FR2646584B1 - Methode de fabrication de circuits imprimes permettant le montage de composants electroniques - Google Patents

Methode de fabrication de circuits imprimes permettant le montage de composants electroniques

Info

Publication number
FR2646584B1
FR2646584B1 FR9003966A FR9003966A FR2646584B1 FR 2646584 B1 FR2646584 B1 FR 2646584B1 FR 9003966 A FR9003966 A FR 9003966A FR 9003966 A FR9003966 A FR 9003966A FR 2646584 B1 FR2646584 B1 FR 2646584B1
Authority
FR
France
Prior art keywords
electronic components
mounting electronic
printed circuits
manufacturing printed
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9003966A
Other languages
English (en)
Other versions
FR2646584A1 (fr
Inventor
Takeyama Takeshi
Kondo Mitsuhiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of FR2646584A1 publication Critical patent/FR2646584A1/fr
Application granted granted Critical
Publication of FR2646584B1 publication Critical patent/FR2646584B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
FR9003966A 1989-05-01 1990-03-28 Methode de fabrication de circuits imprimes permettant le montage de composants electroniques Expired - Lifetime FR2646584B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1113425A JP2676112B2 (ja) 1989-05-01 1989-05-01 電子部品搭載用基板の製造方法

Publications (2)

Publication Number Publication Date
FR2646584A1 FR2646584A1 (fr) 1990-11-02
FR2646584B1 true FR2646584B1 (fr) 1993-11-26

Family

ID=14611910

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9003966A Expired - Lifetime FR2646584B1 (fr) 1989-05-01 1990-03-28 Methode de fabrication de circuits imprimes permettant le montage de composants electroniques

Country Status (6)

