IT1115712B - Apparecchiatura perfezionata per la fabbricazione di circuiti integrati - Google Patents

Apparecchiatura perfezionata per la fabbricazione di circuiti integrati

Info

Publication number
IT1115712B
IT1115712B IT20895/77A IT2089577A IT1115712B IT 1115712 B IT1115712 B IT 1115712B IT 20895/77 A IT20895/77 A IT 20895/77A IT 2089577 A IT2089577 A IT 2089577A IT 1115712 B IT1115712 B IT 1115712B
Authority
IT
Italy
Prior art keywords
manufacture
integrated circuits
improved equipment
equipment
improved
Prior art date
Application number
IT20895/77A
Other languages
English (en)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of IT1115712B publication Critical patent/IT1115712B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
    • H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
    • H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
    • H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/416—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6322—Formation by thermal treatments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6682—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound being a silane, e.g. disilane, methylsilane or chlorosilane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/694—Inorganic materials composed of nitrides
    • H10P14/6943—Inorganic materials composed of nitrides containing silicon
    • H10P14/69433—Inorganic materials composed of nitrides containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/06—Gettering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/122—Polycrystalline
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/928—Active solid-state devices, e.g. transistors, solid-state diodes with shorted PN or schottky junction other than emitter junction
IT20895/77A 1976-04-02 1977-03-04 Apparecchiatura perfezionata per la fabbricazione di circuiti integrati IT1115712B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/672,906 US4053335A (en) 1976-04-02 1976-04-02 Method of gettering using backside polycrystalline silicon

Publications (1)

Publication Number Publication Date
IT1115712B true IT1115712B (it) 1986-02-03

Family

ID=24700519

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20895/77A IT1115712B (it) 1976-04-02 1977-03-04 Apparecchiatura perfezionata per la fabbricazione di circuiti integrati

Country Status (6)

Country Link
US (1) US4053335A (it)
JP (1) JPS52120777A (it)
CA (1) CA1079863A (it)
DE (1) DE2714413A1 (it)
FR (1) FR2346856A1 (it)
IT (1) IT1115712B (it)

