ES8802245A1 - Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico. - Google Patents

Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico.

Info

Publication number
ES8802245A1
ES8802245A1 ES553544A ES553544A ES8802245A1 ES 8802245 A1 ES8802245 A1 ES 8802245A1 ES 553544 A ES553544 A ES 553544A ES 553544 A ES553544 A ES 553544A ES 8802245 A1 ES8802245 A1 ES 8802245A1
Authority
ES
Spain
Prior art keywords
nitrogen
typical
resin
curable compositions
methylaminoethanol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES553544A
Other languages
English (en)
Other versions
ES553544A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of ES8802245A1 publication Critical patent/ES8802245A1/es
Publication of ES553544A0 publication Critical patent/ES553544A0/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Insulating Bodies (AREA)
  • Cable Accessories (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

PROCEDIMIENTO PARA ADHERIR DOS SUPERFICIES METALICAS DE MATERIAL SINTETICO REFORZADO, DE VIDRIO, DE MATERIAL DE FRICCION O CERAMICO. COMPRENDE LAS ETAPAS DE APLICAR A UNA O AMBAS DE LAS SUPERFICIES A ADHERIR, UNA COMPOSICION CURABLE FORMADA POR UNA RESINA EPOXIDO, UN AGENTE DE CURADO LATENTE QUE CONTIENE NITROGENO PARA RESINA EPOXIDO, Y UN ACELERADOR PARA EL CURADO; DE COLOCAR LAS DOS SUPERFICIES JUNTAS CON LA COMPOSICION SITUADA ENTRE LAS MISMAS, PARA FORMAR ASI UN CONJUNTO; Y DE CALENTAR EL CONJUNTO FORMADO HASTA QUE SOLIDIFIQUE LA COMPOSICION. DE APLICACION EN LA UNION DE SUPERFICIES METALICAS, DE PLASTICO REFORZADO, DE CRISTAL, DE MATERIALES DE FRICCION Y DE PRODUCTOS CERAMICOS, MEDIANTE UN ADHESIVO DE RESINA EPOXIDO CURABLE.
ES553544A 1985-04-02 1986-03-31 Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico. Expired ES8802245A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8508628 1985-04-02

Publications (2)

Publication Number Publication Date
ES8802245A1 true ES8802245A1 (es) 1988-04-16
ES553544A0 ES553544A0 (es) 1988-04-16

Family

ID=10577097

Family Applications (2)

Application Number Title Priority Date Filing Date
ES553544A Expired ES8802245A1 (es) 1985-04-02 1986-03-31 Procedimiento para adherir dos superficies metalicas de material sintetico reforzado de vidrio, de material de friccion o ceramico.
ES553543A Expired ES8706770A1 (es) 1985-04-02 1986-03-31 Procedimiento de curado de resinas epoxido

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES553543A Expired ES8706770A1 (es) 1985-04-02 1986-03-31 Procedimiento de curado de resinas epoxido

Country Status (7)

Country Link
US (4) US4659779A (es)
EP (2) EP0200678B1 (es)
JP (1) JPH0660231B2 (es)
AT (2) ATE56462T1 (es)
CA (2) CA1259897A (es)
DE (2) DE3674052D1 (es)
ES (2) ES8802245A1 (es)