Country Link
US (2) US5022960A (fr)
JP (1) JP2676112B2 (fr)
KR (1) KR930004250B1 (fr)
DE (1) DE4006063C2 (fr)
FR (1) FR2646584B1 (fr)
GB (1) GB2231205B (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206188A (en) * 1990-01-31 1993-04-27 Ibiden Co., Ltd. Method of manufacturing a high lead count circuit board
US5446244A (en) * 1990-07-19 1995-08-29 Toyo Communication Equipment Co., Ltd. Printed wiring pattern
JPH04213867A (ja) * 1990-11-27 1992-08-04 Ibiden Co Ltd 電子部品搭載用基板フレーム
US5252784A (en) * 1990-11-27 1993-10-12 Ibiden Co., Ltd. Electronic-parts mounting board and electronic-parts mounting board frame
JP3088175B2 (ja) * 1992-01-14 2000-09-18 日本メクトロン株式会社 可撓性回路配線基板の製造法
US5243498A (en) * 1992-05-26 1993-09-07 Motorola, Inc. Multi-chip semiconductor module and method for making and testing
US5603847A (en) * 1993-04-07 1997-02-18 Zycon Corporation Annular circuit components coupled with printed circuit board through-hole
EP0646962B1 (fr) * 1993-04-14 2002-11-06 Hitachi Construction Machinery Co., Ltd. Procede d'usinage d'une feuille metallique, procede d'usinage d'une grille de connexion et procede d'usinage d'un dispositif a semi-conducteur
US5589668A (en) * 1993-05-12 1996-12-31 Hitachi Cable, Ltd. Multi-metal layer wiring tab tape carrier and process for fabricating the same
US5585016A (en) * 1993-07-20 1996-12-17 Integrated Device Technology, Inc. Laser patterned C-V dot
JPH07288385A (ja) * 1994-04-19 1995-10-31 Hitachi Chem Co Ltd 多層配線板及びその製造法
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US5501761A (en) * 1994-10-18 1996-03-26 At&T Corp. Method for stripping conformal coatings from circuit boards
US6631558B2 (en) * 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
US5761802A (en) * 1996-06-10 1998-06-09 Raytheon Company Multi-layer electrical interconnection method
JP3633252B2 (ja) * 1997-01-10 2005-03-30 イビデン株式会社 プリント配線板及びその製造方法
US5953594A (en) * 1997-03-20 1999-09-14 International Business Machines Corporation Method of making a circuitized substrate for chip carrier structure
CN100370602C (zh) * 1997-04-30 2008-02-20 日立化成工业株式会社 半导体元件装配用基板及其制造方法和半导体器件
US6110650A (en) * 1998-03-17 2000-08-29 International Business Machines Corporation Method of making a circuitized substrate
US6187652B1 (en) 1998-09-14 2001-02-13 Fujitsu Limited Method of fabrication of multiple-layer high density substrate
US6207354B1 (en) 1999-04-07 2001-03-27 International Business Machines Coporation Method of making an organic chip carrier package
US6221694B1 (en) 1999-06-29 2001-04-24 International Business Machines Corporation Method of making a circuitized substrate with an aperture
US6388230B1 (en) 1999-10-13 2002-05-14 Morton International, Inc. Laser imaging of thin layer electronic circuitry material
US6748644B1 (en) * 1999-11-12 2004-06-15 Fargo Electronics, Inc. Method of forming a carrier
DE10248112B4 (de) * 2002-09-09 2007-01-04 Ruwel Ag Verfahren zur Herstellung von gedruckten elektrischen Schaltungen
DE10340705B4 (de) * 2003-09-04 2008-08-07 Fela Hilzinger Gmbh Leiterplattentechnik Metallkernleiterplatte und Verfahren zum Herstellen einer solchen Metallkernleiterplatte
US20090017309A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
JPWO2010013366A1 (ja) * 2008-07-30 2012-01-05 イビデン株式会社 フレックスリジッド配線板及びその製造方法
AT12321U1 (de) * 2009-01-09 2012-03-15 Austria Tech & System Tech Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
US20100193950A1 (en) * 2009-01-30 2010-08-05 E.I.Du Pont De Nemours And Company Wafer level, chip scale semiconductor device packaging compositions, and methods relating thereto
US9881875B2 (en) * 2013-07-31 2018-01-30 Universal Scientific Industrial (Shanghai) Co., Ltd. Electronic module and method of making the same
US9545691B2 (en) * 2013-12-23 2017-01-17 Taiwan Semiconductor Manufacturing Company Limited Method of removing waste of substrate and waste removing device thereof
US9636783B2 (en) * 2014-04-30 2017-05-02 International Business Machines Corporation Method and apparatus for laser dicing of wafers
US10658772B1 (en) * 2017-08-15 2020-05-19 Adtran, Inc. Tiered circuit board for interfacing cables and connectors
JP2019067994A (ja) * 2017-10-04 2019-04-25 トヨタ自動車株式会社 積層基板とその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
JPS5248972A (en) * 1975-10-17 1977-04-19 Seiko Instr & Electronics Ltd Circuit board for semiconductor device
DE2657212C3 (de) * 1976-12-17 1982-09-02 Schoeller & Co Elektronik Gmbh, 3552 Wetter Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
ZA783270B (en) * 1977-07-06 1979-06-27 Motorola Inc Molded circuit board
US4179310A (en) * 1978-07-03 1979-12-18 National Semiconductor Corporation Laser trim protection process
US4544442A (en) * 1981-04-14 1985-10-01 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
DE3119884C1 (de) * 1981-05-19 1982-11-04 Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
DE3140061C1 (de) * 1981-10-08 1983-02-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von starre und flexible Bereiche aufweisenden Leiterplatten
US4480288A (en) * 1982-12-27 1984-10-30 International Business Machines Corporation Multi-layer flexible film module
JPS6041249A (ja) * 1983-08-17 1985-03-04 Nec Corp 混成集積回路装置
JPS60194553A (ja) * 1984-03-16 1985-10-03 Nec Corp 混成集積回路装置
US4622058A (en) * 1984-06-22 1986-11-11 International Business Machines Corporation Formation of a multi-layer glass-metallized structure formed on and interconnected to multi-layered-metallized ceramic substrate
JPS6195792A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd 印刷配線板の製造方法
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
GB2189084B (en) * 1986-04-10 1989-11-22 Stc Plc Integrated circuit package
US4786358A (en) * 1986-08-08 1988-11-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming a pattern of a film on a substrate with a laser beam
JPS63114150A (ja) * 1986-10-30 1988-05-19 Nec Corp 混成集積回路
US4789770A (en) * 1987-07-15 1988-12-06 Westinghouse Electric Corp. Controlled depth laser drilling system
JPS6476747A (en) * 1987-09-17 1989-03-22 Ibiden Co Ltd Semiconductor mounting board
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
US4894115A (en) * 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
JPH06195792A (ja) * 1992-12-22 1994-07-15 Mitsubishi Electric Corp 光磁気ディスク装置

