ES324264A1 - Procedure for the manufacture in series of elements of electrical construction, especially of microelements of construction semiconductors in boxes of plastic material. (Machine-translation by Google Translate, not legally binding) - Google Patents

Procedure for the manufacture in series of elements of electrical construction, especially of microelements of construction semiconductors in boxes of plastic material. (Machine-translation by Google Translate, not legally binding)

Info

Publication number
ES324264A1
ES324264A1 ES0324264A ES324264A ES324264A1 ES 324264 A1 ES324264 A1 ES 324264A1 ES 0324264 A ES0324264 A ES 0324264A ES 324264 A ES324264 A ES 324264A ES 324264 A1 ES324264 A1 ES 324264A1
Authority
ES
Spain
Prior art keywords
electrodes
construction
carrier body
manufactured
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0324264A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Publication of ES324264A1 publication Critical patent/ES324264A1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Process for the series production of electrical construction elements, especially semiconductor micro-elements in plastic boxes, in which a carrier body, suitable as a conveyor belt during different work phases, is used for the semiconductor arrangements, which they are composed of contact material and serve as electrical supply conductors, in which, in addition to the quantity of the external electrodes of the construction elements to be manufactured, electrodes are provided, which are missing, in certain geometric coordination with respect to the body carrier, which are attached to the carrier body, at periodic distances, in which after the semiconductor arrangements, are applied by alloy on the carrier body at distances, whose magnitude is determined by the dimensions of the construction element to be manufactured, and contact wires of the semic layout The electrodes are joined with the electrodes, after which the semiconductor arrangements and the bonding sites between the contact and electrode wires are wrapped with a solid, low melting melting coating mass at the operating temperature of the electrode. construction element to be manufactured, and in which in addition the carrier body and the electrodes are correspondingly divided, characterized in that the marginal strip of the carrier body constituted as a conveyor belt, located opposite the construction element applied by alloy with the applied electrodes , it is wrapped with a casting lining mass of low melting point, solid at the operating temperature of the construction element to be manufactured and because the marginal strip coated by cast iron, is constituted in such a way that it finds use, both as a strip of measurement, as well as transport lath. (Machine-translation by Google Translate, not legally binding)
ES0324264A 1965-03-18 1966-03-16 Procedure for the manufacture in series of elements of electrical construction, especially of microelements of construction semiconductors in boxes of plastic material. (Machine-translation by Google Translate, not legally binding) Expired ES324264A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0096025 1965-03-18

Publications (1)

Publication Number Publication Date
ES324264A1 true ES324264A1 (en) 1967-02-01

Family

ID=7519772

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0324264A Expired ES324264A1 (en) 1965-03-18 1966-03-16 Procedure for the manufacture in series of elements of electrical construction, especially of microelements of construction semiconductors in boxes of plastic material. (Machine-translation by Google Translate, not legally binding)

Country Status (7)

Country Link
BE (1) BE678041A (en)
DE (1) DE1514418A1 (en)
ES (1) ES324264A1 (en)
FR (1) FR1473478A (en)
GB (1) GB1115105A (en)
NL (1) NL6601942A (en)
SE (1) SE318950B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535526B1 (en) * 1982-10-29 1986-03-28 Radiotechnique Compelec METHOD OF ENCAPSULATION OF ELECTRONIC COMPONENTS BY EXTRUSION OF PLASTIC MATERIAL AND APPLICATIONS TO THE MANUFACTURE OF LIGHT INDICATORS AND TO THE ENCAPSULATION OF ELECTRONIC CIRCUITS
FR2549291B2 (en) * 1982-10-29 1986-05-09 Radiotechnique Compelec METHOD OF ENCAPSULATION OF ELECTRONIC COMPONENTS BY EXTRUSION OF PLASTIC MATERIAL AND APPLICATIONS TO THE MANUFACTURE OF LIGHT INDICATORS AND TO THE ENCAPSULATION OF ELECTRONIC CIRCUITS
US10542978B2 (en) 2011-05-27 2020-01-28 Covidien Lp Method of internally potting or sealing a handheld medical device

Also Published As

Publication number Publication date
SE318950B (en) 1969-12-22
BE678041A (en) 1966-09-19
FR1473478A (en) 1967-03-17
DE1514418A1 (en) 1969-06-26
NL6601942A (en) 1966-09-19
GB1115105A (en) 1968-05-29

Similar Documents

Publication Publication Date Title
CH464302A (en) Carrier material for metallically conductive metal layers
AT314662B (en) Power supply arrangement for at least two direct current consumers
ES406434A1 (en) A SEMICONDUCTOR DEVICE.
ES324264A1 (en) Procedure for the manufacture in series of elements of electrical construction, especially of microelements of construction semiconductors in boxes of plastic material. (Machine-translation by Google Translate, not legally binding)
SE7603784L (en) DEVICE FOR CONTACTING ELECTRICAL COMPONENTS FOR CASTING IN THE WORKPIECE
ATA117374A (en) PLANT FOR TINNING WIRES, IN PARTICULAR ELECTRICAL CIRCUIT WIRES
JPS5651851A (en) Semiconductor device
SE442750B (en) CONTACT MATERIAL IN POWDER FORM TO MAKE ELECTRICAL CONTACTS
FR2281827A1 (en) FLAT OR FLAT INSULATION MATERIAL FOR ELECTRICAL COMPONENTS
NL7606781A (en) SEMI-GUIDE DEVICE.
ES437033A1 (en) Space-charge-limited integrated circuit structure
JPS5751928B2 (en)
JPS5412263A (en) Semiconductor element and production of the same
SE7604827L (en) PROCEDURE FOR MANUFACTURING A SEMICONDUCTOR AND SEMICONDUCTORS MANUFACTURING ACCORDING TO THIS PROCEDURE
ES397216A1 (en) A method for obtaining an electrically semiconductor laminar material to form a screen layer on the electric cables. (Machine-translation by Google Translate, not legally binding)
JPS5261963A (en) Leadframe for semiconductor device
JPS5269537A (en) Semiconductor memory
JPS5311816B2 (en)
JPS5240972A (en) Packaging construction of semiconductor device
ES374600A1 (en) IMPROVEMENTS IN THE CONSTRUCTION OF METALLIC OXIDE SEMICONDUCTOR DEVICES.
ES402719A1 (en) Flipchip mounted transistor
JPS5295176A (en) Manufacture of semiconductor apparatus
JPS51138163A (en) Production method of semiconductor device
CH525488A (en) Device for the determination of the specific electrical resistance of granulates
JPS51137378A (en) Semi conductor wafer