IT8019615A0 - Processo per la fabbricazione di circuiti integrati. - Google Patents
Processo per la fabbricazione di circuiti integrati.Info
- Publication number
- IT8019615A0 IT8019615A0 IT8019615A IT1961580A IT8019615A0 IT 8019615 A0 IT8019615 A0 IT 8019615A0 IT 8019615 A IT8019615 A IT 8019615A IT 1961580 A IT1961580 A IT 1961580A IT 8019615 A0 IT8019615 A0 IT 8019615A0
- Authority
- IT
- Italy
- Prior art keywords
- manufacture
- integrated circuits
- circuits
- integrated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6319—Formation by plasma treatments, e.g. plasma oxidation of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
- H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/016,648 US4232057A (en) | 1979-03-01 | 1979-03-01 | Semiconductor plasma oxidation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8019615A0 true IT8019615A0 (it) | 1980-02-01 |
| IT1151001B IT1151001B (it) | 1986-12-17 |
Family
ID=21778221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT19615/80A IT1151001B (it) | 1979-03-01 | 1980-02-01 | Processo per la fabbricazione di circuiti integrati |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4232057A (it) |
| EP (1) | EP0016909B1 (it) |
| JP (1) | JPS55118639A (it) |
| CA (1) | CA1124409A (it) |
| DE (1) | DE3060785D1 (it) |
| IT (1) | IT1151001B (it) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4409260A (en) * | 1979-08-15 | 1983-10-11 | Hughes Aircraft Company | Process for low-temperature surface layer oxidation of a semiconductor substrate |
| JPS6029295B2 (ja) * | 1979-08-16 | 1985-07-10 | 舜平 山崎 | 非単結晶被膜形成法 |
| JPS5662328A (en) * | 1979-10-26 | 1981-05-28 | Agency Of Ind Science & Technol | Manufacturing of insulation membrane and insulation membrane-semiconductor interface |
| US4371587A (en) * | 1979-12-17 | 1983-02-01 | Hughes Aircraft Company | Low temperature process for depositing oxide layers by photochemical vapor deposition |
| US4323589A (en) * | 1980-05-07 | 1982-04-06 | International Business Machines Corporation | Plasma oxidation |
| US4421592A (en) * | 1981-05-22 | 1983-12-20 | United Technologies Corporation | Plasma enhanced deposition of semiconductors |
| US4474829A (en) * | 1981-11-23 | 1984-10-02 | Hughes Aircraft Company | Low-temperature charge-free process for forming native oxide layers |
| JPS59111333A (ja) * | 1982-12-09 | 1984-06-27 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | SiO領域をSiO↓2領域に変換してSiO↓2領を形成する方法 |
| NL8300422A (nl) * | 1983-02-04 | 1984-09-03 | Philips Nv | Methode voor de vervaardiging van een optisch uitleesbare informatieschijf. |
| US4474828A (en) * | 1983-03-30 | 1984-10-02 | Sperry Corporation | Method of controlling the supercurrent of a Josephson junction device |
| US4510172A (en) * | 1984-05-29 | 1985-04-09 | International Business Machines Corporation | Technique for thin insulator growth |
| US4599247A (en) * | 1985-01-04 | 1986-07-08 | Texas Instruments Incorporated | Semiconductor processing facility for providing enhanced oxidation rate |
| FR2587729B1 (fr) * | 1985-09-24 | 1988-12-23 | Centre Nat Rech Scient | Procede et dispositif de traitement chimique, notamment de traitement thermochimique et de depot chimique dans un plasma homogene de grand volume |
| JPS62227089A (ja) * | 1986-03-27 | 1987-10-06 | Anelva Corp | 表面処理方法および装置 |
| FR2618796B1 (fr) * | 1987-07-27 | 1993-02-05 | Centre Nat Rech Scient | Procede de traitement de surfaces, utilisant une post-decharge electrique dans un gaz en ecoulement et dispositif pour la mise en oeuvre de ce procede |
| FR2652591B1 (fr) * | 1989-10-03 | 1993-10-08 | Framatome | Procede d'oxydation superficielle d'une piece en metal passivable, et elements d'assemblage combustible en alliage metallique revetus d'une couche d'oxyde protectrice. |
| US5039625A (en) * | 1990-04-27 | 1991-08-13 | Mcnc | Maximum areal density recessed oxide isolation (MADROX) process |
| JP2519364B2 (ja) * | 1990-12-03 | 1996-07-31 | アプライド マテリアルズ インコーポレイテッド | Uhf/vhf共振アンテナ供給源を用いたプラズマリアクタ |
