JPH0210593B2 - - Google Patents

Info

Publication number: JPH0210593B2
Authority: JP; Japan
Prior art keywords: powder; compound; substrate; plastic material; dielectric powder
Prior art date: 1979-04-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP55500874A

Other languages

English (en)

Japanese (ja)

Other versions

JPS56500435A (2

Inventor

Gonaa Soorensen

Reo Gorubado Subensen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

PURATONEKU AS

Original Assignee

PURATONEKU AS

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-04-11

Filing date

1980-04-11

Publication date

1990-03-08

1980-04-11 Application filed by PURATONEKU AS filed Critical PURATONEKU AS

1981-04-02 Publication of JPS56500435A publication Critical patent/JPS56500435A/ja

1990-03-08 Publication of JPH0210593B2 publication Critical patent/JPH0210593B2/ja

2000-04-11 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

239000000843 powder Substances 0.000 claims description 52
238000000034 method Methods 0.000 claims description 51
239000000758 substrate Substances 0.000 claims description 26
239000002245 particle Substances 0.000 claims description 24
239000004033 plastic Substances 0.000 claims description 20
229920003023 plastic Polymers 0.000 claims description 20
150000001875 compounds Chemical class 0.000 claims description 17
239000000463 material Substances 0.000 claims description 17
239000003960 organic solvent Substances 0.000 claims description 13
238000012546 transfer Methods 0.000 claims description 13
206010070834 Sensitisation Diseases 0.000 claims description 7
230000008313 sensitization Effects 0.000 claims description 7
239000000126 substance Substances 0.000 claims description 4
230000005855 radiation Effects 0.000 claims description 3
230000001235 sensitizing effect Effects 0.000 claims description 3
229920001169 thermoplastic Polymers 0.000 claims description 3
239000004416 thermosoftening plastic Substances 0.000 claims description 3
238000000454 electroless metal deposition Methods 0.000 claims 1
239000000243 solution Substances 0.000 description 10
239000002184 metal Substances 0.000 description 9
229910052751 metal Inorganic materials 0.000 description 9
150000003606 tin compounds Chemical class 0.000 description 8
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 7
238000007747 plating Methods 0.000 description 7
238000000151 deposition Methods 0.000 description 6
230000008569 process Effects 0.000 description 6
239000010949 copper Substances 0.000 description 5
230000008021 deposition Effects 0.000 description 5
230000008018 melting Effects 0.000 description 5
238000002844 melting Methods 0.000 description 5
239000002904 solvent Substances 0.000 description 5
238000001035 drying Methods 0.000 description 4
238000005530 etching Methods 0.000 description 4
238000001694 spray drying Methods 0.000 description 4
238000003756 stirring Methods 0.000 description 4
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
238000009826 distribution Methods 0.000 description 3
230000008020 evaporation Effects 0.000 description 3
238000001704 evaporation Methods 0.000 description 3
150000002736 metal compounds Chemical class 0.000 description 3
229920000642 polymer Polymers 0.000 description 3
238000003892 spreading Methods 0.000 description 3
230000007480 spreading Effects 0.000 description 3
239000003125 aqueous solvent Substances 0.000 description 2
229910052802 copper Inorganic materials 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
238000007654 immersion Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229920000058 polyacrylate Polymers 0.000 description 2
239000004800 polyvinyl chloride Substances 0.000 description 2
229920000915 polyvinyl chloride Polymers 0.000 description 2
238000001556 precipitation Methods 0.000 description 2
238000002360 preparation method Methods 0.000 description 2
238000011160 research Methods 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
239000000725 suspension Substances 0.000 description 2
239000012815 thermoplastic material Substances 0.000 description 2
FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Chemical compound O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 description 2
238000009736 wetting Methods 0.000 description 2
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
239000004952 Polyamide Substances 0.000 description 1
-1 SnCl 2 2H 2 O Chemical class 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
VAUDGNMGIQYSMK-UHFFFAOYSA-N [H]O[Cl][Sn] Chemical compound [H]O[Cl][Sn] VAUDGNMGIQYSMK-UHFFFAOYSA-N 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
238000000889 atomisation Methods 0.000 description 1
230000008859 change Effects 0.000 description 1
239000003153 chemical reaction reagent Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
238000010276 construction Methods 0.000 description 1
230000008094 contradictory effect Effects 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
230000001419 dependent effect Effects 0.000 description 1
238000000586 desensitisation Methods 0.000 description 1
238000011161 development Methods 0.000 description 1
230000000694 effects Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
238000001914 filtration Methods 0.000 description 1
230000006870 function Effects 0.000 description 1
XLYOFNOQVPJJNP-ZSJDYOACSA-N heavy water Substances [2H]O[2H] XLYOFNOQVPJJNP-ZSJDYOACSA-N 0.000 description 1
238000005470 impregnation Methods 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
239000011817 metal compound particle Substances 0.000 description 1
239000002923 metal particle Substances 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
150000002739 metals Chemical group 0.000 description 1
239000000203 mixture Substances 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
238000005325 percolation Methods 0.000 description 1
229920001568 phenolic resin Polymers 0.000 description 1
239000005011 phenolic resin Substances 0.000 description 1
229920002647 polyamide Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
239000011148 porous material Substances 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
239000002516 radical scavenger Substances 0.000 description 1
230000035484 reaction time Effects 0.000 description 1
239000012047 saturated solution Substances 0.000 description 1
239000007787 solid Substances 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
238000012360 testing method Methods 0.000 description 1
AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
238000009827 uniform distribution Methods 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1
238000001947 vapour-phase growth Methods 0.000 description 1
238000003466 welding Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/225—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 using contact-printing
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/65—Apparatus which relate to the handling of copy material
- G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
- G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Metallurgy (AREA)
General Physics & Mathematics (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Photoreceptors In Electrophotography (AREA)
Developing Agents For Electrophotography (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

