ES324264A1 - Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. - Google Patents

Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.

Info

Publication number
ES324264A1
ES324264A1 ES0324264A ES324264A ES324264A1 ES 324264 A1 ES324264 A1 ES 324264A1 ES 0324264 A ES0324264 A ES 0324264A ES 324264 A ES324264 A ES 324264A ES 324264 A1 ES324264 A1 ES 324264A1
Authority
ES
Spain
Prior art keywords
electrodes
construction
carrier body
manufactured
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0324264A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Publication of ES324264A1 publication Critical patent/ES324264A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
ES0324264A 1965-03-18 1966-03-16 Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. Expired ES324264A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0096025 1965-03-18

Publications (1)

Publication Number Publication Date
ES324264A1 true ES324264A1 (es) 1967-02-01

Family

ID=7519772

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0324264A Expired ES324264A1 (es) 1965-03-18 1966-03-16 Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.

Country Status (7)

Country Link
BE (1) BE678041A (es)
DE (1) DE1514418A1 (es)
ES (1) ES324264A1 (es)
FR (1) FR1473478A (es)
GB (1) GB1115105A (es)
NL (1) NL6601942A (es)
SE (1) SE318950B (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2535526B1 (fr) * 1982-10-29 1986-03-28 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
FR2549291B2 (fr) * 1982-10-29 1986-05-09 Radiotechnique Compelec Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques
US10542978B2 (en) * 2011-05-27 2020-01-28 Covidien Lp Method of internally potting or sealing a handheld medical device

Also Published As

Publication number Publication date
GB1115105A (en) 1968-05-29
NL6601942A (es) 1966-09-19
SE318950B (es) 1969-12-22
BE678041A (es) 1966-09-19
FR1473478A (fr) 1967-03-17
DE1514418A1 (de) 1969-06-26

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