|
GB8622998D0
(en)
*
|
1986-09-24 |
1986-10-29 |
Ciba Geigy Ag |
Curable compositions
|
|
EP0289632A1
(en)
*
|
1987-05-04 |
1988-11-09 |
American Cyanamid Company |
High green strength induction curable adhesives
|
|
JPH0811791B2
(ja)
*
|
1987-07-27 |
1996-02-07 |
神鋼鋼線工業株式会社 |
プレストレストコンクリート緊張材用塗布材料
|
|
US4777084A
(en)
*
|
1987-10-08 |
1988-10-11 |
Minnesota Mining And Manufacturing Company |
Phenolic-modified epoxy adhesive including the reaction product of bisphenol A and the monoglycidyl ether of bisphenol A
|
|
US5194307A
(en)
*
|
1988-02-08 |
1993-03-16 |
Martin Processing, Inc. |
High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism
|
|
US5888654A
(en)
*
|
1988-02-08 |
1999-03-30 |
Courtaulds Performance Films |
High performance epoxy based laminating adhesive
|
|
ATE123502T1
(de)
*
|
1988-07-09 |
1995-06-15 |
Ciba Geigy Ag |
Härtbare epoxydharzzusammensetzungen.
|
|
US4874833A
(en)
*
|
1988-08-22 |
1989-10-17 |
Shell Oil Company |
Composition containing epoxy resin and alkyl hindered polyaromatic diamine and monoaromatic amine curing agents
|
|
GB8824391D0
(en)
*
|
1988-10-18 |
1988-11-23 |
Ciba Geigy Ag |
Compositions
|
|
US5618606A
(en)
*
|
1989-09-18 |
1997-04-08 |
Rockwell International Corporation |
Process for bonding staged composites with a cobonded staged adhesive and article
|
|
US5593770A
(en)
*
|
1989-10-25 |
1997-01-14 |
Thiokol Corporation |
Chemorheologically tailored matrix resin formulations containing anhydride curing agents
|
|
US5545278A
(en)
*
|
1989-10-25 |
1996-08-13 |
Thiokol Corporation |
Method for increasing fiber strength translation in composition pressure vessels using matrix resin formulations containing anhydride curing agents and surface-active agents
|
|
DE68916253T2
(de)
*
|
1989-11-30 |
1994-11-24 |
Courtaulds Performance Films |
Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff.
|
|
US5248331A
(en)
*
|
1990-01-11 |
1993-09-28 |
Lilly Industries, Inc. |
Mirror back coating
|
|
US5252402A
(en)
*
|
1990-01-11 |
1993-10-12 |
Lilly Industries, Inc. |
Mirrorback coating
|
|
US5212263A
(en)
*
|
1991-01-10 |
1993-05-18 |
Morton International, Inc. |
Textured epoxy powder coating
|
|
IT1261171B
(it)
*
|
1992-03-03 |
1996-05-09 |
Ruetgerswerke Ag |
Miscuglio resinoso a basso contenuto di prodotti di scissione.
|
|
GB9310031D0
(en)
*
|
1993-05-15 |
1993-06-30 |
G B Tools Components Export |
Manufacture of bonded articles
|
|
US6255367B1
(en)
|
1995-03-07 |
2001-07-03 |
Landec Corporation |
Polymeric modifying agents
|
|
US6831116B2
(en)
*
|
1995-03-07 |
2004-12-14 |
Landec Corporation |
Polymeric modifying agents
|
|
KR100189282B1
(ko)
*
|
1995-07-19 |
1999-06-01 |
완다 케이. 덴슨-로우 |
실온에서 안정한, 일성분계 가요성 에폭시 접착제
|
|
US6295599B1
(en)
*
|
1995-08-16 |
2001-09-25 |
Microunity Systems Engineering |
System and method for providing a wide operand architecture
|
|
EP0888394B1
(en)
*
|
1996-03-22 |
2001-07-25 |
Vantico AG |
One-component epoxy resin tooling material
|
|
US5795927A
(en)
*
|
1996-05-17 |
1998-08-18 |
Morton International, Inc. |
