IL128430A - Method for producing high surface area foil electrodes - Google Patents
Method for producing high surface area foil electrodesInfo
- Publication number
- IL128430A IL128430A IL12843099A IL12843099A IL128430A IL 128430 A IL128430 A IL 128430A IL 12843099 A IL12843099 A IL 12843099A IL 12843099 A IL12843099 A IL 12843099A IL 128430 A IL128430 A IL 128430A
- Authority
- IL
- Israel
- Prior art keywords
- valve metal
- substrate
- electrode
- aluminum
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5853—Oxidation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
- H10D1/712—Electrodes having non-planar surfaces, e.g. formed by texturisation being rough surfaces, e.g. using hemispherical grains
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/033,664 US6287673B1 (en) | 1998-03-03 | 1998-03-03 | Method for producing high surface area foil electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL128430A0 IL128430A0 (en) | 2000-01-31 |
| IL128430A true IL128430A (en) | 2004-09-27 |
Family
ID=21871724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL12843099A IL128430A (en) | 1998-03-03 | 1999-02-09 | Method for producing high surface area foil electrodes |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6287673B1 (de) |
| EP (1) | EP0940828B1 (de) |
| JP (1) | JP3746627B2 (de) |
| DE (1) | DE69939916D1 (de) |
| IL (1) | IL128430A (de) |
Families Citing this family (61)
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|---|---|---|---|---|
| US6287673B1 (en) * | 1998-03-03 | 2001-09-11 | Acktar Ltd. | Method for producing high surface area foil electrodes |
| IL141592A (en) * | 2001-02-22 | 2007-02-11 | Zvi Finkelstein | Electrolytic capacitors and method for making them |
| JP3329380B2 (ja) * | 1999-09-21 | 2002-09-30 | 日本電気株式会社 | 半導体装置およびその製造方法 |
| DE10005124C2 (de) * | 2000-02-07 | 2002-03-28 | Becromal Spa | Elektrode sowie Verfahren zu ihrer Herstellung |
| US7066234B2 (en) | 2001-04-25 | 2006-06-27 | Alcove Surfaces Gmbh | Stamping tool, casting mold and methods for structuring a surface of a work piece |
| US6660660B2 (en) | 2000-10-10 | 2003-12-09 | Asm International, Nv. | Methods for making a dielectric stack in an integrated circuit |
| US6844203B2 (en) * | 2001-08-30 | 2005-01-18 | Micron Technology, Inc. | Gate oxides, and methods of forming |
| US8026161B2 (en) | 2001-08-30 | 2011-09-27 | Micron Technology, Inc. | Highly reliable amorphous high-K gate oxide ZrO2 |
| US6953730B2 (en) * | 2001-12-20 | 2005-10-11 | Micron Technology, Inc. | Low-temperature grown high quality ultra-thin CoTiO3 gate dielectrics |
| US6767795B2 (en) | 2002-01-17 | 2004-07-27 | Micron Technology, Inc. | Highly reliable amorphous high-k gate dielectric ZrOXNY |
| US6803151B2 (en) * | 2002-02-21 | 2004-10-12 | Delphi Technologies, Inc. | Electrode |
| US7323422B2 (en) * | 2002-03-05 | 2008-01-29 | Asm International N.V. | Dielectric layers and methods of forming the same |
| US6812100B2 (en) * | 2002-03-13 | 2004-11-02 | Micron Technology, Inc. | Evaporation of Y-Si-O films for medium-k dielectrics |
| JP4367838B2 (ja) * | 2002-03-25 | 2009-11-18 | 堀金属表面処理工業株式会社 | 導電性陽極酸化皮膜を表面に有するマグネシウム又はマグネシウム合金製品及びその製造方法 |
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| IL161606A0 (en) * | 2004-04-25 | 2004-09-27 | Acktar Ltd | Integral separator for electrolytic capacitors |
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| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| JP4882458B2 (ja) * | 2005-09-30 | 2012-02-22 | 日本ケミコン株式会社 | 電解コンデンサ |
| JP4983074B2 (ja) * | 2005-09-30 | 2012-07-25 | 日本ケミコン株式会社 | 電解コンデンサ |
| JP4797754B2 (ja) * | 2005-09-30 | 2011-10-19 | 日本ケミコン株式会社 | 電解コンデンサ用電極材 |
| JP4983073B2 (ja) * | 2005-09-30 | 2012-07-25 | 日本ケミコン株式会社 | 電解コンデンサ |
| JP4983072B2 (ja) * | 2005-09-30 | 2012-07-25 | 日本ケミコン株式会社 | 電解コンデンサ |