| WO2002075801A2 (en) * | 2000-11-07 | 2002-09-26 | Tokyo Electron Limited | Method of fabricating oxides with low defect densities |
| US7273638B2 (en) * | 2003-01-07 | 2007-09-25 | International Business Machines Corp. | High density plasma oxidation |
| CN101451237B (zh) | 2007-11-30 | 2012-02-08 | 中微半导体设备(上海)有限公司 | 具有多个等离子体反应区域的包括多个处理平台的等离子体反应室 |
| US7974119B2 (en) | 2008-07-10 | 2011-07-05 | Seagate Technology Llc | Transmission gate-based spin-transfer torque memory unit |
| US7936580B2 (en) | 2008-10-20 | 2011-05-03 | Seagate Technology Llc | MRAM diode array and access method |
| US9030867B2 (en) | 2008-10-20 | 2015-05-12 | Seagate Technology Llc | Bipolar CMOS select device for resistive sense memory |
| US7936583B2 (en) | 2008-10-30 | 2011-05-03 | Seagate Technology Llc | Variable resistive memory punchthrough access method |
| US7825478B2 (en) | 2008-11-07 | 2010-11-02 | Seagate Technology Llc | Polarity dependent switch for resistive sense memory |
| US8178864B2 (en) | 2008-11-18 | 2012-05-15 | Seagate Technology Llc | Asymmetric barrier diode |
| US8203869B2 (en) | 2008-12-02 | 2012-06-19 | Seagate Technology Llc | Bit line charge accumulation sensing for resistive changing memory |
| US8159856B2 (en) | 2009-07-07 | 2012-04-17 | Seagate Technology Llc | Bipolar select device for resistive sense memory |
| US8158964B2 (en) | 2009-07-13 | 2012-04-17 | Seagate Technology Llc | Schottky diode switch and memory units containing the same |
| US8183126B2 (en) | 2009-07-13 | 2012-05-22 | Seagate Technology Llc | Patterning embedded control lines for vertically stacked semiconductor elements |
| US8617952B2 (en) | 2010-09-28 | 2013-12-31 | Seagate Technology Llc | Vertical transistor with hardening implatation |
| US8648426B2 (en) | 2010-12-17 | 2014-02-11 | Seagate Technology Llc | Tunneling transistors |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3108900A (en) * | 1959-04-13 | 1963-10-29 | Cornelius A Papp | Apparatus and process for producing coatings on metals |
| DE1289382B (de) * | 1963-08-16 | 1969-02-13 | Licentia Gmbh | Verfahren zur Oxydation eines Silizium-Halbleiterkoerpers |
| FR1403466A (fr) * | 1963-08-16 | 1965-06-18 | Licentia Gmbh | Procédé d'oxydation de silicium ou d'une disposition de semi-conducteurs comportant une ou plusieurs transitions pn |
| GB1104935A (en) * | 1964-05-08 | 1968-03-06 | Standard Telephones Cables Ltd | Improvements in or relating to a method of forming a layer of an inorganic compound |
| US3424661A (en) * | 1966-09-01 | 1969-01-28 | Bell Telephone Labor Inc | Method of conducting chemical reactions in a glow discharge |
| US3615956A (en) * | 1969-03-27 | 1971-10-26 | Signetics Corp | Gas plasma vapor etching process |
| JPS4960484A (it) * | 1972-10-12 | 1974-06-12 | ||
| US3920483A (en) * | 1974-11-25 | 1975-11-18 | Ibm | Method of ion implantation through a photoresist mask |
| US4123663A (en) * | 1975-01-22 | 1978-10-31 | Tokyo Shibaura Electric Co., Ltd. | Gas-etching device |
| GB1550853A (en) * | 1975-10-06 | 1979-08-22 | Hitachi Ltd | Apparatus and process for plasma treatment |
| US4138306A (en) * | 1976-08-31 | 1979-02-06 | Tokyo Shibaura Electric Co., Ltd. | Apparatus for the treatment of semiconductors |
-
1979
- 1979-03-01 US US06/016,648 patent/US4232057A/en not_active Expired - Lifetime
-
1980
- 1980-01-09 CA CA343,327A patent/CA1124409A/en not_active Expired
- 1980-01-18 JP JP371580A patent/JPS55118639A/ja active Pending
- 1980-01-23 EP EP80100325A patent/EP0016909B1/fr not_active Expired
- 1980-01-23 DE DE8080100325T patent/DE3060785D1/de not_active Expired
- 1980-02-01 IT IT19615/80A patent/IT1151001B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DE3060785D1 (en) | 1982-10-28 |
| JPS55118639A (en) | 1980-09-11 |
| US4232057A (en) | 1980-11-04 |
| IT1151001B (it) | 1986-12-17 |
| CA1124409A (en) | 1982-05-25 |
| EP0016909A1 (fr) | 1980-10-15 |
| EP0016909B1 (fr) | 1982-09-01 |
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