Families Citing this family (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8622998D0 (en) * 1986-09-24 1986-10-29 Ciba Geigy Ag Curable compositions
EP0289632A1 (en) * 1987-05-04 1988-11-09 American Cyanamid Company High green strength induction curable adhesives
JPH0811791B2 (ja) * 1987-07-27 1996-02-07 神鋼鋼線工業株式会社 プレストレストコンクリート緊張材用塗布材料
US4777084A (en) * 1987-10-08 1988-10-11 Minnesota Mining And Manufacturing Company Phenolic-modified epoxy adhesive including the reaction product of bisphenol A and the monoglycidyl ether of bisphenol A
US5194307A (en) * 1988-02-08 1993-03-16 Martin Processing, Inc. High performance epoxy based coverlay and bond fly adhesive with heat activated cure mechanism
US5888654A (en) * 1988-02-08 1999-03-30 Courtaulds Performance Films High performance epoxy based laminating adhesive
ES2072919T3 (es) * 1988-07-09 1995-08-01 Ciba Geigy Ag Composiciones de resina epoxida curables.
US4874833A (en) * 1988-08-22 1989-10-17 Shell Oil Company Composition containing epoxy resin and alkyl hindered polyaromatic diamine and monoaromatic amine curing agents
GB8824391D0 (en) * 1988-10-18 1988-11-23 Ciba Geigy Ag Compositions
US5618606A (en) * 1989-09-18 1997-04-08 Rockwell International Corporation Process for bonding staged composites with a cobonded staged adhesive and article
US5593770A (en) * 1989-10-25 1997-01-14 Thiokol Corporation Chemorheologically tailored matrix resin formulations containing anhydride curing agents
US5545278A (en) * 1989-10-25 1996-08-13 Thiokol Corporation Method for increasing fiber strength translation in composition pressure vessels using matrix resin formulations containing anhydride curing agents and surface-active agents
DE68916253T2 (de) * 1989-11-30 1994-11-24 Courtaulds Performance Films Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff.
US5252402A (en) * 1990-01-11 1993-10-12 Lilly Industries, Inc. Mirrorback coating
US5248331A (en) * 1990-01-11 1993-09-28 Lilly Industries, Inc. Mirror back coating
US5212263A (en) * 1991-01-10 1993-05-18 Morton International, Inc. Textured epoxy powder coating
IT1261171B (it) * 1992-03-03 1996-05-09 Ruetgerswerke Ag Miscuglio resinoso a basso contenuto di prodotti di scissione.
GB9310031D0 (en) * 1993-05-15 1993-06-30 G B Tools Components Export Manufacture of bonded articles
US6831116B2 (en) * 1995-03-07 2004-12-14 Landec Corporation Polymeric modifying agents
US6255367B1 (en) 1995-03-07 2001-07-03 Landec Corporation Polymeric modifying agents
EP0754742B1 (en) * 1995-07-19 2001-10-24 Raytheon Company Room-temperature stable, one-component, flexible epoxy adhesives
US6295599B1 (en) * 1995-08-16 2001-09-25 Microunity Systems Engineering System and method for providing a wide operand architecture
ES2160928T3 (es) * 1996-03-22 2001-11-16 Vantico Ag Material para trabajar con herramientas de resina epoxi de un componente.
US5688878A (en) * 1996-05-17 1997-11-18 Morton International, Inc. Epoxy powder coating with wrinkle finish
US5795927A (en) * 1996-05-17 1998-08-18 Morton International, Inc. Color stable wrinkle finish epoxy powder coating
US6056846A (en) 1996-07-25 2000-05-02 Mcdonnell Douglas Helicopter Co. Bonded composite structure and its fabrication
US5932288A (en) * 1997-12-18 1999-08-03 Morton International, Inc. Wrinkle epoxy powder coating with acid and its homolog methylenedisalicylic
