IE49192B1 - A process for dry sensitization of an insulating surface - Google Patents

A process for dry sensitization of an insulating surface

Info

Publication number: IE49192B1
Authority: IE; Ireland
Prior art keywords: powder; substrate; process according; metal; compound
Prior art date: 1979-04-11

Application number

IE732/80A

Other languages

English (en)

Other versions

IE800732L (en

Original Assignee

Neselco As

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-04-11

Filing date

1980-04-10

Publication date

1985-08-21

1980-04-10 Application filed by Neselco As filed Critical Neselco As

1980-10-11 Publication of IE800732L publication Critical patent/IE800732L/xx

1985-08-21 Publication of IE49192B1 publication Critical patent/IE49192B1/en

Links

238000000034 method Methods 0.000 title claims abstract description 89
230000008569 process Effects 0.000 title claims abstract description 63
206010070834 Sensitisation Diseases 0.000 title claims description 21
230000008313 sensitization Effects 0.000 title claims description 21
239000000758 substrate Substances 0.000 claims abstract description 63
239000000843 powder Substances 0.000 claims abstract description 54
150000001875 compounds Chemical class 0.000 claims abstract description 25
239000002245 particle Substances 0.000 claims abstract description 23
150000002736 metal compounds Chemical class 0.000 claims abstract description 6
229910052751 metal Inorganic materials 0.000 claims description 29
239000002184 metal Substances 0.000 claims description 29
239000012190 activator Substances 0.000 claims description 21
239000000463 material Substances 0.000 claims description 17
230000008021 deposition Effects 0.000 claims description 13
239000003960 organic solvent Substances 0.000 claims description 12
238000007772 electroless plating Methods 0.000 claims description 9
238000001035 drying Methods 0.000 claims description 7
230000008018 melting Effects 0.000 claims description 4
238000002844 melting Methods 0.000 claims description 4
229920001169 thermoplastic Polymers 0.000 claims description 3
239000004416 thermosoftening plastic Substances 0.000 claims description 3
239000000470 constituent Substances 0.000 claims description 2
239000011358 absorbing material Substances 0.000 claims 1
239000004033 plastic Substances 0.000 abstract description 16
229920003023 plastic Polymers 0.000 abstract description 16
230000001235 sensitizing effect Effects 0.000 abstract description 11
238000012546 transfer Methods 0.000 abstract description 10
238000007747 plating Methods 0.000 abstract description 9
238000001465 metallisation Methods 0.000 abstract description 6
239000000243 solution Substances 0.000 description 18
KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
238000000151 deposition Methods 0.000 description 12
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
238000004519 manufacturing process Methods 0.000 description 7
150000003606 tin compounds Chemical class 0.000 description 7
239000003638 chemical reducing agent Substances 0.000 description 6
239000002904 solvent Substances 0.000 description 6
238000001994 activation Methods 0.000 description 5
239000010949 copper Substances 0.000 description 5
238000009826 distribution Methods 0.000 description 5
229910052763 palladium Inorganic materials 0.000 description 5
238000001556 precipitation Methods 0.000 description 5
238000000454 electroless metal deposition Methods 0.000 description 4
238000001704 evaporation Methods 0.000 description 4
230000007246 mechanism Effects 0.000 description 4
229910000510 noble metal Inorganic materials 0.000 description 4
238000001694 spray drying Methods 0.000 description 4
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
230000004913 activation Effects 0.000 description 3
230000008901 benefit Effects 0.000 description 3
239000003054 catalyst Substances 0.000 description 3
230000003197 catalytic effect Effects 0.000 description 3
239000004020 conductor Substances 0.000 description 3
230000008020 evaporation Effects 0.000 description 3
238000010438 heat treatment Methods 0.000 description 3
238000003384 imaging method Methods 0.000 description 3
238000003756 stirring Methods 0.000 description 3
229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
239000003795 chemical substances by application Substances 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
238000011161 development Methods 0.000 description 2
238000005530 etching Methods 0.000 description 2
238000001914 filtration Methods 0.000 description 2
238000005470 impregnation Methods 0.000 description 2
239000004922 lacquer Substances 0.000 description 2
239000007788 liquid Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
