ITTO20010347A0 - Sistema manipolatore per tagliare un dispositivo d'involucro per semiconduttori. - Google Patents

Sistema manipolatore per tagliare un dispositivo d'involucro per semiconduttori.

Info

Publication number
ITTO20010347A0
ITTO20010347A0 IT2001TO000347A ITTO20010347A ITTO20010347A0 IT TO20010347 A0 ITTO20010347 A0 IT TO20010347A0 IT 2001TO000347 A IT2001TO000347 A IT 2001TO000347A IT TO20010347 A ITTO20010347 A IT TO20010347A IT TO20010347 A0 ITTO20010347 A0 IT TO20010347A0
Authority
IT
Italy
Prior art keywords
cutting
manipulator system
enclosure device
semiconductor enclosure
semiconductor
Prior art date
Application number
IT2001TO000347A
Other languages
English (en)
Inventor
Ik-Gyun Na
Original Assignee
Hanmi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2000-0079284A external-priority patent/KR100396982B1/ko
Priority claimed from KR10-2000-0079282A external-priority patent/KR100385876B1/ko
Application filed by Hanmi Co Ltd filed Critical Hanmi Co Ltd
Publication of ITTO20010347A0 publication Critical patent/ITTO20010347A0/it
Publication of ITTO20010347A1 publication Critical patent/ITTO20010347A1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
IT2001TO000347A 2000-12-20 2001-04-11 Sistema manipolatore per tagliare un dispositivo d'involucro per semiconduttori. ITTO20010347A1 (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2000-0079284A KR100396982B1 (ko) 2000-12-20 2000-12-20 반도체패키지 적재 테이블장치
KR10-2000-0079282A KR100385876B1 (ko) 2000-12-20 2000-12-20 반도체 패키지장치 절단용 핸들러 시스템

Publications (2)

Publication Number Publication Date
ITTO20010347A0 true ITTO20010347A0 (it) 2001-04-11
ITTO20010347A1 ITTO20010347A1 (it) 2002-10-11

Family

ID=26638651

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2001TO000347A ITTO20010347A1 (it) 2000-12-20 2001-04-11 Sistema manipolatore per tagliare un dispositivo d'involucro per semiconduttori.

Country Status (8)