| JP4984031B2 (ja) * | 2005-09-30 | 2012-07-25 | 日本ケミコン株式会社 | 電解コンデンサ用電極材 |
| JP4984030B2 (ja) * | 2005-09-30 | 2012-07-25 | 日本ケミコン株式会社 | 電解コンデンサ用電極材 |
| US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
| IL173121A (en) * | 2006-01-12 | 2011-07-31 | Dina Katsir | Electrodes, membranes, printing plate precursors and other articles including multi-strata porous coatings |
| JP2007273912A (ja) * | 2006-03-31 | 2007-10-18 | Nippon Chemicon Corp | 電解コンデンサ |
| EP2009653A4 (de) | 2006-03-31 | 2015-08-12 | Nippon Chemicon | Elektrodenmaterial für einen elektrolytkondensator |
| IL175270A0 (en) | 2006-04-26 | 2006-09-05 | Acktar Ltd | Composite inorganic membrane for separation in fluid systems |
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| JP5293743B2 (ja) * | 2008-09-11 | 2013-09-18 | パナソニック株式会社 | コンデンサ用電極箔とそれを用いた電解コンデンサ |
| JP5522048B2 (ja) * | 2008-10-10 | 2014-06-18 | パナソニック株式会社 | コンデンサ用電極箔及びその製造方法とその電極箔を用いた固体電解コンデンサ |
| BRPI0906259A2 (pt) * | 2008-12-26 | 2018-12-26 | Sharp Kk | método de fabricação de um molde e método de produção de um filme antirreflexão usando o molde. |
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| CN102549692B (zh) | 2009-10-09 | 2013-09-18 | 松下电器产业株式会社 | 电极箔及使用该电极箔的电容器 |
| US20120261162A1 (en) | 2010-04-07 | 2012-10-18 | Toyo Aluminium Kabushiki Kaisha | Method for manufacturing electrode structure, electrode structure, and capacitor |
| JP5692726B2 (ja) * | 2010-08-31 | 2015-04-01 | 国立大学法人 鹿児島大学 | アルミニウム薄膜の製造方法 |
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| DE102011116939A1 (de) * | 2011-10-26 | 2013-05-02 | H.C. Starck Gmbh | Verzugsfreie schablonengedruckte Anoden auf Ta-/Nb-Blech |
| EP2951331A4 (de) * | 2013-01-31 | 2017-04-19 | Dina Katsir | Instrumente mit niedriger fluoreszenz |
| ITUB20159439A1 (it) | 2015-12-21 | 2017-06-21 | Industrie De Nora Spa | Rivestimento anticorrosivo e metodo per il suo ottenimento |
| CN106910635A (zh) * | 2017-02-24 | 2017-06-30 | 中国科学院合肥物质科学研究院 | 一种用于钽电容器的有序孔阵列阳极钽箔及其制备方法 |
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| US5643432A (en) | 1995-07-13 | 1997-07-01 | Avx Corporation | Selective anodization of capacitor anode body |
| KR0175017B1 (ko) * | 1995-10-23 | 1999-04-01 | 윤종용 | 알루미나 형성장치 및 알루미나 마스크를 이용한 식각 방법 |
| AU6321796A (en) * | 1996-04-03 | 1997-10-22 | Zakrytoe Aktsionernoe Obschestvo "Skb "Istra" | Method and device for applying porous coatings and cathode film of an electrol ytic condenser |
| US6084285A (en) * | 1997-10-20 | 2000-07-04 | The Board Of Trustees Of The Leland Stanford Junior University | Lateral flux capacitor having fractal-shaped perimeters |
| US6287673B1 (en) * | 1998-03-03 | 2001-09-11 | Acktar Ltd. | Method for producing high surface area foil electrodes |
-
1998
- 1998-03-03 US US09/033,664 patent/US6287673B1/en not_active Expired - Lifetime
-
1999
- 1999-02-09 IL IL12843099A patent/IL128430A/en not_active IP Right Cessation
- 1999-02-11 DE DE69939916T patent/DE69939916D1/de not_active Expired - Lifetime
- 1999-02-11 EP EP99650014A patent/EP0940828B1/de not_active Expired - Lifetime
- 1999-03-02 JP JP05376599A patent/JP3746627B2/ja not_active Expired - Fee Related
-
2000
- 2000-12-21 US US09/745,347 patent/US6764712B2/en not_active Expired - Fee Related
-
2001
- 2001-06-28 US US09/893,914 patent/US6933041B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0940828B1 (de) | 2008-11-19 |
| IL128430A0 (en) | 2000-01-31 |
| US20010051442A1 (en) | 2001-12-13 |
| US20010006735A1 (en) | 2001-07-05 |
| EP0940828A3 (de) | 2001-08-16 |
| EP0940828A2 (de) | 1999-09-08 |
| DE69939916D1 (de) | 2009-01-02 |
| JPH11317331A (ja) | 1999-11-16 |
| US6764712B2 (en) | 2004-07-20 |
| JP3746627B2 (ja) | 2006-02-15 |
| US6933041B2 (en) | 2005-08-23 |
| US6287673B1 (en) | 2001-09-11 |
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| MM9K | Patent not in force due to non-payment of renewal fees |