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2738195A1 (de) * 1977-08-24 1979-03-01 Siemens Ag Verfahren zur reduzierung von kristallfehlern bei der herstellung von halbleiterbauelementen und integrierten schaltkreisen in einkristallinen halbleiterscheiben
DE2829983A1 (de) * 1978-07-07 1980-01-24 Siemens Ag Verfahren zum gettern von halbleiterbauelementen und integrierten halbleiterschaltkreisen
FR2435818A1 (fr) * 1978-09-08 1980-04-04 Ibm France Procede pour accroitre l'effet de piegeage interne des corps semi-conducteurs
US4191788A (en) * 1978-11-13 1980-03-04 Trw Inc. Method to reduce breakage of V-grooved <100> silicon substrate
US4416051A (en) * 1979-01-22 1983-11-22 Westinghouse Electric Corp. Restoration of high infrared sensitivity in extrinsic silicon detectors
US4246590A (en) * 1979-01-22 1981-01-20 Westinghouse Electric Corp. Restoration of high infrared sensitivity in extrinsic silicon detectors
US4249962A (en) * 1979-09-11 1981-02-10 Western Electric Company, Inc. Method of removing contaminating impurities from device areas in a semiconductor wafer
US4257827A (en) * 1979-11-13 1981-03-24 International Business Machines Corporation High efficiency gettering in silicon through localized superheated melt formation
US4354307A (en) * 1979-12-03 1982-10-19 Burroughs Corporation Method for mass producing miniature field effect transistors in high density LSI/VLSI chips
US4349394A (en) * 1979-12-06 1982-09-14 Siemens Corporation Method of making a zener diode utilizing gas-phase epitaxial deposition
JPS57136333A (en) * 1981-02-17 1982-08-23 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS57136331A (en) * 1981-02-17 1982-08-23 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS57153438A (en) * 1981-03-18 1982-09-22 Nec Corp Manufacture of semiconductor substrate
JPS58138035A (ja) * 1982-02-12 1983-08-16 Nec Corp 半導体装置及びその製造方法
AT380974B (de) * 1982-04-06 1986-08-11 Shell Austria Verfahren zum gettern von halbleiterbauelementen
US5391893A (en) * 1985-05-07 1995-02-21 Semicoductor Energy Laboratory Co., Ltd. Nonsingle crystal semiconductor and a semiconductor device using such semiconductor
US4716451A (en) * 1982-12-10 1987-12-29 Rca Corporation Semiconductor device with internal gettering region
KR870000315B1 (ko) * 1983-02-14 1987-02-26 몬산토 캄파니 반도체 기판재료 및 전자디바이스의 제조방법
US4608095A (en) * 1983-02-14 1986-08-26 Monsanto Company Gettering
US4608096A (en) * 1983-04-04 1986-08-26 Monsanto Company Gettering
JPS59186331A (ja) * 1983-04-04 1984-10-23 モンサント・コンパニ− 半導体基質及び製法
JPS60119733A (ja) * 1983-12-01 1985-06-27 Fuji Electric Corp Res & Dev Ltd シリコン板の重金属ゲッタリング方法
US4666532A (en) * 1984-05-04 1987-05-19 Monsanto Company Denuding silicon substrates with oxygen and halogen
US4622082A (en) * 1984-06-25 1986-11-11 Monsanto Company Conditioned semiconductor substrates
US4559086A (en) * 1984-07-02 1985-12-17 Eastman Kodak Company Backside gettering of silicon wafers utilizing selectively annealed single crystal silicon portions disposed between and extending into polysilicon portions
JPS6124240A (ja) * 1984-07-13 1986-02-01 Toshiba Corp 半導体基板
US4589928A (en) * 1984-08-21 1986-05-20 At&T Bell Laboratories Method of making semiconductor integrated circuits having backside gettered with phosphorus
US7038238B1 (en) 1985-05-07 2006-05-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having a non-single crystalline semiconductor layer
JPS6249628A (ja) * 1986-03-24 1987-03-04 Sony Corp 半導体装置
US4687682A (en) * 1986-05-02 1987-08-18 American Telephone And Telegraph Company, At&T Technologies, Inc. Back sealing of silicon wafers
US4796073A (en) * 1986-11-14 1989-01-03 Burr-Brown Corporation Front-surface N+ gettering techniques for reducing noise in integrated circuits
DE3738344A1 (de) * 1986-11-14 1988-05-26 Mitsubishi Electric Corp Anlage zum einfuehren von gitterstoerstellen und verfahren dazu
JPH0646622B2 (ja) * 1987-06-30 1994-06-15 三菱電機株式会社 半導体基板用シリコンウェハの製造方法
US4843037A (en) * 1987-08-21 1989-06-27 Bell Communications Research, Inc. Passivation of indium gallium arsenide surfaces
JPH0648686B2 (ja) * 1988-03-30 1994-06-22 新日本製鐵株式会社 ゲッタリング能力の優れたシリコンウェーハおよびその製造方法
DE3910185C2 (de) * 1988-03-30 1998-09-24 Nippon Steel Corp Siliziumplättchen mit hervorragendem Gettervermögen und Verfahren zu dessen Herstellung
US5189508A (en) * 1988-03-30 1993-02-23 Nippon Steel Corporation Silicon wafer excelling in gettering ability and method for production thereof
