IL73562A - Flat package for integrated circuit memory chips - Google Patents
Flat package for integrated circuit memory chipsInfo
- Publication number
- IL73562A IL73562A IL73562A IL7356284A IL73562A IL 73562 A IL73562 A IL 73562A IL 73562 A IL73562 A IL 73562A IL 7356284 A IL7356284 A IL 7356284A IL 73562 A IL73562 A IL 73562A
- Authority
- IL
- Israel
- Prior art keywords
- integrated circuit
- flat package
- circuit board
- printed circuit
- circuit memory
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Semiconductor Memories (AREA)
- Credit Cards Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56636483A | 1983-12-28 | 1983-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL73562A0 IL73562A0 (en) | 1985-02-28 |
| IL73562A true IL73562A (en) | 1988-07-31 |
Family
ID=24262576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL73562A IL73562A (en) | 1983-12-28 | 1984-11-20 | Flat package for integrated circuit memory chips |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0167538B1 (es) |
| JP (1) | JPS61500879A (es) |
| KR (1) | KR920007209B1 (es) |
| AU (1) | AU568416B2 (es) |
| CA (1) | CA1232082A (es) |
| DE (1) | DE3476297D1 (es) |
| ES (1) | ES295772Y (es) |
| IL (1) | IL73562A (es) |
| WO (1) | WO1985002941A1 (es) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4676571A (en) * | 1985-07-23 | 1987-06-30 | Thomas & Betts Corporation | Leaded chip carrier connector |
| GB2190555B (en) * | 1986-05-03 | 1990-03-28 | Burr Brown Ltd | Surface mounted single package data acquisition system |
| US4961633A (en) * | 1988-02-22 | 1990-10-09 | Xerox Corporation | VLSI optimized modulator |
| EP0689241A2 (en) * | 1991-10-17 | 1995-12-27 | Fujitsu Limited | Carrier for carrying semiconductor device |
| KR100218291B1 (ko) * | 1991-12-11 | 1999-09-01 | 구본준 | 세라믹 패들을 이용한 반도체 패키지 및 그 제작방법 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| GB2083285B (en) * | 1980-02-12 | 1984-08-15 | Mostek Corp | Over/under dual in-line chip package |
| US4296456A (en) * | 1980-06-02 | 1981-10-20 | Burroughs Corporation | Electronic package for high density integrated circuits |
| JPS5923044Y2 (ja) * | 1980-08-28 | 1984-07-10 | 栗山ゴム株式会社 | 覆工板における着脱調節式ストツパ−装置 |
| US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
-
1984
- 1984-10-01 WO PCT/US1984/001568 patent/WO1985002941A1/en not_active Ceased
- 1984-10-01 EP EP84903829A patent/EP0167538B1/en not_active Expired
- 1984-10-01 DE DE8484903829T patent/DE3476297D1/de not_active Expired
- 1984-10-01 JP JP59503857A patent/JPS61500879A/ja active Pending
- 1984-10-01 AU AU35090/84A patent/AU568416B2/en not_active Ceased
- 1984-11-20 IL IL73562A patent/IL73562A/xx not_active IP Right Cessation
- 1984-12-20 CA CA000470731A patent/CA1232082A/en not_active Expired
- 1984-12-26 KR KR1019840008332A patent/KR920007209B1/ko not_active Expired
- 1984-12-27 ES ES1984295772U patent/ES295772Y/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| ES295772U (es) | 1987-11-01 |
| DE3476297D1 (en) | 1989-02-23 |
| IL73562A0 (en) | 1985-02-28 |
| EP0167538B1 (en) | 1989-01-18 |
| KR920007209B1 (ko) | 1992-08-27 |
| EP0167538A1 (en) | 1986-01-15 |
| AU3509084A (en) | 1985-07-12 |
| JPS61500879A (ja) | 1986-05-01 |
| WO1985002941A1 (en) | 1985-07-04 |
| CA1232082A (en) | 1988-01-26 |
| AU568416B2 (en) | 1987-12-24 |
| KR850005150A (ko) | 1985-08-21 |
| ES295772Y (es) | 1988-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| KB | Patent renewed | ||
| HC | Change of name of proprietor(s) | ||
| RH1 | Patent not in force |