Country Link
US (1) US6446354B1 (it)
JP (1) JP3699661B2 (it)
CN (1) CN1208824C (it)
GB (1) GB2370411B (it)
HK (1) HK1048196B (it)
IT (1) ITTO20010347A1 (it)
SG (2) SG98444A1 (it)
TW (1) TW495866B (it)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4649059B2 (ja) * 2001-05-25 2011-03-09 アピックヤマダ株式会社 ワーク搬送装置及びダイシング装置
SG111091A1 (en) * 2002-10-29 2005-05-30 Advanced Systems Automation Handler for semiconductor singulation and method therefor
KR20050063359A (ko) * 2003-12-22 2005-06-28 한미반도체 주식회사 반도체 패키지 이송 메카니즘 및 이송방법
CN100470758C (zh) * 2004-05-07 2009-03-18 韩美半导体株式会社 用于制造半导体封装的切割和处理系统
US20070259483A1 (en) * 2004-08-31 2007-11-08 Hanmi Semiconductor Co., Ltd. Sawing Apparatus and a Control Method for Manufacturing Processes of Semiconductor Package
KR100596505B1 (ko) * 2004-09-08 2006-07-05 삼성전자주식회사 소잉/소팅 시스템
US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
KR100904496B1 (ko) * 2007-02-09 2009-06-24 한미반도체 주식회사 반도체 패키지 가공시스템 및 반도체 패키지 가공방법
WO2008114457A1 (ja) * 2007-03-16 2008-09-25 Tohoku Seiki Industries, Ltd. 位置補正機能を有するハンドラーおよび未検デバイスの測定ソケットに対する装填方法
US8978673B2 (en) * 2007-08-09 2015-03-17 Asm Assembly Automation Ltd Megasonic cleaning system
CN101802997B (zh) * 2007-09-14 2011-12-07 韩美半导体株式会社 切割与加工存储卡的装置
US8167524B2 (en) * 2007-11-16 2012-05-01 Asm Assembly Automation Ltd Handling system for inspecting and sorting electronic components
NL2001790C2 (nl) * 2008-07-11 2010-01-12 Fico Bv Inrichting en werkwijze voor het zagen van elektronische componenten.
JP5457660B2 (ja) * 2008-11-07 2014-04-02 アピックヤマダ株式会社 切断方法及び切断装置
US8037996B2 (en) * 2009-01-05 2011-10-18 Asm Assembly Automation Ltd Transfer apparatus for handling electronic components
US7975710B2 (en) * 2009-07-06 2011-07-12 Asm Assembly Automation Ltd Acoustic cleaning system for electronic components
US8251422B2 (en) * 2010-03-29 2012-08-28 Asm Assembly Automation Ltd Apparatus for transferring electronic components in stages
CN102107192A (zh) * 2010-12-01 2011-06-29 铜陵三佳科技股份有限公司 半导体封装设备下模面擦洗装置
CN102290356B (zh) * 2011-09-02 2012-11-21 四川卫士通信息安全平台技术有限公司 一种适用于bga芯片贴片焊接后进行封装保护的方法
KR101414690B1 (ko) * 2013-04-22 2014-07-08 한미반도체 주식회사 반도체 스트립 절단장치
JP6000902B2 (ja) 2013-06-24 2016-10-05 Ｔｏｗａ株式会社 電子部品用の収容治具、その製造方法及び個片化装置
KR20160001004A (ko) 2014-06-26 2016-01-06 삼성전자주식회사 피치 조절 유닛, 피치 조절유닛을 구비하는 추출 장치 및 테스트 핸들러
KR101820667B1 (ko) * 2015-10-14 2018-01-22 한미반도체 주식회사 반도체 패키지 처리장치
KR102440451B1 (ko) * 2016-01-29 2022-09-06 한미반도체 주식회사 반도체 패키지 처리장치
JP6952515B2 (ja) 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
CN108817962A (zh) * 2018-07-24 2018-11-16 米亚索乐装备集成（福建）有限公司 一种卷材裁切装置
CN110391156A (zh) * 2019-04-23 2019-10-29 南宁聚信众信息技术咨询有限公司 一种基于芯片封装技术的稳定性高的分拣设备
CN110176415B (zh) * 2019-05-07 2021-11-05 资兴市慧华电子有限公司 一种具有吸嘴拆装便捷功能的清洁型芯片分拣设备
JP7154195B2 (ja) * 2019-07-26 2022-10-17 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
KR102331363B1 (ko) * 2020-06-19 2021-11-29 리노정밀(주) 검사 장치용 지그 블록 절단 장치
CN113787006B (zh) * 2021-09-15 2022-09-06 扬州爱迪秀自动化科技有限公司 一种双工位陶瓷电容分拣装置
CN114545188A (zh) * 2022-03-02 2022-05-27 深圳市卓晶微智能机器人科技有限公司 一种适用性强的半导体测试设备
CN115582632B (zh) * 2022-09-27 2025-07-25 成都尚明工业有限公司 一种半导体引线框架切割装置
CN115971110A (zh) * 2022-12-28 2023-04-18 荣成歌尔微电子有限公司 封装结构的清洗方法和清洗设备

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01121136A (ja) * 1987-11-06 1989-05-12 Canon Inc 物品供給装置
US5232463A (en) 1988-03-05 1993-08-03 Deutsche Itt Industries Gmbh Apparatus for manufacturing a semiconductor device
JPH01289134A (ja) * 1988-05-16 1989-11-21 Seiko Epson Corp 半導体装置のダイ収納トレイ
US5446584A (en) * 1989-09-11 1995-08-29 Kensington Laboratories, Inc. Compact specimen processing station
JP2644912B2 (ja) * 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP2596217Y2 (ja) 1991-06-21 1999-06-07 山形日本電気株式会社 切断成形装置
US5766360A (en) * 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
JPH06252241A (ja) * 1993-03-02 1994-09-09 Toshiba Corp 半導体製造装置
JP3274906B2 (ja) * 1993-05-07 2002-04-15 芝浦メカトロニクス株式会社 半導体樹脂封止装置
JPH0798361A (ja) * 1993-06-19 1995-04-11 Tokyo Electron Ltd 被検査体の収納具及びプローブ装置
JPH07171754A (ja) * 1993-12-20 1995-07-11 Disco Abrasive Syst Ltd 外観検査機能付きダイシング装置
JPH07241870A (ja) * 1994-03-01 1995-09-19 Mitsubishi Materials Corp 電子部品の樹脂封止装置
US5654204A (en) * 1994-07-20 1997-08-05 Anderson; James C. Die sorter
JPH0843482A (ja) * 1994-08-01 1996-02-16 Tokyo Electron Ltd 温調装置
JPH0964148A (ja) * 1995-08-18 1997-03-07 Shinkawa Ltd ウェーハリングの供給・返送装置
JPH0983196A (ja) * 1995-09-11 1997-03-28 Yamagata Casio Co Ltd 電子部品搭載装置
JP3307189B2 (ja) * 1995-10-17 2002-07-24 安藤電気株式会社 無人搬送車によるバーンインボードの自動移載方法およびバーンインテストシステム
JP3739844B2 (ja) * 1995-12-19 2006-01-25 株式会社アドバンテスト ハンドラ装置のストッカ部
JPH09197001A (ja) * 1996-01-16 1997-07-31 Oki Electric Ind Co Ltd Ｉｃ試験用ソケットのハンダくず除去装置
JPH09312309A (ja) * 1996-05-22 1997-12-02 Hitachi Ltd モールド方法およびモールドユニットならびにタブレット
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JPH1038967A (ja) * 1996-07-24 1998-02-13 Advantest Corp Ｉｃ位置決装置
JPH10117092A (ja) * 1996-10-08 1998-05-06 Toshiba Corp 部品供給装置
JP3019005B2 (ja) * 1996-10-16 2000-03-13 日本電気株式会社 Ｌｓｉハンドラ
JPH10163237A (ja) * 1996-11-22 1998-06-19 Texas Instr Inc <Ti> 改良した集積回路チップ・パッケージング方法
JPH10232263A (ja) * 1997-02-19 1998-09-02 Nippon Haiburitsuto:Kk 集積回路の検査装置および検査用導電体
US6090176A (en) * 1997-03-18 2000-07-18 Kabushiki Kaisha Toshiba Sample transferring method and sample transfer supporting apparatus
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
JP4002645B2 (ja) * 1997-11-25 2007-11-07 アピックヤマダ株式会社 半導体装置切断収納装置
JP3338352B2 (ja) * 1997-11-26 2002-10-28 シャープ株式会社 ダイボンダーおよびワイヤーボンダーならびにそれらを用いる半導体装置の製造方法
JPH11223656A (ja) * 1998-02-06 1999-08-17 Jsr Corp 被検査物の位置決め方法、および、それが用いられる検査装置
JP2000040728A (ja) * 1998-07-22 2000-02-08 Nippon Asm Kk ウェハ搬送機構
JP2000111613A (ja) * 1998-10-07 2000-04-21 Nippon Eng Kk バーンインボード用ローダアンローダ装置
JP3605302B2 (ja) * 1998-10-26 2004-12-22 大日本スクリーン製造株式会社 基板処理装置
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
JP2000232080A (ja) * 1999-02-10 2000-08-22 Disco Abrasive Syst Ltd 被加工物の分割システム及びペレットの移し替え装置