239000002952 polymeric resin Substances 0.000 description 2
229920000915 polyvinyl chloride Polymers 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
238000007639 printing Methods 0.000 description 2
230000009467 reduction Effects 0.000 description 2
239000012047 saturated solution Substances 0.000 description 2
235000011150 stannous chloride Nutrition 0.000 description 2
229920003002 synthetic resin Polymers 0.000 description 2
IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 2
AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 2
ZSUXOVNWDZTCFN-UHFFFAOYSA-L tin(ii) bromide Chemical compound Br[Sn]Br ZSUXOVNWDZTCFN-UHFFFAOYSA-L 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
FGDUWKHMIDZUIX-UHFFFAOYSA-J O[Sn](Cl)(Cl)Cl Chemical class O[Sn](Cl)(Cl)Cl FGDUWKHMIDZUIX-UHFFFAOYSA-J 0.000 description 1
229910002666 PdCl2 Inorganic materials 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
150000001252 acrylic acid derivatives Chemical class 0.000 description 1
230000003213 activating effect Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
238000013459 approach Methods 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
239000003125 aqueous solvent Substances 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
238000000889 atomisation Methods 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
239000013522 chelant Substances 0.000 description 1
238000009388 chemical precipitation Methods 0.000 description 1
238000006243 chemical reaction Methods 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000003086 colorant Substances 0.000 description 1
239000008139 complexing agent Substances 0.000 description 1
238000010276 construction Methods 0.000 description 1
238000000586 desensitisation Methods 0.000 description 1
230000001627 detrimental effect Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
230000007613 environmental effect Effects 0.000 description 1
230000002349 favourable effect Effects 0.000 description 1
230000006870 function Effects 0.000 description 1
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
229910052737 gold Inorganic materials 0.000 description 1
239000010931 gold Substances 0.000 description 1
238000000227 grinding Methods 0.000 description 1
XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
238000010849 ion bombardment Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
239000011817 metal compound particle Substances 0.000 description 1
239000002923 metal particle Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
230000000737 periodic effect Effects 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229910052697 platinum Inorganic materials 0.000 description 1
229920000058 polyacrylate Polymers 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920000307 polymer substrate Polymers 0.000 description 1
230000005855 radiation Effects 0.000 description 1
239000002516 radical scavenger Substances 0.000 description 1
238000011160 research Methods 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000003892 spreading Methods 0.000 description 1
230000007480 spreading Effects 0.000 description 1
239000007858 starting material Substances 0.000 description 1
230000003068 static effect Effects 0.000 description 1
238000005728 strengthening Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
239000000725 suspension Substances 0.000 description 1
239000012815 thermoplastic material Substances 0.000 description 1
-1 tin (II) compound Chemical class 0.000 description 1
238000001947 vapour-phase growth Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/225—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 using contact-printing
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/65—Apparatus which relate to the handling of copy material
- G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
- G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
General Physics & Mathematics (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Photoreceptors In Electrophotography (AREA)
Developing Agents For Electrophotography (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

IE732/80A 1979-04-11 1980-04-10 A process for dry sensitization of an insulating surface IE49192B1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DK150779A DK153337C (da)	1979-04-11	1979-04-11	Fremgangsmaade til toer sensibilisering af en isolerende overflade

Publications (2)

Publication Number	Publication Date
IE800732L IE800732L (en)	1980-10-11
IE49192B1 true IE49192B1 (en)	1985-08-21

Family

ID=8105559

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IE732/80A IE49192B1 (en)	1979-04-11	1980-04-10	A process for dry sensitization of an insulating surface

Country Status (12)