EP0930343A3 (en) 1998-01-16 2000-05-31 Landec Corporation Low profile additives for crosslink resins
US6492462B2 (en) 1998-01-16 2002-12-10 Landec Corporation Side chain crystalline polymer as rheology modifier for crosslinked polymer
US6060540A (en) * 1998-02-13 2000-05-09 Landec Corporation Modeling pastes
JPH11279376A (ja) * 1998-03-27 1999-10-12 Hitachi Chem Co Ltd 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板
US20060204777A1 (en) * 2001-05-04 2006-09-14 Alto Products Corp. Process for making adhesive bonded sintered plates
US20020162618A1 (en) * 2001-05-04 2002-11-07 David Landa Process for making adhesive bonded sintered plates
US7217771B2 (en) 2001-07-31 2007-05-15 Huntsman Advanced Materials Americas Inc. Epoxy resin
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
ATE346877T1 (de) * 2003-04-16 2006-12-15 Huntsman Adv Mat Switzerland Härtungsbeschleuniger für epoxyharzzusammensetzungen härtend bei niedriger temperatur
EP2843022B1 (en) 2003-07-07 2020-12-16 Dow Global Technologies LLC Adhesive epoxy composition and process for applying it
US7557169B2 (en) 2003-07-07 2009-07-07 Dow Global Technologies, Inc. Capping isocyanate prepolymer or polyisocyanate/polyether polyol or polyamine mixture
US7192991B2 (en) * 2003-11-26 2007-03-20 3M Innovative Properties Company Cationically curable composition
ES2276182T5 (es) * 2004-03-12 2015-04-10 Dow Global Technologies Llc Composición adhesiva epoxídica
EP1602702B2 (en) * 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
US8029889B1 (en) 2004-12-03 2011-10-04 Henkel Corporation Prepregs, towpregs and preforms
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
DE602005020260D1 (de) * 2005-06-02 2010-05-12 Dow Global Technologies Inc Schlagzähmodifizierter Strukturklebstoff auf Epoxid Basis
JP4890872B2 (ja) * 2006-01-30 2012-03-07 ルネサスエレクトロニクス株式会社 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置
US7537827B1 (en) 2006-12-13 2009-05-26 Henkel Corporation Prepreg laminates
ATE486899T1 (de) * 2006-12-21 2010-11-15 Dow Global Technologies Inc Zusammensetzung, die zur verwendung als klebstoff beim einbau von fahrzeugfenstern brauchbar ist
EP2344561B1 (en) 2007-06-20 2015-07-29 Dow Global Technologies LLC Crash durable epoxy adhesives with very low sensitivity to temperature variations
CN101778877B (zh) * 2007-07-23 2013-01-02 陶氏环球技术公司 在使用温度范围内g-模量基本一致的两部分聚氨酯可固化组合物
US20100009086A1 (en) * 2008-07-08 2010-01-14 Berry Plastics Coprporation Rapid cure coating system
CN102177013B (zh) * 2008-07-29 2014-07-23 陶氏环球技术有限责任公司 用于汽车空腔中的加强和能量耗散的增韧可膨胀环氧树脂
BRPI0912919B1 (pt) * 2008-08-22 2019-04-24 Dow Global Technologies Llc Composição bicomponente e método para ligar dois ou mais substratos entre si
BRPI1005818A2 (pt) 2009-02-26 2016-03-08 Dow Global Technologies Llc adesivo estrutural monocomponente e método de aplicação de adesivo estrutural
CN102648262B (zh) 2009-11-05 2014-12-10 陶氏环球技术有限责任公司 含有用酮肟封端的弹性增韧剂的结构环氧树脂胶粘剂
WO2012000171A1 (en) * 2010-06-29 2012-01-05 Dow Global Technologies Llc Storage-stable heat-activated tertiary amine catalysts for epoxy resins
CN103025840A (zh) * 2010-06-29 2013-04-03 陶氏环球技术有限责任公司 用于环氧树脂的储存稳定且热活化的叔胺催化剂
EP2655516B1 (en) 2010-12-26 2018-12-26 Dow Global Technologies LLC Structural epoxy resin adhesives containing chain-extended elastomeric tougheners capped with phenol, polyphenol or aminophenol compounds
