IT1214254B - Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame". - Google Patents

Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".

Info

Publication number
IT1214254B
IT1214254B IT8783658A IT8365887A IT1214254B IT 1214254 B IT1214254 B IT 1214254B IT 8783658 A IT8783658 A IT 8783658A IT 8365887 A IT8365887 A IT 8365887A IT 1214254 B IT1214254 B IT 1214254B
Authority
IT
Italy
Prior art keywords
frame
plastic
semiconductor device
sides
chips
Prior art date
Application number
IT8783658A
Other languages
English (en)
Other versions
IT8783658A0 (it
Inventor
Giuseppe Marchisi
Original Assignee
Sgs Microelettonica S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettonica S P A filed Critical Sgs Microelettonica S P A
Priority to IT8783658A priority Critical patent/IT1214254B/it
Publication of IT8783658A0 publication Critical patent/IT8783658A0/it
Application granted granted Critical
Publication of IT1214254B publication Critical patent/IT1214254B/it
Priority to US07/493,466 priority patent/US5034350A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/537—Multiple bond wires having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT8783658A 1987-09-23 1987-09-23 Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame". IT1214254B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT8783658A IT1214254B (it) 1987-09-23 1987-09-23 Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".
US07/493,466 US5034350A (en) 1987-09-23 1990-03-14 Semiconductor device package with dies mounted on both sides of the central pad of a metal frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8783658A IT1214254B (it) 1987-09-23 1987-09-23 Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".

Publications (2)

Publication Number Publication Date
IT8783658A0 IT8783658A0 (it) 1987-09-23
IT1214254B true IT1214254B (it) 1990-01-10

Family

ID=11323697

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8783658A IT1214254B (it) 1987-09-23 1987-09-23 Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".

Country Status (2)

Country Link
US (1) US5034350A (it)
IT (1) IT1214254B (it)

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US5615475A (en) * 1995-01-30 1997-04-01 Staktek Corporation Method of manufacturing an integrated package having a pair of die on a common lead frame
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US6133067A (en) * 1997-12-06 2000-10-17 Amic Technology Inc. Architecture for dual-chip integrated circuit package and method of manufacturing the same
US6117382A (en) 1998-02-05 2000-09-12 Micron Technology, Inc. Method for encasing array packages
JP2002534363A (ja) * 1999-01-08 2002-10-15 エミスフェアー・テクノロジーズ・インク ポリマー性デリバリー剤及びデリバリー剤化合物
US6323060B1 (en) 1999-05-05 2001-11-27 Dense-Pac Microsystems, Inc. Stackable flex circuit IC package and method of making same
US6572387B2 (en) 1999-09-24 2003-06-03 Staktek Group, L.P. Flexible circuit connector for stacked chip module
US6262895B1 (en) 2000-01-13 2001-07-17 John A. Forthun Stackable chip package with flex carrier
JP3522177B2 (ja) * 2000-02-21 2004-04-26 株式会社三井ハイテック 半導体装置の製造方法
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US7485951B2 (en) 2001-10-26 2009-02-03 Entorian Technologies, Lp Modularized die stacking system and method
US7026708B2 (en) * 2001-10-26 2006-04-11 Staktek Group L.P. Low profile chip scale stacking system and method
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US6956284B2 (en) 2001-10-26 2005-10-18 Staktek Group L.P. Integrated circuit stacking system and method
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US6576992B1 (en) 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US7371609B2 (en) 2001-10-26 2008-05-13 Staktek Group L.P. Stacked module systems and methods
US20030234443A1 (en) 2001-10-26 2003-12-25 Staktek Group, L.P. Low profile stacking system and method
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US7542304B2 (en) 2003-09-15 2009-06-02 Entorian Technologies, Lp Memory expansion and integrated circuit stacking system and method
CN101002314A (zh) * 2004-08-31 2007-07-18 松下电器产业株式会社 微型机械设备
US7468893B2 (en) 2004-09-03 2008-12-23 Entorian Technologies, Lp Thin module system and method
US7446410B2 (en) 2004-09-03 2008-11-04 Entorian Technologies, Lp Circuit module with thermal casing systems
US7606050B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Compact module system and method
US7606049B2 (en) 2004-09-03 2009-10-20 Entorian Technologies, Lp Module thermal management system and method
US7423885B2 (en) 2004-09-03 2008-09-09 Entorian Technologies, Lp Die module system
US7522421B2 (en) * 2004-09-03 2009-04-21 Entorian Technologies, Lp Split core circuit module
US7324352B2 (en) 2004-09-03 2008-01-29 Staktek Group L.P. High capacity thin module system and method
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Also Published As

Publication number Publication date
IT8783658A0 (it) 1987-09-23
US5034350A (en) 1991-07-23

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970929