JPH07120657B2 (ja) * 1988-04-05 1995-12-20 三菱電機株式会社 半導体基板
DE3833161B4 (de) * 1988-09-29 2005-10-13 Infineon Technologies Ag Verfahren zum Gettern von Halbleiter-Bauelementen und nach dem Verfahren erhaltene Halbleiter-Bauelemente
US5227314A (en) * 1989-03-22 1993-07-13 At&T Bell Laboratories Method of making metal conductors having a mobile inn getterer therein
JPH03235333A (ja) * 1990-02-13 1991-10-21 Mitsubishi Electric Corp ゲッタ効果の高められた半導体基板並びに該基板を用いた半導体装置およびその製造方法
JP2763204B2 (ja) * 1991-02-21 1998-06-11 株式会社東芝 半導体基板及びその製造方法
JPH05110024A (ja) * 1991-10-18 1993-04-30 Sharp Corp 半導体装置及びその製造方法
US5244819A (en) * 1991-10-22 1993-09-14 Honeywell Inc. Method to getter contamination in semiconductor devices
JP2723725B2 (ja) * 1991-10-29 1998-03-09 信越半導体株式会社 半導体基板の製造方法
JPH05206146A (ja) * 1992-01-24 1993-08-13 Toshiba Corp 半導体装置の製造方法
JPH05218049A (ja) * 1992-01-31 1993-08-27 Nec Corp 半導体素子形成用基板
DE4304849C2 (de) * 1992-02-21 2000-01-27 Mitsubishi Electric Corp Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
JPH06104268A (ja) * 1992-09-21 1994-04-15 Mitsubishi Electric Corp ゲッタリング効果を持たせた半導体基板およびその製造方法
US5272119A (en) * 1992-09-23 1993-12-21 Memc Electronic Materials, Spa Process for contamination removal and minority carrier lifetime improvement in silicon
JP3024409B2 (ja) * 1992-12-25 2000-03-21 日本電気株式会社 半導体装置の製造方法
JP3384506B2 (ja) * 1993-03-30 2003-03-10 ソニー株式会社 半導体基板の製造方法
JP3232168B2 (ja) * 1993-07-02 2001-11-26 三菱電機株式会社 半導体基板およびその製造方法ならびにその半導体基板を用いた半導体装置
JPH0786289A (ja) * 1993-07-22 1995-03-31 Toshiba Corp 半導体シリコンウェハおよびその製造方法
JP3524141B2 (ja) * 1994-03-25 2004-05-10 株式会社東芝 半導体装置及びその製造方法
US5757063A (en) * 1994-03-25 1998-05-26 Kabushiki Kaisha Toshiba Semiconductor device having an extrinsic gettering film
JPH08264400A (ja) * 1995-03-28 1996-10-11 Mitsubishi Electric Corp シリコン単結晶ウェハおよびその表面の熱酸化方法
JP3498431B2 (ja) * 1995-07-04 2004-02-16 株式会社デンソー 半導体装置の製造方法
US6004868A (en) 1996-01-17 1999-12-21 Micron Technology, Inc. Method for CMOS well drive in a non-inert ambient
JP2743904B2 (ja) * 1996-02-16 1998-04-28 日本電気株式会社 半導体基板およびこれを用いた半導体装置の製造方法
JP3391184B2 (ja) * 1996-03-28 2003-03-31 信越半導体株式会社 シリコンウエーハおよびその製造方法
US5764353A (en) * 1996-11-29 1998-06-09 Seh America, Inc. Back side damage monitoring system
TW350112B (en) * 1996-12-27 1999-01-11 Komatsu Denshi Kinzoku Kk Silicon wafer evaluation method
US6424011B1 (en) 1997-04-14 2002-07-23 International Business Machines Corporation Mixed memory integration with NVRAM, dram and sram cell structures on same substrate
US6159824A (en) 1997-05-12 2000-12-12 Silicon Genesis Corporation Silicon-on-silicon wafer bonding process using a thin film blister-separation method
US6033974A (en) 1997-05-12 2000-03-07 Silicon Genesis Corporation Method for controlled cleaving process
US20070122997A1 (en) 1998-02-19 2007-05-31 Silicon Genesis Corporation Controlled process and resulting device
JPH10321635A (ja) * 1997-05-16 1998-12-04 Nec Corp 半導体装置及びその製造方法
US6146980A (en) * 1997-06-04 2000-11-14 United Microelectronics Corp. Method for manufacturing silicon substrate having gettering capability
US6548382B1 (en) 1997-07-18 2003-04-15 Silicon Genesis Corporation Gettering technique for wafers made using a controlled cleaving process
JP3211747B2 (ja) * 1997-09-30 2001-09-25 日本電気株式会社 半導体装置の製造方法
RU2134467C1 (ru) * 1997-10-14 1999-08-10 Научно-исследовательский институт измерительных систем Способ геттерирующей обработки подложек кремния
US6228779B1 (en) * 1998-11-06 2001-05-08 Novellus Systems, Inc. Ultra thin oxynitride and nitride/oxide stacked gate dielectrics fabricated by high pressure technology
DE19915078A1 (de) 1999-04-01 2000-10-12 Siemens Ag Verfahren zur Prozessierung einer monokristallinen Halbleiterscheibe und teilweise prozessierte Halbleiterscheibe
US6500732B1 (en) 1999-08-10 2002-12-31 Silicon Genesis Corporation Cleaving process to fabricate multilayered substrates using low implantation doses
EP1939932A1 (en) 1999-08-10 2008-07-02 Silicon Genesis Corporation A substrate comprising a stressed silicon germanium cleave layer
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
US6530074B1 (en) * 1999-11-23 2003-03-04 Agere Systems Inc. Apparatus for verification of IC mask sets
US6544862B1 (en) 2000-01-14 2003-04-08 Silicon Genesis Corporation Particle distribution method and resulting structure for a layer transfer process