JP5969217B2 (ja) * 2011-03-09 2016-08-17 日東電工株式会社 両面接着テープ
US20140147677A1 (en) * 2011-05-19 2014-05-29 Andreas Lutz Novel Structural Adhesive and Use Thereof
BR112014000231B1 (pt) 2011-08-22 2020-07-14 Dow Global Technologies Llc Composição tenacificante e adesivo de epóxi
DE102012200854A1 (de) * 2012-01-20 2013-07-25 Tesa Se Vernetzer-Beschleuniger-System für Polyacrylate
EP2828860B1 (en) 2012-03-21 2021-02-24 Dow Global Technologies LLC Wash-off resistant epoxy adhesive composition and pre-gelled adhesive
JP6173424B2 (ja) * 2012-03-23 2017-08-02 ダウ グローバル テクノロジーズ エルエルシー 応力耐久性が高い破壊耐久性接着剤
BR112014018126B1 (pt) 2012-03-23 2021-07-13 Dow Global Technologies Llc Adesivo estrutural termocurável e processo para unir e soldar membros metálicos
JP2015514149A (ja) 2012-04-02 2015-05-18 ダウ グローバル テクノロジーズ エルエルシー エポキシ系接着剤並びにその製造および用途
CN104364325A (zh) * 2012-06-13 2015-02-18 威士伯采购公司 低应用温度的粉末涂料
EP2888331B1 (en) 2012-08-27 2019-03-20 Dow Global Technologies LLC Accelerated and toughened two-part epoxy adhesives
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
CN105934457A (zh) 2013-11-26 2016-09-07 巴斯夫欧洲公司 聚氨酯弹性组合物及其制备方法
JP6553640B2 (ja) 2014-04-14 2019-07-31 ダウ グローバル テクノロジーズ エルエルシー プレゲル炉のためのエポキシ樹脂組成物
EP3137538A1 (en) 2014-05-01 2017-03-08 Dow Global Technologies LLC Prepreg manufacturing and drying process
WO2015191354A1 (en) 2014-06-09 2015-12-17 Dow Global Technologies Llc Process for making curable, multi-layer fiber-reinforced prepreg
CN106715577A (zh) 2014-07-08 2017-05-24 陶氏环球技术有限责任公司 延迟固化的高Tg碰撞耐用粘合剂
US10150893B2 (en) 2014-07-23 2018-12-11 Dow Global Technologies Llc Structural adhesives having improved wash-off resistance and method for dispensing same
US10392539B2 (en) 2014-12-31 2019-08-27 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
JP2016153475A (ja) * 2015-02-13 2016-08-25 積水化学工業株式会社 エポキシ樹脂硬化用マイクロカプセル及びエポキシ樹脂組成物
WO2016191403A1 (en) * 2015-05-28 2016-12-01 Dow Global Technologies Llc A two part (2k) epoxy adhesive composition for bonding oily metals
US20180163104A1 (en) 2015-06-02 2018-06-14 Dow Global Technologies Llc Blocked polyurethane tougheners for epoxy adhesives
JP6796603B2 (ja) 2015-06-30 2020-12-09 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 金属基材上にゴムをコールド接着させる方法
EP3347398B1 (en) 2015-09-10 2024-07-31 DDP Specialty Electronic Materials US, LLC One-component toughened epoxy adhesives with improved adhesion to oily surfaces and high wash-off resistance
WO2017044359A1 (en) 2015-09-10 2017-03-16 Dow Global Technologies Llc High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers
BR112018003350B1 (pt) 2015-09-10 2022-06-14 Dow Global Technologies Llc Composição adequada como endurecedor em um adesivo de epóxi e método de fabricação de uma composição adequada como um endurecedor em um adesivo de epóxi
US11242427B2 (en) * 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
AU2017207446A1 (en) 2016-01-15 2018-07-26 Basf Se Composite article
WO2017127253A1 (en) 2016-01-19 2017-07-27 Dow Global Technologies Llc One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
EP3281982A1 (de) 2016-08-11 2018-02-14 Sika Technology AG Blockierte polyurethan-schlagzähigkeitsmodifikatoren zur verbesserung der schlagzähigkeit einkomponentiger tieftemperaturhärtender epoxidklebstoffe
