JP1782485S - プラズマ処理装置用サセプタリング - Google Patents

プラズマ処理装置用サセプタリング

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Publication number
JP1782485S
JP1782485S JP2023020295F JP2023020295F JP1782485S JP 1782485 S JP1782485 S JP 1782485S JP 2023020295 F JP2023020295 F JP 2023020295F JP 2023020295 F JP2023020295 F JP 2023020295F JP 1782485 S JP1782485 S JP 1782485S
Authority
JP
Japan
Prior art keywords
plasma processing
susceptor ring
processing equipment
plasma
present article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023020295F
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Priority to JP2023020295F priority Critical patent/JP1782485S/ja
Priority to US29/934,856 priority patent/USD1108380S1/en
Priority to TW113301478F priority patent/TWD234042S/zh
Application granted granted Critical
Publication of JP1782485S publication Critical patent/JP1782485S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

本物品は、半導体製造で使われるプラズマ処理装置に用いられるサセプタリングであり、主にステージをプラズマから保護するためのものである。通常、本物品は、本物品と別のサセプタリングを組み合わせた状態で使用される。
JP2023020295F 2023-09-29 2023-09-29 プラズマ処理装置用サセプタリング Active JP1782485S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023020295F JP1782485S (ja) 2023-09-29 2023-09-29 プラズマ処理装置用サセプタリング
US29/934,856 USD1108380S1 (en) 2023-09-29 2024-03-28 Electrode cover for a plasma processing apparatus
TW113301478F TWD234042S (zh) 2023-09-29 2024-03-28 電漿處理裝置用保護環

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023020295F JP1782485S (ja) 2023-09-29 2023-09-29 プラズマ処理装置用サセプタリング

Publications (1)

Publication Number Publication Date
JP1782485S true JP1782485S (ja) 2024-10-17

Family

ID=93058244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023020295F Active JP1782485S (ja) 2023-09-29 2023-09-29 プラズマ処理装置用サセプタリング

Country Status (3)

Country Link
US (1) USD1108380S1 (ja)
JP (1) JP1782485S (ja)
TW (1) TWD234042S (ja)

Family Cites Families (33)

* Cited by examiner, † Cited by third party
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US1798246A (en) * 1930-09-19 1931-03-31 Victor Mfg & Gasket Co Gasket
US2508705A (en) * 1946-01-18 1950-05-23 Gen Aniline & Film Corp Pulverulent iron of improved electromagnetic properties
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
WO2004033152A1 (en) * 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
USD537744S1 (en) * 2004-11-30 2007-03-06 Shih-Hsiung Wu Ring cover for a vehicle gage
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20090050272A1 (en) * 2007-08-24 2009-02-26 Applied Materials, Inc. Deposition ring and cover ring to extend process components life and performance for process chambers
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD709537S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
CN102534567B (zh) * 2012-03-21 2014-01-15 中微半导体设备(上海)有限公司 控制化学气相沉积腔室内的基底加热的装置及方法
WO2013184349A1 (en) * 2012-06-05 2013-12-12 Applied Materials, Inc. Two-part retaining ring with interlock features
FR3002242B1 (fr) * 2013-02-21 2015-04-03 Altatech Semiconductor Dispositif de depot chimique en phase vapeur
USD729730S1 (en) * 2013-06-06 2015-05-19 Jon Simon Gillespie-Brown Power charging ring
USD717746S1 (en) * 2013-11-06 2014-11-18 Applied Materials, Inc. Lower chamber liner
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
JP1545406S (ja) * 2015-06-16 2016-03-14
JP1545407S (ja) * 2015-06-16 2016-03-14
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1584241S (ja) 2017-01-31 2017-08-21
JP1584906S (ja) 2017-01-31 2017-08-28
JP1598998S (ja) * 2017-08-31 2018-03-05
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
JP1704964S (ja) * 2021-04-19 2022-01-14 プラズマ処理装置用サセプタリング
USD1066275S1 (en) * 2022-04-04 2025-03-11 Applied Materials, Inc. Baffle for anti-rotation process kit for substrate processing chamber
USD1061309S1 (en) * 2024-10-14 2025-02-11 Ping Liu Ring cover

Also Published As

Publication number Publication date
TWD234042S (zh) 2024-10-01
USD1108380S1 (en) 2026-01-06

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