Color stable wrinkle finish epoxy powder coating
|
|
US5688878A
(en)
*
|
1996-05-17 |
1997-11-18 |
Morton International, Inc. |
Epoxy powder coating with wrinkle finish
|
|
US6056846A
(en)
*
|
1996-07-25 |
2000-05-02 |
Mcdonnell Douglas Helicopter Co. |
Bonded composite structure and its fabrication
|
|
US5932288A
(en)
*
|
1997-12-18 |
1999-08-03 |
Morton International, Inc. |
Wrinkle epoxy powder coating with acid and its homolog methylenedisalicylic
|
|
US6492462B2
(en)
|
1998-01-16 |
2002-12-10 |
Landec Corporation |
Side chain crystalline polymer as rheology modifier for crosslinked polymer
|
|
JPH11256043A
(ja)
|
1998-01-16 |
1999-09-21 |
Landec Corp |
架橋性樹脂のための低収縮剤
|
|
US6060540A
(en)
*
|
1998-02-13 |
2000-05-09 |
Landec Corporation |
Modeling pastes
|
|
JPH11279376A
(ja)
*
|
1998-03-27 |
1999-10-12 |
Hitachi Chem Co Ltd |
印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
|
|
US20020162618A1
(en)
*
|
2001-05-04 |
2002-11-07 |
David Landa |
Process for making adhesive bonded sintered plates
|
|
US20060204777A1
(en)
*
|
2001-05-04 |
2006-09-14 |
Alto Products Corp. |
Process for making adhesive bonded sintered plates
|
|
US7217771B2
(en)
|
2001-07-31 |
2007-05-15 |
Huntsman Advanced Materials Americas Inc. |
Epoxy resin
|
|
JP2003082318A
(ja)
*
|
2001-09-13 |
2003-03-19 |
Three M Innovative Properties Co |
カチオン重合性接着剤組成物及び異方導電性接着剤組成物
|
|
ATE346877T1
(de)
*
|
2003-04-16 |
2006-12-15 |
Huntsman Adv Mat Switzerland |
Härtungsbeschleuniger für epoxyharzzusammensetzungen härtend bei niedriger temperatur
|
|
EP2843022B1
(en)
|
2003-07-07 |
2020-12-16 |
Dow Global Technologies LLC |
Adhesive epoxy composition and process for applying it
|
|
US7557169B2
(en)
|
2003-07-07 |
2009-07-07 |
Dow Global Technologies, Inc. |
Capping isocyanate prepolymer or polyisocyanate/polyether polyol or polyamine mixture
|
|
US7192991B2
(en)
*
|
2003-11-26 |
2007-03-20 |
3M Innovative Properties Company |
Cationically curable composition
|
|
ES2276182T5
(es)
*
|
2004-03-12 |
2015-04-10 |
Dow Global Technologies Llc |
Composición adhesiva epoxídica
|
|
EP1602702B2
(en)
*
|
2004-06-01 |
2020-09-16 |
Dow Global Technologies LLC |
Epoxy adhesive composition
|
|
US7649060B2
(en)
|
2005-12-02 |
2010-01-19 |
Henkel Corporation |
Curable compositions
|
|
US8029889B1
(en)
|
2004-12-03 |
2011-10-04 |
Henkel Corporation |
Prepregs, towpregs and preforms
|
|
EP1695990A1
(en)
|
2005-02-28 |
2006-08-30 |
Dow Global Technologies Inc. |
Two-component epoxy adhesive composition
|
|
DE602005020260D1
(de)
*
|
2005-06-02 |
2010-05-12 |
Dow Global Technologies Inc |
Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
|
|
JP4890872B2
(ja)
*
|
2006-01-30 |
2012-03-07 |
ルネサスエレクトロニクス株式会社 |
光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
|
|
US7537827B1
(en)
|
2006-12-13 |
2009-05-26 |
Henkel Corporation |
Prepreg laminates
|
|
ATE486899T1
(de)
*
|
2006-12-21 |
2010-11-15 |
Dow Global Technologies Inc |
Zusammensetzung, die zur verwendung als klebstoff beim einbau von fahrzeugfenstern brauchbar ist
|
|
KR101467609B1
(ko)
|
2007-06-20 |