US6376335B1 (en) 2000-02-17 2002-04-23 Memc Electronic Materials, Inc. Semiconductor wafer manufacturing process
US6620632B2 (en) 2000-04-06 2003-09-16 Seh America, Inc. Method for evaluating impurity concentrations in semiconductor substrates
US6670283B2 (en) 2001-11-20 2003-12-30 International Business Machines Corporation Backside protection films
US6576501B1 (en) * 2002-05-31 2003-06-10 Seh America, Inc. Double side polished wafers having external gettering sites, and method of producing same
EP1482539A1 (en) * 2003-05-26 2004-12-01 S.O.I. Tec Silicon on Insulator Technologies S.A. Preparation method for protecting the back side of a wafer and back side protected wafer
US6749684B1 (en) 2003-06-10 2004-06-15 International Business Machines Corporation Method for improving CVD film quality utilizing polysilicon getterer
US20040259321A1 (en) * 2003-06-19 2004-12-23 Mehran Aminzadeh Reducing processing induced stress
KR101143346B1 (ko) * 2004-08-20 2012-05-11 아르토 오로라 변형 내부 게이트 구조를 갖는 반도체 방사선 검출기
JP4992246B2 (ja) * 2006-02-22 2012-08-08 株式会社Ｓｕｍｃｏ シリコンウェーハ中のＣｕ評価方法
US7737004B2 (en) 2006-07-03 2010-06-15 Semiconductor Components Industries Llc Multilayer gettering structure for semiconductor device and method
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
US9362439B2 (en) 2008-05-07 2016-06-07 Silicon Genesis Corporation Layer transfer of films utilizing controlled shear region
US7811900B2 (en) 2006-09-08 2010-10-12 Silicon Genesis Corporation Method and structure for fabricating solar cells using a thick layer transfer process
US8293619B2 (en) 2008-08-28 2012-10-23 Silicon Genesis Corporation Layer transfer of films utilizing controlled propagation
US8330126B2 (en) 2008-08-25 2012-12-11 Silicon Genesis Corporation Race track configuration and method for wafering silicon solar substrates
US8148249B2 (en) * 2008-09-12 2012-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of fabricating high-k metal gate devices
US8329557B2 (en) 2009-05-13 2012-12-11 Silicon Genesis Corporation Techniques for forming thin films by implantation with reduced channeling
US8541305B2 (en) * 2010-05-24 2013-09-24 Institute of Microelectronics, Chinese Academy of Sciences 3D integrated circuit and method of manufacturing the same
US8846500B2 (en) 2010-12-13 2014-09-30 Semiconductor Components Industries, Llc Method of forming a gettering structure having reduced warpage and gettering a semiconductor wafer therewith
JP2016009730A (ja) * 2014-06-23 2016-01-18 株式会社東芝 半導体装置の製造方法
JP6593369B2 (ja) * 2017-02-21 2019-10-23 株式会社村田製作所 半導体チップが実装されたモジュール、及び半導体チップ実装方法
US10242929B1 (en) 2017-11-30 2019-03-26 Semiconductor Components Industries, Llc Method of forming a multilayer structure for reducing defects in semiconductor devices and structure
CN113496871A (zh) * 2020-04-03 2021-10-12 重庆超硅半导体有限公司 一种外延基底用硅晶片之背面膜层及制造方法
CN116206950B (zh) * 2023-03-02 2025-08-12 杭州富芯半导体有限公司 一种硅片外吸杂方法
CN117174726B (zh) * 2023-08-30 2024-08-09 中环领先半导体科技股份有限公司 半导体衬底、制备方法及图像传感器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2841510A (en) * 1958-07-01 Method of producing p-n junctions in
US3370980A (en) * 1963-08-19 1968-02-27 Litton Systems Inc Method for orienting single crystal films on polycrystalline substrates
US3494809A (en) * 1967-06-05 1970-02-10 Honeywell Inc Semiconductor processing
US3632438A (en) * 1967-09-29 1972-01-04 Texas Instruments Inc Method for increasing the stability of semiconductor devices
JPS4912795B1 (it) * 1968-12-05 1974-03-27
GB1250377A (it) * 1968-08-24 1971-10-20
JPS5129636B1 (it) * 1970-12-25 1976-08-26
US3723201A (en) * 1971-11-01 1973-03-27 Motorola Inc Diffusion process for heteroepitaxial germanium device fabrication utilizing polycrystalline silicon mask
JPS4940856A (it) * 1972-08-25 1974-04-17
JPS5010572A (it) * 1973-05-25 1975-02-03
US3862852A (en) * 1973-06-01 1975-01-28 Fairchild Camera Instr Co Method of obtaining high-quality thick films of polycrystalline silicone from dielectric isolation
US3900597A (en) * 1973-12-19 1975-08-19 Motorola Inc System and process for deposition of polycrystalline silicon with silane in vacuum
US3929529A (en) * 1974-12-09 1975-12-30 Ibm Method for gettering contaminants in monocrystalline silicon
US3997368A (en) * 1975-06-24 1976-12-14 Bell Telephone Laboratories, Incorporated Elimination of stacking faults in silicon devices: a gettering process

