991-11-19 1993-05-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum abtragen von werkstoff von relativbewegten metallenen werkstücken
DE4215561C2 (de) 1991-11-19 1995-04-06 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Abtragen von Werkstoff eines relativbewegten metallenen Werkstücks
RU2024441C1 (ru) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5463200A (en) 1993-02-11 1995-10-31 Lumonics Inc. Marking of a workpiece by light energy
US5359176A (en) 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
US5571429A (en) 1994-02-25 1996-11-05 Litel Instruments Apparatus and process for high speed laminate processing with computer generated holograms
US5622540A (en) 1994-09-19 1997-04-22 Corning Incorporated Method for breaking a glass sheet
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
US5871134A (en) 1994-12-27 1999-02-16 Asahi Glass Company Ltd. Method and apparatus for breaking and cutting a glass ribbon
US5742026A (en) 1995-06-26 1998-04-21 Corning Incorporated Processes for polishing glass and glass-ceramic surfaces using excimer laser radiation
JPH0929472A (ja) * 1995-07-14 1997-02-04 Hitachi Ltd 割断方法、割断装置及びチップ材料
JP3923526B2 (ja) * 1995-08-31 2007-06-06 コーニング インコーポレイテッド 壊れやすい材料の分断方法および装置
DE19609199A1 (de) 1996-03-09 1997-09-11 Vetter & Co Apotheker Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens
JPH1099978A (ja) 1996-09-27 1998-04-21 Hitachi Ltd レーザー加工装置
MY120533A (en) 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP3498895B2 (ja) * 1997-09-25 2004-02-23 シャープ株式会社 基板の切断方法および表示パネルの製造方法
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe

Also Published As

Publication number Publication date
AU1790001A (en) 2001-06-04
US20030024909A1 (en) 2003-02-06
CN1413136A (zh) 2003-04-23
EP1232038A1 (de) 2002-08-21
KR100721391B1 (ko) 2007-05-23
KR20020071866A (ko) 2002-09-13
ATE392984T1 (de) 2008-05-15
WO2001038039A9 (en) 2002-11-07
EP1232038B1 (de) 2008-04-23
WO2001038039A1 (en) 2001-05-31
TR200201402T2 (tr) 2003-03-21
JP2003534132A (ja) 2003-11-18
US6489588B1 (en) 2002-12-03
DE60038692D1 (de) 2008-06-05
JP3895179B2 (ja) 2007-03-22
DE60038692T2 (de) 2009-07-02
US6660963B2 (en) 2003-12-09

Similar Documents

Publication Publication Date Title
US6489588B1 (en) Method and apparatus for separating non-metallic materials
ES2774377T3 (es) Procedimiento y dispositivo de mecanización basada en láser de sustratos cristalinos planos, especialmente sustratos semiconductores
CN100468125C (zh) 光束均化器和激光辐照装置以及半导体器件制造方法
JP7190631B2 (ja) マルチビームフェムト秒レーザによって材料を切断する方法及び器具
CN101001729B (zh) 基板的垂直裂纹形成方法及垂直裂纹形成装置
KR101329477B1 (ko) 단일 방사 빔으로 취성 재료를 스코어링 및 분리하는 방법 및 장치
TW460422B (en) Method and apparatus for cutting through a flat workpiece made of brittle material along a predetermined cutting line
KR20200049800A (ko) 어포컬 빔 조정 조립체를 사용하여 투명 가공물을 레이저 가공하는 장치 및 방법
KR101453587B1 (ko) 이동 유리 리본을 스코어링하기 위한 장치, 시스템, 및 방법
JP5352696B2 (ja) 平面ガラスシートの製造方法およびガラス基板の分割方法
ES2529201T3 (es) Método de corte de un sustrato con una formación a lo largo de una línea de puntos modificados por superposición en el interior del sustrato
US20070284785A1 (en) Device, System and Method for Cutting, Cleaving or Separating a Substrate Material
ES2848543T3 (es) Un procedimiento de procesamiento por láser de un material metálico con control de la posición del eje óptico del láser en relación con un flujo de gas auxiliar, y una máquina y un programa informático para la implementación de dicho procedimiento
US9085048B2 (en) Apparatus and method for generating separating fissures in a substrate
EP1874702A2 (de) Verfahren und vorrichtung zur ritzung eines spröden materials mit einer beweglichen optischen anordnung
JP4615231B2 (ja) スクライブ装置およびこの装置を用いたスクライブ方法
ES2921237T3 (es) Dispositivo de granallado por láser y procedimientos de granallado por láser
JP5081086B2 (ja) 平面ガラスシートの製造方法およびガラス基板の分割方法
US20240335909A1 (en) Method of and apparatus for cutting a substrate or preparing a substrate for cleaving
KR20050026253A (ko) 직립형 유리판절단장치
CN114101902B (zh) 光学系统以及包括其的激光照射装置
KR200415435Y1 (ko) 직립형 lcd 기판용 유리판절단장치
KR20070031404A (ko) 기판 재료를 절단, 벽개 또는 분리하는 장치, 시스템 및방법
JP2007304196A (ja) 光学素子及びこれを用いたピント調節装置、ピント調節方法、レーザアニール装置、レーザアニール方法
WO2007026722A1 (ja) 投影マスク、レーザ加工方法、レーザ加工装置および薄膜トランジスタ素子