Also Published As

Publication number Publication date
CN1360345A (zh) 2002-07-24
SG98444A1 (en) 2003-09-19
HK1048196A1 (en) 2003-03-21
TW495866B (en) 2002-07-21
JP3699661B2 (ja) 2005-09-28
CN1208824C (zh) 2005-06-29
GB2370411B (en) 2003-08-13
GB0107260D0 (en) 2001-05-16
HK1048196B (zh) 2005-09-02
JP2002214288A (ja) 2002-07-31
ITTO20010347A1 (it) 2002-10-11
US20020073575A1 (en) 2002-06-20
SG129308A1 (en) 2007-02-26
US6446354B1 (en) 2002-09-10
GB2370411A (en) 2002-06-26
HK1091947A1 (zh) 2007-01-26

Similar Documents

Publication Publication Date Title
GB2370411B (en) Handler system for cutting a semiconductor package device
DE60006892D1 (de) Halbleiteranordnung
FR2817658B1 (fr) Dispositif semi-conducteur
EP1164595A4 (en) SEMICONDUCTOR DEVICE
DE69912565D1 (de) Halbleiteranordnung
EP1077486A4 (en) SEMICONDUCTOR DEVICE
EP1143536A4 (en) SEMICONDUCTOR COMPONENT
FR2815386B1 (fr) Dispositif d&#39;ecrous anti-desserrage
EP1179851A4 (en) SEMICONDUCTOR
DE69923374D1 (de) Halbleiteranordnung
FR2810160B1 (fr) Dispositif a semiconducteur
FR2774234B1 (fr) Dispositif a semiconducteur
EP0973237A4 (en) Semiconductor laser device
EP1220071A4 (en) SEMICONDUCTOR DEVICE
EP1174967A4 (en) SEMICONDUCTOR LASER DEVICE
IT1318257B1 (it) Lead-frame per dispositivi a semiconduttore.
IT1317458B1 (it) Sistema di posizionamento per un dispositivo misuratore di unsatellite
EP1209752A4 (en) SEMICONDUCTOR COMPONENT
IT1317934B1 (it) Dispositivo a memoria di forma per il trattamento per via endoscopicadi polipi peduncolati.
EP1211733A4 (en) SEMICONDUCTOR COMPONENT
ITTO20020021U1 (it) Dispositivo per l&#39;apertura di un coperchio.
ITRM20010518A1 (it) Dispositivo di tenuta a cassetta.
FR2812247B1 (fr) Dispositif d&#39;alimentation
KR960025345U (ko) 반도체 장치의 포토레지스트 제거장치.
IT245287Y1 (it) Dispositivo medico-odontoiatrico per abbattimento di difficolta&#39;.