EP3529328B1 (en) 2016-10-24 2020-06-24 Dow Global Technologies LLC Epoxy adhesive resistant to open bead humidity exposure
WO2018081032A1 (en) 2016-10-25 2018-05-03 Dow Global Technologies Llc Epoxy adhesive having improved low-temperature impact resistance
EP3532527A1 (en) 2016-10-28 2019-09-04 Dow Global Technologies, LLC Crash durable epoxy adhesive having improved low-temperature impact resistance
US11629219B2 (en) * 2016-12-21 2023-04-18 Huntsman Advanced Materials Licensing (Switzerland) Gmbh Latent curing accelerators
US11274236B2 (en) 2017-02-26 2022-03-15 Ddp Specialty Electronic Materials Us, Llc One-component toughened epoxy adhesives containing a mixture of latent curing agents
CN110678314B (zh) 2017-06-07 2022-08-02 陶氏环球技术有限责任公司 具有随机定向的长丝的模制化合物及其制作和使用方法
KR102627557B1 (ko) 2017-08-15 2024-01-24 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 이액형 상온 경화성 에폭시 접착제
US11492525B2 (en) 2017-09-12 2022-11-08 Ddp Specialty Electronic Materials Us, Llc Adhesive formulation
WO2019055128A1 (en) 2017-09-12 2019-03-21 Dow Global Technologies Llc EPOXY ADHESIVES REINFORCED WITH A COMPONENT
US10996338B2 (en) * 2017-09-12 2021-05-04 Toyota Research Institute, Inc. Systems and methods for detection by autonomous vehicles
DE102017008925A1 (de) 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
US11820922B2 (en) 2017-10-18 2023-11-21 Ddp Specialty Electronic Materials Us, Llc Adhesive composition
KR20240025034A (ko) 2018-01-08 2024-02-26 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 에폭시 수지 접착제 조성물
EP3802723B1 (en) 2018-05-29 2022-09-21 DDP Specialty Electronic Materials US, LLC Method for bonding using one-component epoxy adhesive mixtures
JP2021526168A (ja) 2018-06-05 2021-09-30 ダウ グローバル テクノロジーズ エルエルシー エポキシ繊維複合体をポリオレフィンにリサイクルするための方法
JP7394833B2 (ja) 2018-08-31 2023-12-08 ダウ グローバル テクノロジーズ エルエルシー エポキシ複合配合物
KR102874303B1 (ko) 2019-02-15 2025-10-22 다우 글로벌 테크놀로지스 엘엘씨 에폭시 조성물
EP3715406A1 (en) 2019-03-29 2020-09-30 Henkel AG & Co. KGaA Process for modifying the surface polarity of rubber substrates
JP2022533832A (ja) 2019-05-21 2022-07-26 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー エポキシ接着剤組成物及び使用方法
US20220195267A1 (en) 2019-06-18 2022-06-23 Ddp Specialty Electronic Materials Us, Llc One-component toughened epoxy adhesives with improved humidity resistance
CN111662675B (zh) * 2020-06-19 2021-10-22 西北工业大学深圳研究院 具有自愈合功能的壁画、彩绘类文物加固剂及制备方法
EP4189029A1 (en) 2020-08-03 2023-06-07 DDP Specialty Electronic Materials US, LLC Bonding dissimilar materials using radio frequency wave curing
CN116472301A (zh) 2020-10-26 2023-07-21 Ddp特种电子材料美国有限责任公司 单组分结构粘合剂
WO2023033919A1 (en) 2021-08-30 2023-03-09 Ddp Specialty Electronic Materials Us, Llc Two-component structural adhesive
KR20240161648A (ko) 2022-03-22 2024-11-12 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 2-성분 열 전도성 구조 접착제
CN119968413A (zh) 2022-10-06 2025-05-09 Ddp 特种电子材料美国有限责任公司 双组分粘合剂组合物
JP2025533916A (ja) 2022-10-06 2025-10-09 ディーディーピー スペシャルティ エレクトロニック マテリアルズ ユーエス リミテッド ライアビリティ カンパニー 二液型接着剤組成物
US20240327615A1 (en) * 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in polymeric phenols in combination with other resins
US20240327610A1 (en) 2023-03-31 2024-10-03 Evonik Operations Gmbh Solutions of amines in functional and non-functional resins