Country	Link
US (1)	US4504529A (2)
EP (1)	EP0026211B1 (2)
JP (1)	JPH0210593B2 (2)
CA (1)	CA1162778A (2)
DE (1)	DE3067809D1 (2)
DK (1)	DK153337C (2)
IE (1)	IE49192B1 (2)
IL (1)	IL59807A (2)
IT (1)	IT1128410B (2)
NO (1)	NO154370C (2)
WO (1)	WO1980002222A1 (2)
ZA (1)	ZA802121B (2)

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DK427780A (da) *	1980-10-10	1982-04-11	Neselco As	Pulver til brug ved toer sensibilisering for stroemloes metallisering
DK148327C (da) *	1981-07-24	1985-11-04	Neselco As	Pulver til brug ved toer sensibilisering for stroemloes metallisering
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US4851320A (en) *	1988-05-23	1989-07-25	Tektronix, Inc.	Method of forming a pattern of conductor runs on a dielectric sheet
US5213850A (en) *	1989-03-24	1993-05-25	Nippon Paint Co., Ltd.	Process for plating a metallic deposit between functional pattern lines on a substrate
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US20040265531A1 (en) *	2003-06-30	2004-12-30	Mckean Dennis R.	Sliders bonded by a debondable silicon-based encapsulant
EP2003939A1 (en)	2007-06-14	2008-12-17	Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO	Method for preparing a pattern for a 3-dimensional electric circuit
JP2013517123A (ja) *	2010-01-14	2013-05-16	ザリージェンツオブザユニバーシティオブカリフォルニア	電気伝導性ナノ構造体の薄膜を成長させる汎用溶液
SG11201502787XA (en)	2012-10-12	2015-05-28	Univ California	Polyaniline membranes, uses, and methods thereto
DK2996799T3 (da)	2013-05-15	2021-10-18	Univ California	Polyanilinmembraner dannet ved fase-inversion til direkte osmoseanvendelser
JP6674383B2 (ja)	2014-04-08	2020-04-01	ザリージェンツオブザユニバーシティオブカリフォルニア	ポリアニリン系耐塩素性親水性濾過膜

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DE2159467A1 (de) *	1970-12-02	1972-07-13	Minolta Camera Kk	Verfahren zur Herstellung eines flüssigen Entwicklers für die Elektrophotographie
US3745045A (en) *	1971-01-06	1973-07-10	R Brenneman	Electrical contact surface using an ink containing a plating catalyst
US3880689A (en) *	1971-09-30	1975-04-29	Eastman Kodak Co	Magnetic developer containing an electroless plating sensitizer, and method of using same
BE789988A (fr) *	1971-10-12	1973-04-12	Xerox Corp	Composition de revelateur et procede pour son emploi
CA986770A (en) *	1972-04-10	1976-04-06	Jack C. Goldfrank	Pressure fixable magnetic toners
JPS511434B2 (2) *	1972-05-15	1976-01-17
JPS5187042A (2) *	1975-01-29	1976-07-30	Hitachi Metals Ltd
JPS5196330A (2) *	1975-02-21	1976-08-24
US4042730A (en) *	1976-03-29	1977-08-16	Bell Telephone Laboratories, Incorporated	Process for electroless plating using separate sensitization and activation steps
JPS5841760B2 (ja) *	1976-05-29	1983-09-14	神崎製紙株式会社	呈色剤の製造方法
NL7704238A (nl) *	1977-04-19	1978-10-23	Philips Nv	Werkwijze voor het additief vervaardigen van bedradingspatronen.
US4307168A (en) *	1977-05-05	1981-12-22	Eastman Kodak Company	Amplification of developed electrographic image patterns
JPS54126959A (en) *	1978-03-25	1979-10-02	Nippon Mektron Kk	Method of producing circuit board