Also Published As

Publication number Publication date
US4053335A (en) 1977-10-11
CA1079863A (en) 1980-06-17
JPS52120777A (en) 1977-10-11
FR2346856A1 (fr) 1977-10-28
DE2714413A1 (de) 1977-10-20
FR2346856B1 (it) 1980-01-11

Similar Documents

Publication Publication Date Title
IT1115712B (it) Apparecchiatura perfezionata per la fabbricazione di circuiti integrati
IT1079559B (it) Apparecchiatura automatizzata per la fabbricazione di circuiti integrati
IT1152039B (it) Procedimento per la fabbricazione di circuiti integrati
IT7925850A0 (it) Apparecchiatura per provare circuiti semiconduttori integrati.
IT1063394B (it) Procedimento perfezionato per la fabbricazione di circuiti integrati
IT1114870B (it) Processo e struttura per la connessione di circuiti elettrici
IT1080619B (it) Complesso di circuito integrato
IT1063554B (it) Procedimento per la fabbricazione di circuiti integrati
SE7712295L (sv) Integrerad krets
IT7831078A0 (it) Struttura d&#39;interconnessione di circuiti integrati.
IT8019615A0 (it) Processo per la fabbricazione di circuiti integrati.
IT1118012B (it) Processo perfezionato per la fabbricazione di circuiti integrati
IT1114884B (it) Procedimento di fabbricazione di dispositivi semiconduttori
IT1064171B (it) Procedimento per la fabbricazione di circuiti integrati
IT1206367B (it) Struttura perfezionata di circuiti multistrato.
IT1091935B (it) Apparecchiatura di interruzione di circuiti
BR7704043A (pt) Aparelho de tufamento
PL200347A1 (pl) Przyrzad polprzewodnikowy wysokonapieciowy
IT1138909B (it) Procedimento per la fabbricazione di circuiti integrati
IT1072436B (it) Metodo di fabbricazione di circuiti integrati
IT1063602B (it) Procedimento perfezionato per la fabbricazione di circuiti integrati
IT1138064B (it) Procedimento di retro-corrisione per circuiti integrati
IT7819249A0 (it) Circuiti integrati.
IT1090820B (it) Procedimento per la produzione di circuiti integrati e prodotto ottenuto
IT1081539B (it) Struttura di semiconduttore