IT1056855B - Disposizione circuitale a semi conduttori intergrata - Google Patents
Disposizione circuitale a semi conduttori intergrataInfo
- Publication number
- IT1056855B IT1056855B IT20832/76A IT2083276A IT1056855B IT 1056855 B IT1056855 B IT 1056855B IT 20832/76 A IT20832/76 A IT 20832/76A IT 2083276 A IT2083276 A IT 2083276A IT 1056855 B IT1056855 B IT 1056855B
- Authority
- IT
- Italy
- Prior art keywords
- integrated circuit
- conductive arrangement
- circuit semi
- semi
- conductive
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0121—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] in regions recessed from the surface, e.g. in trenches or grooves
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
- H10W10/0125—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics
- H10W10/0126—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS] comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics introducing electrical active impurities in local oxidation regions to create channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2510593A DE2510593C3 (de) | 1975-03-11 | 1975-03-11 | Integrierte Halbleiter-Schaltungsanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1056855B true IT1056855B (it) | 1982-02-20 |
Family
ID=5941047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT20832/76A IT1056855B (it) | 1975-03-11 | 1976-03-04 | Disposizione circuitale a semi conduttori intergrata |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4323913A (it) |
| JP (1) | JPS51113475A (it) |
| CA (1) | CA1055619A (it) |
| DE (1) | DE2510593C3 (it) |
| FR (1) | FR2304178A1 (it) |
| GB (1) | GB1514624A (it) |
| IT (1) | IT1056855B (it) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51113578A (en) * | 1975-03-31 | 1976-10-06 | Hitachi Ltd | Semi-conductor elements |
| JPS6057707B2 (ja) * | 1978-01-25 | 1985-12-16 | 株式会社日立製作所 | 記憶回路 |
| EP0029350B1 (en) * | 1979-11-14 | 1987-08-05 | Fujitsu Limited | An output transistor of a ttl device with a means for discharging carriers |
| JPS5829628B2 (ja) * | 1979-11-22 | 1983-06-23 | 富士通株式会社 | 半導体記憶装置 |
| US4333227A (en) | 1979-11-29 | 1982-06-08 | International Business Machines Corporation | Process for fabricating a self-aligned micrometer bipolar transistor device |
| US4303933A (en) | 1979-11-29 | 1981-12-01 | International Business Machines Corporation | Self-aligned micrometer bipolar transistor device and process |
| US4432008A (en) * | 1980-07-21 | 1984-02-14 | The Board Of Trustees Of The Leland Stanford Junior University | Gold-doped IC resistor region |
| US4419150A (en) * | 1980-12-29 | 1983-12-06 | Rockwell International Corporation | Method of forming lateral bipolar transistors |
| US4466180A (en) * | 1981-06-25 | 1984-08-21 | Rockwell International Corporation | Method of manufacturing punch through voltage regulator diodes utilizing shaping and selective doping |
| JPS5812350A (ja) * | 1981-07-16 | 1983-01-24 | Nec Corp | 半導体集積回路装置 |
| DE3144920A1 (de) * | 1981-11-12 | 1983-05-26 | Krauss-Maffei AG, 8000 München | Mischkopf |
| JPS58171832A (ja) * | 1982-03-31 | 1983-10-08 | Toshiba Corp | 半導体装置の製造方法 |
| JPS60117613A (ja) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62230051A (ja) * | 1986-03-31 | 1987-10-08 | Nec Corp | トランジスタ |
| US5095348A (en) * | 1989-10-02 | 1992-03-10 | Texas Instruments Incorporated | Semiconductor on insulator transistor |
| US7084483B2 (en) * | 2004-05-25 | 2006-08-01 | International Business Machines Corporation | Trench type buried on-chip precision programmable resistor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1774929C3 (de) * | 1968-03-01 | 1975-09-04 | Ibm Deutschland Gmbh, 7000 Stuttgart | Monolithische Speicherzelle mit zwei kreuzgekoppelten Transistoren |
| US3631311A (en) * | 1968-03-26 | 1971-12-28 | Telefunken Patent | Semiconductor circuit arrangement with integrated base leakage resistance |
| US3648125A (en) * | 1971-02-02 | 1972-03-07 | Fairchild Camera Instr Co | Method of fabricating integrated circuits with oxidized isolation and the resulting structure |
| NL170901C (nl) * | 1971-04-03 | 1983-01-03 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
| NL161301C (nl) * | 1972-12-29 | 1980-01-15 | Philips Nv | Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan. |
| US3962717A (en) * | 1974-10-29 | 1976-06-08 | Fairchild Camera And Instrument Corporation | Oxide isolated integrated injection logic with selective guard ring |
-
1975
- 1975-03-11 DE DE2510593A patent/DE2510593C3/de not_active Expired
-
1976
- 1976-02-13 GB GB5684/76A patent/GB1514624A/en not_active Expired
- 1976-02-27 CA CA246,721A patent/CA1055619A/en not_active Expired
- 1976-03-04 IT IT20832/76A patent/IT1056855B/it active
- 1976-03-09 FR FR7606664A patent/FR2304178A1/fr active Granted
- 1976-03-10 JP JP51026014A patent/JPS51113475A/ja active Granted
-
1979
- 1979-10-17 US US06/085,735 patent/US4323913A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE2510593C3 (de) | 1982-03-18 |
| FR2304178A1 (fr) | 1976-10-08 |
| US4323913A (en) | 1982-04-06 |
| DE2510593B2 (de) | 1981-07-16 |
| JPS5526620B2 (it) | 1980-07-15 |
| GB1514624A (en) | 1978-06-14 |
| JPS51113475A (en) | 1976-10-06 |
| DE2510593A1 (de) | 1976-09-23 |
| FR2304178B1 (it) | 1982-10-08 |
| CA1055619A (en) | 1979-05-29 |
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