JP1704964S - プラズマ処理装置用サセプタリング - Google Patents
プラズマ処理装置用サセプタリングInfo
- Publication number
- JP1704964S JP1704964S JP2021008306F JP2021008306F JP1704964S JP 1704964 S JP1704964 S JP 1704964S JP 2021008306 F JP2021008306 F JP 2021008306F JP 2021008306 F JP2021008306 F JP 2021008306F JP 1704964 S JP1704964 S JP 1704964S
- Authority
- JP
- Japan
- Prior art keywords
- article
- processing equipment
- plasma processing
- suceptoring
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Abstract
本物品は、半導体製造で使われるプラズマ処理装置に用いられるサセプタリングであり、静電チャックおよびRF給電リングをプラズマから保護するためのものである。本物品は、B-B部分拡大図において略横長長方形状で表れる大きな溝を備えており、また、長い外周縁部を備えることで、使用状態及び各部の名称を示す参考図に一例を示すように、使用状態において本物品の外周縁部が内側の構成物を囲う形状としている。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021008306F JP1704964S (ja) | 2021-04-19 | 2021-04-19 | プラズマ処理装置用サセプタリング |
| TW110305596F TWD235887S (zh) | 2021-04-19 | 2021-10-18 | 電漿處理裝置用保護環 |
| US29/789,775 USD1005245S1 (en) | 2021-04-19 | 2021-10-18 | Electrode cover for a plasma processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021008306F JP1704964S (ja) | 2021-04-19 | 2021-04-19 | プラズマ処理装置用サセプタリング |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1704964S true JP1704964S (ja) | 2022-01-14 |
Family
ID=80217244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021008306F Active JP1704964S (ja) | 2021-04-19 | 2021-04-19 | プラズマ処理装置用サセプタリング |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1005245S1 (ja) |
| JP (1) | JP1704964S (ja) |
| TW (1) | TWD235887S (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11387134B2 (en) | 2018-01-19 | 2022-07-12 | Applied Materials, Inc. | Process kit for a substrate support |
| USD1066275S1 (en) | 2022-04-04 | 2025-03-11 | Applied Materials, Inc. | Baffle for anti-rotation process kit for substrate processing chamber |
| USD1049067S1 (en) * | 2022-04-04 | 2024-10-29 | Applied Materials, Inc. | Ring for an anti-rotation process kit for a substrate processing chamber |
| USD1121576S1 (en) * | 2022-07-14 | 2026-04-07 | Applied Materials Inc. | Purge ring for a substrate processing chamber |
| US12553133B2 (en) | 2022-08-04 | 2026-02-17 | Applied Materials Inc. | Substrate handling system, method, and apparatus |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) * | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| JP1746404S (ja) * | 2023-01-11 | 2023-06-15 | サセプタカバーベース | |
| USD1083043S1 (en) * | 2023-03-28 | 2025-07-08 | Mitsubishi Cable Industries, Ltd. | Composite seal member for semiconductor production apparatus |
| JP1782485S (ja) * | 2023-09-29 | 2024-10-17 | プラズマ処理装置用サセプタリング | |
| JP1782543S (ja) * | 2023-09-29 | 2024-10-17 | プラズマ処理装置用サセプタリング | |
| JP1766095S (ja) * | 2023-12-01 | 2024-03-19 | サセプタ | |
| USD1110288S1 (en) * | 2024-03-20 | 2026-01-27 | Kokusai Electric Corporation | Heat insulation pedestal of a semiconductor manufacturing apparatus |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA127551A (en) * | 1909-12-18 | 1910-08-16 | Leon Braquier | Confection explosive shell |
| USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US10003873B2 (en) * | 2011-09-06 | 2018-06-19 | Kohler Co. | Speaker and shower |
| JP1546801S (ja) * | 2015-06-12 | 2016-03-28 | ||
| TWD178425S (zh) * | 2016-01-08 | 2016-09-21 | Asm Ip Holding Bv | 用於半導體製造設備的電極板 |
| USD794753S1 (en) * | 2016-04-08 | 2017-08-15 | Applied Materials, Inc. | Showerhead for a semiconductor processing chamber |
| JP1584906S (ja) * | 2017-01-31 | 2017-08-28 | ||
| JP1598996S (ja) * | 2017-08-31 | 2018-03-05 | ||
| JP1598998S (ja) * | 2017-08-31 | 2018-03-05 | ||
| JP1598997S (ja) * | 2017-08-31 | 2018-03-05 | ||
| USD874617S1 (en) * | 2018-02-12 | 2020-02-04 | Chudun Chen | Shower drain strainer |
| USD877931S1 (en) * | 2018-05-09 | 2020-03-10 | Moleculight, Inc. | Dispenser for a darkening drape |
| JP1624795S (ja) * | 2018-07-24 | 2019-02-18 | ||
| JP1624794S (ja) * | 2018-07-24 | 2019-02-18 | ||
| JP1624793S (ja) * | 2018-07-24 | 2019-02-18 | ||
| JP1640255S (ja) * | 2018-10-25 | 2019-09-02 | ||
| USD934994S1 (en) * | 2019-05-09 | 2021-11-02 | Fratelli Fantini S.P.A. | Shower head |
| JP1659287S (ja) | 2019-10-18 | 2020-05-11 | ||
| USD923744S1 (en) * | 2020-01-08 | 2021-06-29 | As America, Inc. | Shower head |
| JP1678330S (ja) * | 2020-05-27 | 2021-02-01 | ||
| JP1733645S (ja) * | 2022-04-25 | 2023-01-04 | 半導体処理装置用シャワーヘッド | |
| JP1729106S (ja) * | 2022-04-25 | 2022-11-04 | 半導体処理装置用シャワーヘッド |
-
2021
- 2021-04-19 JP JP2021008306F patent/JP1704964S/ja active Active
- 2021-10-18 US US29/789,775 patent/USD1005245S1/en active Active
- 2021-10-18 TW TW110305596F patent/TWD235887S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| USD1005245S1 (en) | 2023-11-21 |
| TWD235887S (zh) | 2025-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP1704964S (ja) | プラズマ処理装置用サセプタリング | |
| TWD210379S (zh) | 電漿處理裝置用保護環 | |
| TW201612974A (en) | Proximity contact cover ring for plasma dicing | |
| TWD193611S (zh) | Electrode plate peripheral ring for plasma processing equipment | |
| JP1741174S (ja) | サセプタ | |
| JP2017508303A5 (ja) | ||
| TWD193438S (zh) | Jet ring for plasma processing unit | |
| TWD204260S (zh) | 通氣基座 | |
| PH12020551137A1 (en) | Deposition ring for processing reduced size substrates | |
| TWD186395S (zh) | 電漿處理裝置用保護環 | |
| TWD189313S (zh) | 用於半導體製造設備的承載器 | |
| MY191098A (en) | Bottle with insulative body | |
| JP1766095S (ja) | サセプタ | |
| TWD190344S (zh) | Shield ring for plasma processing unit | |
| TWD186394S (zh) | 電漿處理裝置用保護環 | |
| WO2012057987A3 (en) | Deposition ring and electrostatic chuck for physical vapor deposition chamber | |
| TWD175854S (zh) | 電漿處理裝置用保護環 | |
| JP1745924S (ja) | サセプタ | |
| JP2016207806A5 (ja) | ||
| TWD204229S (zh) | 電漿處理裝置用環 | |
| JP1746404S (ja) | サセプタカバーベース | |
| JP1782485S (ja) | プラズマ処理装置用サセプタリング | |
| JP1782543S (ja) | プラズマ処理装置用サセプタリング | |
| SG10201402193TA (en) | Chemical mechanical polishing fixture having lateral perforation structures | |
| JP1790303S (ja) | カバーリング |