JP2000502467A - ポジ型フォトレジスト用の混合溶剤系 - Google Patents
ポジ型フォトレジスト用の混合溶剤系Info
- Publication number
- JP2000502467A JP2000502467A JP9523737A JP52373797A JP2000502467A JP 2000502467 A JP2000502467 A JP 2000502467A JP 9523737 A JP9523737 A JP 9523737A JP 52373797 A JP52373797 A JP 52373797A JP 2000502467 A JP2000502467 A JP 2000502467A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- ether acetate
- photoresist
- propylene glycol
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 73
- 239000012046 mixed solvent Substances 0.000 title description 4
- 239000000203 mixture Substances 0.000 claims abstract description 54
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229920003986 novolac Polymers 0.000 claims abstract description 24
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 claims abstract description 18
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims abstract description 14
- 150000005215 alkyl ethers Chemical class 0.000 claims abstract description 13
- 239000011877 solvent mixture Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 33
- 239000002904 solvent Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- -1 alkyl ether acetate Chemical class 0.000 claims description 12
- 239000003504 photosensitizing agent Substances 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004014 plasticizer Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002318 adhesion promoter Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical group OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 230000032050 esterification Effects 0.000 claims description 3
- 238000005886 esterification reaction Methods 0.000 claims description 3
- 230000001235 sensitizing effect Effects 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 239000002952 polymeric resin Substances 0.000 claims description 2
- 229920005591 polysilicon Polymers 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000003245 coal Substances 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 claims 2
- 150000004982 aromatic amines Chemical class 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 2
- 239000007859 condensation product Substances 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 229920000768 polyamine Polymers 0.000 claims 2
- 239000000047 product Substances 0.000 claims 2
- 235000014121 butter Nutrition 0.000 claims 1
- 239000010408 film Substances 0.000 description 24
- 238000011161 development Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 210000002381 plasma Anatomy 0.000 description 4
- 239000000975 dye Substances 0.000 description 3
- 239000003623 enhancer Substances 0.000 description 3
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PVNIIMVLHYAWGP-UHFFFAOYSA-N Niacin Chemical compound OC(=O)C1=CC=CN=C1 PVNIIMVLHYAWGP-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000003791 organic solvent mixture Substances 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000013557 residual solvent Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YVLNDCLPPGIRCP-UHFFFAOYSA-N 2-nitro-3-phenylprop-2-enoic acid Chemical compound OC(=O)C([N+]([O-])=O)=CC1=CC=CC=C1 YVLNDCLPPGIRCP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 241001001781 Citrus karna Species 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WWKGVZASJYXZKN-UHFFFAOYSA-N Methyl violet 2B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(N)=CC=1)=C1C=CC(=[N+](C)C)C=C1 WWKGVZASJYXZKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- FDZZZRQASAIRJF-UHFFFAOYSA-M malachite green Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](C)C)C=C1 FDZZZRQASAIRJF-UHFFFAOYSA-M 0.000 description 1