JP55500874A 1979-04-11 1980-04-11 Expired - Lifetime JPH0210593B2 (2)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DK150779A DK153337C (da)	1979-04-11	1979-04-11	Fremgangsmaade til toer sensibilisering af en isolerende overflade

Publications (2)

Publication Number	Publication Date
JPS56500435A JPS56500435A (2)	1981-04-02
JPH0210593B2 true JPH0210593B2 (2)	1990-03-08

Family

ID=8105559

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP55500874A Expired - Lifetime JPH0210593B2 (2)	1979-04-11	1980-04-11

Country Status (12)

Country	Link
US (1)	US4504529A (2)
EP (1)	EP0026211B1 (2)
JP (1)	JPH0210593B2 (2)
CA (1)	CA1162778A (2)
DE (1)	DE3067809D1 (2)
DK (1)	DK153337C (2)
IE (1)	IE49192B1 (2)
IL (1)	IL59807A (2)
IT (1)	IT1128410B (2)
NO (1)	NO154370C (2)
WO (1)	WO1980002222A1 (2)
ZA (1)	ZA802121B (2)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DK427780A (da) *	1980-10-10	1982-04-11	Neselco As	Pulver til brug ved toer sensibilisering for stroemloes metallisering
DK148327C (da) *	1981-07-24	1985-11-04	Neselco As	Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3134507A1 (de) *	1981-09-01	1983-03-17	Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt	"verfahren zur selektiven chemischen metallabscheidung"
DK153572C (da) *	1982-02-18	1988-12-19	Platonec Aps	Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
IT1184408B (it) *	1985-04-09	1987-10-28	Telettra Lab Telefon	Processo per la fabbricazione di piastre e circuiti stampati,e prodotti relativi
US5244525A (en) *	1987-11-02	1993-09-14	Kimberly-Clark Corporation	Methods for bonding, cutting and printing polymeric materials using xerographic printing of IR absorbing material
US4851320A (en) *	1988-05-23	1989-07-25	Tektronix, Inc.	Method of forming a pattern of conductor runs on a dielectric sheet
US5213850A (en) *	1989-03-24	1993-05-25	Nippon Paint Co., Ltd.	Process for plating a metallic deposit between functional pattern lines on a substrate
DK0487291T3 (da)	1990-11-19	2000-01-03	Loctite Corp	Fotohærdende silikonekomposition og fremgangsmåde til fremstilling af samme
US5269980A (en) *	1991-08-05	1993-12-14	Northeastern University	Production of polymer particles in powder form using an atomization technique
DE4142658A1 (de) *	1991-12-19	1993-06-24	Siemens Ag	Verfahren zum aufbringen von lot auf eine leiterplatte
US5304447A (en) *	1992-02-11	1994-04-19	Elf Technologies, Inc.	Plateable toner and method for producing the same
DE4319759A1 (de) *	1993-06-15	1994-12-22	Bayer Ag	Pulvermischungen zum Metallisieren von Substratoberflächen
DE19731346C2 (de) *	1997-06-06	2003-09-25	Lpkf Laser & Electronics Ag	Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
DE19942054A1 (de) *	1999-09-03	2001-12-06	Schott Glas	Verfahren zur Herstellung einer gedruckten Schaltung
PL365417A1 (en) *	2001-06-04	2005-01-10	Qinetiq Limited	Patterning method
GB2381274A (en) *	2001-10-29	2003-04-30	Qinetiq Ltd	High resolution patterning method
GB2382798A (en) *	2001-12-04	2003-06-11	Qinetiq Ltd	Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
US20040265531A1 (en) *	2003-06-30	2004-12-30	Mckean Dennis R.	Sliders bonded by a debondable silicon-based encapsulant
EP2003939A1 (en)	2007-06-14	2008-12-17	Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO	Method for preparing a pattern for a 3-dimensional electric circuit
JP2013517123A (ja) *	2010-01-14	2013-05-16	ザリージェンツオブザユニバーシティオブカリフォルニア	電気伝導性ナノ構造体の薄膜を成長させる汎用溶液
SG11201502787XA (en)	2012-10-12	2015-05-28	Univ California	Polyaniline membranes, uses, and methods thereto
DK2996799T3 (da)	2013-05-15	2021-10-18	Univ California	Polyanilinmembraner dannet ved fase-inversion til direkte osmoseanvendelser
JP6674383B2 (ja)	2014-04-08	2020-04-01	ザリージェンツオブザユニバーシティオブカリフォルニア	ポリアニリン系耐塩素性親水性濾過膜