Also Published As

Publication number Publication date
JP2676112B2 (ja) 1997-11-12
GB9000550D0 (en) 1990-03-14
DE4006063A1 (de) 1990-11-08
JPH02292846A (ja) 1990-12-04
FR2646584A1 (fr) 1990-11-02
GB2231205B (en) 1993-08-04
US5088008A (en) 1992-02-11
DE4006063C2 (de) 1994-09-15
GB2231205A (en) 1990-11-07
KR930004250B1 (ko) 1993-05-22
US5022960A (en) 1991-06-11
KR900019202A (ko) 1990-12-24

Similar Documents

Publication Publication Date Title
FR2646584B1 (fr) Methode de fabrication de circuits imprimes permettant le montage de composants electroniques
FR2518863B1 (fr) Procede de fabrication de plaquettes de circuits pour montages electroniques
DE69329916D1 (de) Herstellungsverfahren elektronischer Komponenten für Schaltungsanordnung
DE69316877D1 (de) Mehrschichtiger verbinder für integrierte mikrowellenschaltungsmodule
FI951142L (fi) Menetelmä integroitujen piirilaitteiden valmistamiseksi
FI972423L (fi) Painetun piirilevyn valmistus
FI904210A7 (fi) Parannettu menetelmä painettujen piirien valmistamiseksi
EP0484013A3 (en) Method for manufacturing an integrated circuit
DE69127154D1 (de) Anordnung zur Montierung elektronischer Bauteile
FR2733386B1 (fr) Micro-refroidisseur pour composants electroniques et son procede de fabrication
EP0478320A3 (en) Method for manufacturing printed circuit board
GB8314294D0 (en) Mounting multilead components on circuit boards
DE69207520D1 (de) Elektrische Leiterplattenbaugruppe und Herstellungsverfahren für eine elektrische Leiterplattenbaugruppe
KR910009129A (ko) 도체패턴형성용 감광성수지조성물과 다층프린트회로기판 및 그의 제조방법
FR2613170B1 (fr) Procede de fabrication de structures de circuit multicouche
DE69300615D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.
FR2613175B1 (fr) Procede de montage, sur une plaquette a circuits imprimes, de composants electroniques, a montage en surface
GB8415652D0 (en) Mounting electronic circuit element on circuit board
FR2513062B1 (fr) Machine de montage successif de composants electroniques sur des plaquettes de circuit imprime
FR2652703B1 (fr) Procede de montage d'un composant electronique sur une carte de circuit imprime.
FR2684836B3 (fr) Procede de fabrication de cartes de circuits imprimes a trous de via.
EP0781079A4 (fr) Procede de fabrication d'un circuit electronique
EP0572121A3 (fr) Procédé de fabrication de plaquettes de circuits.
GB8314293D0 (en) Mounting multilead components on circuit boards
DE69329928D1 (de) Herstellungsverfahren für integrierten Schaltkreis