2014-12-02 |
다우 글로벌 테크놀로지스 엘엘씨 |
온도 변화에 대한 민감도가 매우 낮은 충돌 내구성 에폭시 접착제
|
|
WO2009015149A1
(en)
*
|
2007-07-23 |
2009-01-29 |
Dow Global Technologies Inc. |
Two part polyurethane curable composition having substantially consistent g-modulus across the range of use temperatures
|
|
US20100009086A1
(en)
*
|
2008-07-08 |
2010-01-14 |
Berry Plastics Coprporation |
Rapid cure coating system
|
|
KR20160085363A
(ko)
*
|
2008-07-29 |
2016-07-15 |
다우 글로벌 테크놀로지스 엘엘씨 |
자동차 캐비티의 강성화 및 에너지 소산을 위한 강인화된 발포성 에폭시 수지
|
|
KR101650965B1
(ko)
*
|
2008-08-22 |
2016-08-24 |
다우 글로벌 테크놀로지스 엘엘씨 |
큰 중량의 부품을 구조물에 접착시키기에 적합한 접착제 조성물
|
|
CN102333837A
(zh)
|
2009-02-26 |
2012-01-25 |
陶氏环球技术有限责任公司 |
包含二聚脂肪酸/环氧树脂加合物和多元醇的单组分环氧树脂结构粘合剂
|
|
JP5715638B2
(ja)
|
2009-11-05 |
2015-05-13 |
ダウ グローバル テクノロジーズ エルエルシー |
ケトオキシムでキャップされたエラストマー強化剤を含む構造用エポキシ樹脂系接着剤
|
|
BR112012028252A2
(pt)
|
2010-06-29 |
2016-08-02 |
Dow Global Technologies Llc |
composição de catalisador termo-ativável, adesivo de epóxi monocomponente e processo para preparar um catalisador de amina
|
|
WO2012000171A1
(en)
*
|
2010-06-29 |
2012-01-05 |
Dow Global Technologies Llc |
Storage-stable heat-activated tertiary amine catalysts for epoxy resins
|
|
EP2655516B1
(en)
|
2010-12-26 |
2018-12-26 |
Dow Global Technologies LLC |
Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds
|
|
JP5969217B2
(ja)
*
|
2011-03-09 |
2016-08-17 |
日東電工株式会社 |
両面接着テープ
|
|
JP6049705B2
(ja)
*
|
2011-05-19 |
2016-12-21 |
ダウ グローバル テクノロジーズ エルエルシー |
新規な構造用接着剤及びその使用
|
|
US20140171550A1
(en)
|
2011-08-22 |
2014-06-19 |
Gary L. Jialanella |
Epoxy resin with enhanced viscosity stability and use thereof
|
|
DE102012200854A1
(de)
*
|
2012-01-20 |
2013-07-25 |
Tesa Se |
Vernetzer-Beschleuniger-System für Polyacrylate
|
|
US9346984B2
(en)
|
2012-03-21 |
2016-05-24 |
Dow Global Technologies Llc |
Wash-off resistant epoxy adhesive composition and pre-gelled adhesive
|
|
EP2828321B1
(en)
|
2012-03-23 |
2016-04-27 |
Dow Global Technologies LLC |
Flame retardant structural epoxy resin adhesives and process for bonding metal members
|
|
BR112014018129B1
(pt)
|
2012-03-23 |
2021-07-20 |
Dow Global Technologies Llc |
Adesivo estrutural termocurável e método para unir um membro de alumínio a um segundo membro metálico
|
|
JP2015514149A
(ja)
|
2012-04-02 |
2015-05-18 |
ダウ グローバル テクノロジーズ エルエルシー |
エポキシ系接着剤並びにその製造および用途
|
|
CA2873069C
(en)
*
|
2012-06-13 |
2021-01-12 |
Valspar Sourcing, Inc. |
Low application temperature powder coating
|
|
WO2014035655A2
(en)
|
2012-08-27 |
2014-03-06 |
Dow Global Technologies Llc |
Accelerated and toughened two part epoxy adhesives
|
|
US9546243B2
(en)
|
2013-07-17 |
2017-01-17 |
Air Products And Chemicals, Inc. |
Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
|
|
AR100026A1
(es)
|
2013-11-26 |
2016-09-07 |
Basf Se |
Composición elastomérica de poliuretano y método de preparación
|
|
WO2015160468A1
(en)
|
2014-04-14 |
2015-10-22 |
Dow Global Technologies Llc |
Epoxy resin compositions for pre-gel ovens
|
|
US20170204235A1
(en)
|
2014-05-01 |
2017-07-20 |
Dow Global Technologies Llc |