Family Cites Families (33)

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Publication number	Priority date	Publication date	Assignee	Title
GB299903A (en) *	1927-08-02	1928-11-02	Albert Ivan Gates Warren	Improvements in processes for coating non-conducting substances with metals
GB567503A (en) *	1943-06-02	1945-02-16	Frank Enoch Kerridge	Improvements in or relating to the production of metallic designs on non-metallic materials
US2910351A (en) *	1955-01-03	1959-10-27	Gen Electric	Method of making printed circuit
US2947625A (en) *	1955-12-21	1960-08-02	Ibm	Method of manufacturing printed circuits
US2966429A (en) *	1956-08-31	1960-12-27	Gen Electric	Method of and apparatus for making printed circuits
US3043685A (en) *	1957-07-18	1962-07-10	Xerox Corp	Xerographic and magnetic image recording and reproducing
US2939804A (en) *	1958-01-23	1960-06-07	Uarco Inc	Resin particle coated with metal
NL113853C (2) *	1959-07-22
US3231374A (en) *	1960-09-02	1966-01-25	Rca Corp	Methods for preparing etch resists using an electrostatic image developer composition
US3275436A (en) *	1962-07-24	1966-09-27	Xerox Corp	Method of image reproduction utilizing a uniform releasable surface film
US3226256A (en) *	1963-01-02	1965-12-28	Jr Frederick W Schneble	Method of making printed circuits
US3350202A (en) *	1964-10-27	1967-10-31	Union Carbide Corp	Method of xerographically photosensitizing planographic printing plates
GB1175832A (en) *	1965-10-12	1969-12-23	Emi Ltd	Improvements relating to the production of an Electrical Conductor Adhering to an Insulating Support
US3494790A (en) *	1965-10-29	1970-02-10	Texas Instruments Inc	Preparation of welding surfaces on semiconductors
US3942983A (en) *	1967-06-09	1976-03-09	Minnesota Mining And Manufacturing Company	Electroless deposition of a non-noble metal on light generated nuclei of a metal more noble than silver
FR1593570A (2) *	1967-09-14	1970-06-01
NL157659B (nl) *	1967-09-22	1978-08-15	Philips Nv	Werkwijze voor het langs fotografische weg vervaardigen van elektrisch geleidende koperpatronen.
NL6808469A (2) *	1968-06-15	1969-12-17
CA929705A (en) *	1969-01-13	1973-07-10	Ransburg Corporation	Deposition materials and methods
US3691993A (en) *	1970-11-23	1972-09-19	Ibm	Apparatus for transferring developed image
DE2159467A1 (de) *	1970-12-02	1972-07-13	Minolta Camera Kk	Verfahren zur Herstellung eines flüssigen Entwicklers für die Elektrophotographie
US3745045A (en) *	1971-01-06	1973-07-10	R Brenneman	Electrical contact surface using an ink containing a plating catalyst
US3880689A (en) *	1971-09-30	1975-04-29	Eastman Kodak Co	Magnetic developer containing an electroless plating sensitizer, and method of using same
BE789988A (fr) *	1971-10-12	1973-04-12	Xerox Corp	Composition de revelateur et procede pour son emploi
CA986770A (en) *	1972-04-10	1976-04-06	Jack C. Goldfrank	Pressure fixable magnetic toners
JPS511434B2 (2) *	1972-05-15	1976-01-17
JPS5187042A (2) *	1975-01-29	1976-07-30	Hitachi Metals Ltd
JPS5196330A (2) *	1975-02-21	1976-08-24
US4042730A (en) *	1976-03-29	1977-08-16	Bell Telephone Laboratories, Incorporated	Process for electroless plating using separate sensitization and activation steps
JPS5841760B2 (ja) *	1976-05-29	1983-09-14	神崎製紙株式会社	呈色剤の製造方法
NL7704238A (nl) *	1977-04-19	1978-10-23	Philips Nv	Werkwijze voor het additief vervaardigen van bedradingspatronen.
US4307168A (en) *	1977-05-05	1981-12-22	Eastman Kodak Company	Amplification of developed electrographic image patterns
JPS54126959A (en) *	1978-03-25	1979-10-02	Nippon Mektron Kk	Method of producing circuit board