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL246535A (es) * 1958-12-18
US3420794A (en) * 1963-08-29 1969-01-07 Shell Oil Co Process for curing polyepoxides with a polyamine and resulting products
US3383433A (en) * 1964-09-22 1968-05-14 Union Carbide Corp Epoxide resins cured with phenolic novolacs and triazoles or tetrazoles
US3519576A (en) * 1966-11-23 1970-07-07 Minnesota Mining & Mfg Latent curing epoxy compositions containing a crystalline polyphenate salt of a polyamine and 2,4,4-trimethyl-2,4,7-trihydroxyflavan
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
US3520905A (en) * 1969-05-16 1970-07-21 Minnesota Mining & Mfg Flavan salt
US3839281A (en) * 1971-06-16 1974-10-01 Ciba Geigy Corp N-hydroxyalkylpiperidyl,n-hydroxyalkylpiperazyl compounds as accelerating agents in epoxy resin compositions
JPS5229800B2 (es) * 1972-11-01 1977-08-04
JPS5219875B2 (es) * 1974-02-07 1977-05-31
US4032513A (en) * 1976-03-30 1977-06-28 Maruzen Oil Co. Ltd. Process of producing alkenylphenol polymers
JPS6030334B2 (ja) * 1978-03-16 1985-07-16 田岡化学工業株式会社 硬化性混合物
JPS5536212A (en) * 1978-09-06 1980-03-13 Mitsui Toatsu Chem Inc Thermosetting resin composition
CH637150A5 (de) * 1978-10-30 1983-07-15 Ciba Geigy Ag Epoxidharzformmasse.
DE3117960A1 (de) * 1980-05-10 1982-03-25 Matsushita Electric Works Ltd., Kadoma, Osaka Epoxydharz-zusammensetzung
JPS5852319A (ja) * 1981-09-24 1983-03-28 Mitsui Toatsu Chem Inc 架橋剤
US4388451A (en) * 1981-09-28 1983-06-14 Ashland Oil, Inc. Polymers derived from allylphenol or substituted allylphenol and maleic anhydride
US4433015A (en) * 1982-04-07 1984-02-21 Parker Chemical Company Treatment of metal with derivative of poly-4-vinylphenol
JPS5949225A (ja) * 1982-09-16 1984-03-21 Hitachi Ltd 耐熱性難燃性樹脂組成物
DE3305549A1 (de) * 1983-02-18 1984-08-23 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum beschichten von kunst- oder natursteinplatten
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
US4593056A (en) * 1985-06-21 1986-06-03 Union Carbide Corporation Epoxy/aromatic amine resin systems containing aromatic trihydroxy compounds as cure accelerators

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EP0197892A3 (en) 1987-09-23
US4701378A (en) 1987-10-20
US4734332A (en) 1988-03-29
CA1240440A (en) 1988-08-09
ES8706770A1 (es) 1987-06-16
CA1259897A (en) 1989-09-26
JPS61231024A (ja) 1986-10-15
EP0197892B1 (de) 1989-10-18
EP0200678A3 (en) 1987-09-23
EP0200678A2 (de) 1986-11-05
DE3666442D1 (en) 1989-11-23
US4713432A (en) 1987-12-15
JPH0660231B2 (ja) 1994-08-10
ES553544A0 (es) 1988-04-16
EP0200678B1 (de) 1990-09-12
ES553543A0 (es) 1987-06-16
EP0197892A2 (de) 1986-10-15
ATE56462T1 (de) 1990-09-15
DE3674052D1 (de) 1990-10-18
ATE47407T1 (de) 1989-11-15
US4659779A (en) 1987-04-21

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