Prepreg manufacturing and drying process
|
|
US20170114198A1
(en)
|
2014-06-09 |
2017-04-27 |
Dow Global Technologies Llc |
Process for making curable, multi-layer fiber-reinforced prepreg
|
|
BR112017000219A2
(pt)
|
2014-07-08 |
2018-01-16 |
Dow Global Technologies Llc |
adesivo durável à falha de alta tg de cura retardada
|
|
CN106661190B
(zh)
|
2014-07-23 |
2020-09-11 |
陶氏环球技术有限责任公司 |
具有改进的耐冲洗性的结构粘合剂和用于分配其的方法
|
|
CN107001897A
(zh)
|
2014-12-31 |
2017-08-01 |
陶氏环球技术有限责任公司 |
具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物
|
|
JP2016153475A
(ja)
*
|
2015-02-13 |
2016-08-25 |
積水化学工業株式会社 |
エポキシ樹脂硬化用マイクロカプセル及びエポキシ樹脂組成物
|
|
WO2016191403A1
(en)
*
|
2015-05-28 |
2016-12-01 |
Dow Global Technologies Llc |
A two part (2k) epoxy adhesive composition for bonding oily metals
|
|
CN107646043A
(zh)
|
2015-06-02 |
2018-01-30 |
陶氏环球技术有限责任公司 |
用于环氧粘合剂的封闭的聚氨酯增韧剂
|
|
MY187105A
(en)
|
2015-06-30 |
2021-08-31 |
Henkel Ag & Co Kgaa |
"process for cold bonding rubber on metal substrates"
|
|
BR112018003350B1
(pt)
|
2015-09-10 |
2022-06-14 |
Dow Global Technologies Llc |
Composição adequada como endurecedor em um adesivo de epóxi e método de fabricação de uma composição adequada como um endurecedor em um adesivo de epóxi
|
|
BR112018003401B1
(pt)
|
2015-09-10 |
2022-06-14 |
Dow Global Technologies Llc |
Adesivo de epóxi de um componente, método para uso do adesivo de epóxi, método para aderir um primeiro substrato oleoso a um segundo substrato, endurecedor elastomérico reativo tendo grupos isocianato capeados e adesivo de epóxi
|
|
US20180258329A1
(en)
|
2015-09-10 |
2018-09-13 |
Dow Global Technologies Llc |
High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
|
|
US11242427B2
(en)
*
|
2015-10-20 |
2022-02-08 |
Ppg Industries Ohio, Inc. |
Structural adhesive compositions
|
|
BR112018014168B1
(pt)
|
2016-01-15 |
2022-07-19 |
Basf Se |
Artigo compósito, métodos para formar um artigo compósito e para formar uma estrutura submarina, e, estrutura submarina
|
|
CN108473662B
(zh)
|
2016-01-19 |
2021-12-21 |
陶氏环球技术有限责任公司 |
具有高伸长率和优异的热稳定性的单组分环氧改性聚氨酯和/或聚脲粘合剂以及使用其的装配工艺
|
|
EP3281982A1
(de)
|
2016-08-11 |
2018-02-14 |
Sika Technology AG |
Blockierte polyurethan-schlagzähigkeitsmodifikatoren zur verbesserung der schlagzähigkeit einkomponentiger tieftemperaturhärtender epoxidklebstoffe
|
|
US11624012B2
(en)
|
2016-10-24 |
2023-04-11 |
Ddp Speciality Electronic Materials Us, Llc |
Epoxy adhesive resistant to open bead humidity exposure
|
|
WO2018081032A1
(en)
|
2016-10-25 |
2018-05-03 |
Dow Global Technologies Llc |
Epoxy adhesive having improved low-temperature impact resistance
|
|
JP7011656B2
(ja)
|
2016-10-28 |
2022-01-26 |
ダウ グローバル テクノロジーズ エルエルシー |
改善された低温耐衝撃性を有する衝突耐久性エポキシ接着剤
|
|
DK3559073T3
(da)
*
|
2016-12-21 |
2026-06-01 |
Huntsman Adv Mat Switzerland |
Latente hærdningsacceleratorer
|
|
US11274236B2
(en)
|
2017-02-26 |
2022-03-15 |
Ddp Specialty Electronic Materials Us, Llc |
One-component toughened epoxy adhesives containing a mixture of latent curing agents
|
|
JP7098662B2
(ja)
|
2017-06-07 |