1979
- 1979-04-11 DK DK150779A patent/DK153337C/da not_active IP Right Cessation
1980
- 1980-04-10 IL IL59807A patent/IL59807A/xx unknown
- 1980-04-10 IT IT67559/80A patent/IT1128410B/it active
- 1980-04-10 CA CA000349530A patent/CA1162778A/en not_active Expired
- 1980-04-10 ZA ZA00802121A patent/ZA802121B/xx unknown
- 1980-04-10 IE IE732/80A patent/IE49192B1/en not_active IP Right Cessation
- 1980-04-11 WO PCT/DK1980/000023 patent/WO1980002222A1/en not_active Ceased
- 1980-04-11 DE DE8080900719T patent/DE3067809D1/de not_active Expired
- 1980-04-11 JP JP55500874A patent/JPH0210593B2/ja not_active Expired - Lifetime
- 1980-10-23 EP EP80900719A patent/EP0026211B1/en not_active Expired
- 1980-12-09 NO NO80803710A patent/NO154370C/no unknown
1982
- 1982-06-18 US US06/389,934 patent/US4504529A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
US4504529A (en)	1985-03-12
NO154370B (no)	1986-05-26
ZA802121B (en)	1981-04-29
WO1980002222A1 (en)	1980-10-16
NO803710L (no)	1980-12-09
EP0026211A1 (en)	1981-04-08
CA1162778A (en)	1984-02-28
NO154370C (no)	1986-09-03
JPS56500435A (2)	1981-04-02
IE49192B1 (en)	1985-08-21
IT8067559A0 (it)	1980-04-10
DK153337B (da)	1988-07-04
IE800732L (en)	1980-10-11
EP0026211B1 (en)	1984-05-16
DK153337C (da)	1988-11-14
DK150779A (da)	1980-10-12
IL59807A (en)	1983-11-30
IT1128410B (it)	1986-05-28
DE3067809D1 (en)	1984-06-20

Publication	Publication Date	Title
US4504529A (en)	1985-03-12	Xerographic method for dry sensitization and electroless coating of an insulating surface and a powder for use with the method
US5437916A (en)	1995-08-01	Flexible printed circuits
US4701351A (en)	1987-10-20	Seeding process for electroless metal deposition
US3628999A (en)	1971-12-21	Plated through hole printed circuit boards
US3031344A (en)	1962-04-24	Production of electrical printed circuits
JP2825558B2 (ja)	1998-11-18	組成物及びこの樹脂組成物を使用した多層プリント回路板の製造方法
KR100188481B1 (ko)	1999-06-15	유전기질과 도금기질을 직접 전기도금 하는 방법
JPH02502233A (ja)	1990-07-19	非導電性重合体の選択的ドーピングによる電子装置の製造
US4710401A (en)	1987-12-01	Method of printing electrically conductive images on dielectric substrates
JPS60206085A (ja)	1985-10-17	プリント回路板の製造法
US3615457A (en)	1971-10-26	Photopolymerizable compositions and processes of applying the same
JPS63127598A (ja)	1988-05-31	自己シールド性多層回路板
US3674485A (en)	1972-07-04	Method of manufacturing electrically conducting metal layers
US4121007A (en)	1978-10-17	Printed circuit board made by dispersion imaging
JPS59102953A (ja)	1984-06-14	導電性の合成樹脂組成物
IE54368B1 (en)	1989-09-13	Powder for use in dry sensitization for electroless metal deposition
JPH0454399B2 (2)	1992-08-31
CA1062071A (en)	1979-09-11	Method of manufacturing an external electrically conducting metal pattern
JPS599161A (ja)	1984-01-18	無電気めっき処理方法
US4084968A (en)	1978-04-18	Method of manufacturing electrically conductive metal layers on substrates
CA1082817A (en)	1980-07-29	Method of depositing metal conducting patterns on large area surfaces
JPS58116532A (ja)	1983-07-11	パタ−ン形成方法
CA1045909A (en)	1979-01-09	Processes and products of sensitizing substrates
JP2003514995A (ja)	2003-04-22	誘電体の金属化方法
JPH093653A (ja)	1997-01-07	導電材料の製造方法