1979
- 1979-04-11 DK DK150779A patent/DK153337C/da not_active IP Right Cessation
1980
- 1980-04-10 IL IL59807A patent/IL59807A/xx unknown
- 1980-04-10 IT IT67559/80A patent/IT1128410B/it active
- 1980-04-10 CA CA000349530A patent/CA1162778A/en not_active Expired
- 1980-04-10 ZA ZA00802121A patent/ZA802121B/xx unknown
- 1980-04-10 IE IE732/80A patent/IE49192B1/en not_active IP Right Cessation
- 1980-04-11 WO PCT/DK1980/000023 patent/WO1980002222A1/en not_active Ceased
- 1980-04-11 DE DE8080900719T patent/DE3067809D1/de not_active Expired
- 1980-04-11 JP JP55500874A patent/JPH0210593B2/ja not_active Expired - Lifetime
- 1980-10-23 EP EP80900719A patent/EP0026211B1/en not_active Expired
- 1980-12-09 NO NO80803710A patent/NO154370C/no unknown
1982
- 1982-06-18 US US06/389,934 patent/US4504529A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US4504529A (en)	1985-03-12
NO154370B (no)	1986-05-26
ZA802121B (en)	1981-04-29
WO1980002222A1 (en)	1980-10-16
NO803710L (no)	1980-12-09
EP0026211A1 (en)	1981-04-08
CA1162778A (en)	1984-02-28
NO154370C (no)	1986-09-03
JPS56500435A (2)	1981-04-02
IT8067559A0 (it)	1980-04-10
DK153337B (da)	1988-07-04
JPH0210593B2 (2)	1990-03-08
IE800732L (en)	1980-10-11
EP0026211B1 (en)	1984-05-16
DK153337C (da)	1988-11-14
DK150779A (da)	1980-10-12
IL59807A (en)	1983-11-30
IT1128410B (it)	1986-05-28
DE3067809D1 (en)	1984-06-20

Legal Events

Date	Code	Title	Description
1994-01-12	MM4A	Patent lapsed

Publication	Publication Date	Title
EP0026211B1 (en)	1984-05-16	A method for dry sensitization of an insulating surface
US3791340A (en)	1974-02-12	Method of depositing a metal pattern on a surface
JP2016196708A (ja)	2016-11-24	非伝導性表面上に伝導性像を形成するための方法
JP2014525992A5 (2)	2016-09-29
JPH0529319B2 (2)	1993-04-30
US7939171B2 (en)	2011-05-10	Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit
US3674485A (en)	1972-07-04	Method of manufacturing electrically conducting metal layers
CA1213993A (en)	1986-11-12	Dry sensitization plastic powder for electroless metal deposition
US3642476A (en)	1972-02-15	Method of preparing glass masters
JP3418555B2 (ja)	2003-06-23	被覆金属粒子およびこれを用いた電子写真用トナー
EP0163089B1 (en)	1988-08-10	Process for activating a substrate for electroless deposition of a conductive metal
JP3217477B2 (ja)	2001-10-09	プリント配線板の製造方法
US4230788A (en)	1980-10-28	Method of manufacturing an external electrically conducting metal pattern
US4084968A (en)	1978-04-18	Method of manufacturing electrically conductive metal layers on substrates
US4085285A (en)	1978-04-18	Method of manufacturing printed circuit boards
US6207351B1 (en)	2001-03-27	Method for pattern seeding and plating of high density printed circuit boards
US3791939A (en)	1974-02-12	Method of selectively depositing a metal on a surface
JP7460047B2 (ja)	2024-04-02	電子写真用トナーによる金属パターンの作製方法
CA1082817A (en)	1980-07-29	Method of depositing metal conducting patterns on large area surfaces
JPH0431463A (ja)	1992-02-03	電気回路材料
FI73243C (fi)	1987-09-10	Pulver foer anvaendning vid torraktivering foer stroemloes metallisering.
WO1998029579A1 (en)	1998-07-09	Method of depositing a metallic film
DE3134507C2 (2)	1989-02-09
KR910011096A (ko)	1991-06-29	은 확산 전사 화상법을 이용한 전자회로
EP0056093A2 (en)	1982-07-21	Process for producing a printed circuit board