2022-07-11 |
ダウ グローバル テクノロジーズ エルエルシー |
ランダムに配向したフィラメントを有する成形化合物、ならびにその作製および使用方法
|
|
KR102627557B1
(ko)
|
2017-08-15 |
2024-01-24 |
디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 |
이액형 상온 경화성 에폭시 접착제
|
|
KR102628558B1
(ko)
|
2017-09-12 |
2024-01-25 |
디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 |
접착제 제형
|
|
JP7295095B2
(ja)
|
2017-09-12 |
2023-06-20 |
ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス,エルエルシー |
一成分強化エポキシ接着剤
|
|
US10996338B2
(en)
*
|
2017-09-12 |
2021-05-04 |
Toyota Research Institute, Inc. |
Systems and methods for detection by autonomous vehicles
|
|
DE102017008925A1
(de)
|
2017-09-25 |
2019-03-28 |
Hexion GmbH |
Imprägnierharzmischung
|
|
WO2019079026A1
(en)
|
2017-10-18 |
2019-04-25 |
Dow Global Technologies Llc |
ADHESIVE COMPOSITION
|
|
EP3737725B1
(en)
|
2018-01-08 |
2023-03-01 |
DDP Specialty Electronic Materials US, LLC |
Epoxy resin adhesive compositions
|
|
CN112654686B
(zh)
*
|
2018-05-29 |
2023-04-07 |
Ddp特种电子材料美国有限责任公司 |
使用单组分环氧粘合剂混合物的粘结方法
|
|
JP2021526168A
(ja)
|
2018-06-05 |
2021-09-30 |
ダウ グローバル テクノロジーズ エルエルシー |
エポキシ繊維複合体をポリオレフィンにリサイクルするための方法
|
|
JP7394833B2
(ja)
|
2018-08-31 |
2023-12-08 |
ダウ グローバル テクノロジーズ エルエルシー |
エポキシ複合配合物
|
|
WO2020167467A1
(en)
|
2019-02-15 |
2020-08-20 |
Dow Global Technologies Llc |
Epoxy composition
|
|
EP3715406A1
(en)
|
2019-03-29 |
2020-09-30 |
Henkel AG & Co. KGaA |
Process for modifying the surface polarity of rubber substrates
|
|
US20220204820A1
(en)
|
2019-05-21 |
2022-06-30 |
Ddp Specialty Electronic Materials Us, Llc |
Epoxy adhesive composition and method of use
|
|
WO2020256902A1
(en)
|
2019-06-18 |
2020-12-24 |
Ddp Specialty Electronic Materials Us, Llc |
One-component toughened epoxy adhesives with improved humidity resistance
|
|
CN111662675B
(zh)
*
|
2020-06-19 |
2021-10-22 |
西北工业大学深圳研究院 |
具有自愈合功能的壁画、彩绘类文物加固剂及制备方法
|
|
US20230279276A1
(en)
|
2020-08-03 |
2023-09-07 |
Ddp Specialty Electronic Materials Us, Llc |
Bonding dissimilar materials using radio frequency wave curing
|
|
EP4232496A1
(en)
|
2020-10-26 |
2023-08-30 |
DDP Specialty Electronic Materials US, LLC |
One-component structural adhesive
|
|
US20240376353A1
(en)
|
2021-08-30 |
2024-11-14 |
Ddp Specialty Electronic Materials Us, Llc |
Two-component structural adhesive
|
|
JP2025510103A
(ja)
|
2022-03-22 |
2025-04-14 |
ディーディーピー スペシャルティ エレクトロニック マテリアルズ ユーエス リミテッド ライアビリティ カンパニー |
二成分熱伝導性構造用接着剤
|
|
KR20250083480A
(ko)
|
2022-10-06 |
2025-06-10 |
디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 |
2-성분 접착제 조성물
|
|
CN119968413A
(zh)
|
2022-10-06 |
2025-05-09 |
Ddp 特种电子材料美国有限责任公司 |
双组分粘合剂组合物
|
|
US20240327615A1
(en)
*
|
2023-03-31 |
2024-10-03 |
Evonik Operations Gmbh |
Solutions of amines in polymeric phenols in combination with other resins
|
|
US20240327610A1
(en)
|
2023-03-31 |
2024-10-03 |
Evonik Operations Gmbh |
Solutions of amines in functional and non-functional resins
|
|
WO2026085810A1
(en)
|
2024-10-24 |
2026-04-30 |
Evonik Operations Gmbh |
A latent curing accelerator composition containing isocyanate blocked tertiary amine
|