ES8601564A1 - Un metodo de fabricar un circuito integrado - Google Patents

Un metodo de fabricar un circuito integrado

Info

Publication number
ES8601564A1
ES8601564A1 ES536095A ES536095A ES8601564A1 ES 8601564 A1 ES8601564 A1 ES 8601564A1 ES 536095 A ES536095 A ES 536095A ES 536095 A ES536095 A ES 536095A ES 8601564 A1 ES8601564 A1 ES 8601564A1
Authority
ES
Spain
Prior art keywords
semiconductor device
manufacturing
package
load
device manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES536095A
Other languages
English (en)
Other versions
ES536095A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES8601564A1 publication Critical patent/ES8601564A1/es
Publication of ES536095A0 publication Critical patent/ES536095A0/es
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D44/00—Charge transfer devices
    • H10D44/01—Manufacture or treatment
    • H10D44/041—Manufacture or treatment having insulated gates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D44/00—Charge transfer devices
    • H10D44/40—Charge-coupled devices [CCD]
    • H10D44/45—Charge-coupled devices [CCD] having field effect produced by insulated gate electrodes 

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

DISPOSITIVO SEMICONDUCTOR QUE COMPRENDE UN CIRCUITO INTEGRADO EN UNA SUPERFICIE DE UN CUERPO SEMICONDUCTOR. COMPRENDE UN SENSOR DE TRANSFERENCIA DE CUADRO (FT) CON UN GRAN NUMERO DE CANALES (2) DE DISPOSITIVOS DE ACOPLAMIENTO DE CARGA QUE SE EXTIENDEN EN LA DIRECCION VERTICAL. EXISTE UNA PARTE DE REGISTRO (A) SOBRE LA QUE PUEDE PROYECTARSE UNA IMAGEN Y QUE PUEDE CONVERTIRSE EN PAQUETE DE CARGA. HAY UNA PARTE DE ALMACENAMIENTO (8) DONDE PUEDE ALMACENARSE UN MOSAICO DE PAQUETES DE CARGA PUDIENDO ESTAR PROVISTA ESTA PARTE DE UNA CAPA DE APANTALLAMIENTO REFLECTANTE O ABSORBENTE.
ES536095A 1983-09-23 1984-09-20 Un metodo de fabricar un circuito integrado Granted ES536095A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8303268A NL8303268A (nl) 1983-09-23 1983-09-23 Werkwijze ter vervaardiging van een halfgeleiderinrichting en halfgeleiderinrichting vervaardigd door toepassing van een dergelijke werkwijze.

Publications (2)

Publication Number Publication Date
ES8601564A1 true ES8601564A1 (es) 1985-10-16
ES536095A0 ES536095A0 (es) 1985-10-16

Family

ID=19842443

Family Applications (1)

Application Number Title Priority Date Filing Date
ES536095A Granted ES536095A0 (es) 1983-09-23 1984-09-20 Un metodo de fabricar un circuito integrado

Country Status (9)

Country Link
US (2) US4686759A (es)
EP (1) EP0137554B1 (es)
JP (1) JPS6091672A (es)
AT (1) ATE39033T1 (es)
AU (1) AU572561B2 (es)
CA (1) CA1216965A (es)
DE (1) DE3475453D1 (es)
ES (1) ES536095A0 (es)
NL (1) NL8303268A (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0734455B2 (ja) * 1986-08-27 1995-04-12 日本電気株式会社 多層配線基板
EP0347238B1 (en) * 1988-06-17 1993-10-20 Ngk Insulators, Ltd. Minutely patterned structure, and method of producing the same
JPH02266537A (ja) * 1989-04-07 1990-10-31 Mitsubishi Electric Corp 電荷転送素子
JP2855291B2 (ja) * 1991-03-07 1999-02-10 富士写真フイルム株式会社 固体撮像装置
JPH07297194A (ja) * 1994-04-25 1995-11-10 Sony Corp マルチチャンバー装置及び半導体装置の製造方法
US6218686B1 (en) 1995-12-28 2001-04-17 Samsung Electronics Co. Ltd. Charge coupled devices
KR0165326B1 (ko) * 1995-12-28 1998-12-15 김광호 전하전송소자 및 그 제조방법
US6096636A (en) * 1996-02-06 2000-08-01 Micron Technology, Inc. Methods of forming conductive lines
JP2000500296A (ja) * 1996-09-10 2000-01-11 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 電荷結合素子及びそのような素子を製造する方法
KR100259084B1 (ko) * 1997-07-25 2000-06-15 김영환 고체촬상소자및이의제조방법
KR100268440B1 (ko) 1998-09-21 2000-10-16 윤종용 고감도 고체 촬상 장치
US6329219B1 (en) * 1999-12-22 2001-12-11 Scientific Imaging Technologies, Inc. Method of processing a semiconductor device
EP2822985B1 (en) * 2012-03-09 2016-11-30 Construction Research & Technology GmbH Amine curable epoxy resin composition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681147A (en) * 1970-01-22 1972-08-01 Ibm Method for masking semiconductor regions for ion implantation
AU2419371A (en) * 1971-01-11 1972-07-13 Multiple layer metal structure and processing
JPS5316523B2 (es) * 1973-05-08 1978-06-01
US3943543A (en) * 1974-07-26 1976-03-09 Texas Instruments Incorporated Three level electrode configuration for three phase charge coupled device
US3961352A (en) * 1975-05-30 1976-06-01 Northern Electric Company Limited Multi-ripple charge coupled device
NL7608901A (nl) * 1976-08-11 1978-02-14 Philips Nv Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze.
US4097885A (en) * 1976-10-15 1978-06-27 Fairchild Camera And Instrument Corp. Compact, two-phase charge-coupled-device structure utilizing multiple layers of conductive material
US4262297A (en) * 1978-12-19 1981-04-14 The General Electric Company Limited Semiconductor charge transfer device with multi-level polysilicon electrode and bus-line structure
JPS5593236A (en) * 1979-01-10 1980-07-15 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor device
DE2923995C2 (de) * 1979-06-13 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von integrierten MOS-Schaltungen mit MOS-Transistoren und MNOS-Speichertransistoren in Silizium-Gate-Technologie
JPS5610930A (en) * 1979-07-09 1981-02-03 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
US4380863A (en) * 1979-12-10 1983-04-26 Texas Instruments Incorporated Method of making double level polysilicon series transistor devices
NL8202777A (nl) * 1982-07-09 1984-02-01 Philips Nv Halfgeleiderinrichting en werkwijze voor het vervaardigen daarvan.

Also Published As

Publication number Publication date
ATE39033T1 (de) 1988-12-15
AU3327784A (en) 1985-03-28
EP0137554B1 (en) 1988-11-30
DE3475453D1 (en) 1989-01-05
AU572561B2 (en) 1988-05-12
EP0137554A3 (en) 1985-05-22
JPS6091672A (ja) 1985-05-23
US4831425A (en) 1989-05-16
NL8303268A (nl) 1985-04-16
ES536095A0 (es) 1985-10-16
CA1216965A (en) 1987-01-20
EP0137554A2 (en) 1985-04-17
JPH0458702B2 (es) 1992-09-18
US4686759A (en) 1987-08-18

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Legal Events

Date Code Title Description
MM4A Patent lapsed

Effective date: 19960506