- 229940107698 malachite green Drugs 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- PGSADBUBUOPOJS-UHFFFAOYSA-N neutral red Chemical compound Cl.C1=C(C)C(N)=CC2=NC3=CC(N(C)C)=CC=C3N=C21 PGSADBUBUOPOJS-UHFFFAOYSA-N 0.000 description 1
- 229960003512 nicotinic acid Drugs 0.000 description 1
- 235000001968 nicotinic acid Nutrition 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- LLWJPGAKXJBKKA-UHFFFAOYSA-N victoria blue B Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)=C(C=C1)C2=CC=CC=C2C1=[NH+]C1=CC=CC=C1 LLWJPGAKXJBKKA-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.少なくとも一種の水不溶性で水性アルカリ可溶性の膜形成性のノボラック樹 脂; 少なくとも一種の o-ジアゾナフトキノン系感光化剤; 及びプロピレング リコールアルキルエーテルアセテートと 3-メチル-3-メトキシブタノールとを含 むフォトレジスト溶剤混合物の混合物から本質的になる、フォトレジストとして 使用するのに適した感光性ポジ型感光性組成物。 2.プロピレングリコールアルキルエーテルアセテート成分が、プロピレングリ コールメチルエーテルアセテートである請求の範囲第1項の組成物。 3.着色剤、アンチストライエーション剤、可塑剤、粘着促進剤、増速剤、溶剤 及び界面活性剤からなる群から選択される一種またはそれ以上の添加物を更に含 む請求の範囲第1項の組成物。 4.3-メチル-3-メトキシブタノール溶剤が、溶剤混合物の約 10〜約 90 重量% の量で存在し、その残りが、3-メチル-3-メトキシブタノールとプロピレングリ コールアルキルエーテルアセテートの合計が使用した溶剤の 100%を構成するよ うな量のプロピレングリコールアルキルエーテルアセテートからなる請求の範囲 第1項の組成物。 5.ノボラック樹脂が、該組成物の重量を基準として約5%〜約 40%の量で存 在する請求の範囲第1項の組成物。 6.ジアゾナフトキノンが、該組成物の固体部分の重量を基準として約5%〜約 35%の量で存在する請求の範囲第1項の組成物。 7.ジアゾナフトキノン成分が、ヒドロキシまたはポリヒドロキシアリール化合 物、アリールアミン類あるいはポリアミン類とジアゾスルホニルクロライドとの 反応生成物から選択される一種またはそれ以上の化合物からなる請求の範囲第1 項の組成物。 8.感光化剤が、2,3,4-トリヒドロキシベンゾフェノンとナフトキノン-(1,2)- ジアジド-5-スルホニルクロライドとの、エステル化度約 45%の縮合生成物であ る請求の範囲第1項の組成物。 9.基体、及びこの基体に付着した請求の範囲第1項の組成物からなる感光性要 素。 10.基体が、ケイ素、アルミニウム、ポリマー性樹脂、二酸化ケイ素、ドープし た二酸化ケイ素、窒化ケイ素、タンタル、銅、ポリシリコン、セラミック及びア ルミニウム/銅混合物からなる群から選択された一種またはそれ以上の成分から なる請求の範囲第9項の要素。 11.少なくとも一種の水不溶性で水性アルカリ可溶性の膜形成性ノボラック樹脂 ;少なくとも一種のオルト-ジアゾナフトキノン系感光化剤;及びプロピレング リコールアルキルエーテルアセテートと 3-メチル-3-メトキシブタノールとを含 むフォトレジスト溶剤混合物の混合物を形成させることからなる、フォトレジス トとして使用するのに適したポジ型感光性組成物の製造方法。 12.プロピレングリコールアルキルエーテルアセテート成分が、プロピレングリ コールメチルエーテルアセテートである請求の範囲第 11 項の方法。 13.着色剤、アンチストライエーション剤、可塑剤、粘着促進剤、増速剤、溶剤 及び界面活性剤からなる群から選択される一種またはそれ以上の添加物を更に含 む請求の範囲第 11 項の方法。 14.3-メチル-3-メトキシブタノール溶剤が、溶剤混合物の約 10〜約 90 重量% の量で存在し、その残りが、3-メチル-3-メトキシブタノールとプロピレングリ コールアルキルエーテルアセテートの合計が使用した溶剤の 100%を構成するよ うな量のプロピレングリコールアルキルエーテルアセテートからなる請求の範囲 第 11 項の方法。 15.ノボラック樹脂が、該組成物の重量を基準として約5%〜約 40%の量で存 在する請求の範囲第 11 項の方法。 16.ジアゾナフトキノンが、該組成物の固体部分の重量を基準として約5%〜約 35%の量で存在する請求の範囲第 11 項の方法。 17.ジアゾナフトキノン成分が、ヒドロキシまたはポリヒドロキシアリール化合 物、アリールアミン類またはポリアミン類とジアゾスルホニルクロライドとの反 応生成物から選択される一種またはそれ以上の化合物からなる請求の範囲第11項 の方法。 18.感光化剤が、2,3,4-トリヒドロキシベンゾフェノンとナフトキノン-(1,2)- ジアジド-5-スルホニルクロライドとの、エステル化度約 45%の縮合生成物であ る請求の範囲第 11 項の方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/576,748 US5853947A (en) | 1995-12-21 | 1995-12-21 | Quinonediazide positive photoresist utilizing mixed solvent consisting essentially of 3-methyl-3-methoxy butanol and propylene glycol alkyl ether acetate |
| US08/576,748 | 1995-12-21 | ||
| PCT/US1996/019953 WO1997023808A2 (en) | 1995-12-21 | 1996-12-17 | A mixed solvent system for positive photoresists |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000502467A true JP2000502467A (ja) | 2000-02-29 |
| JP3765582B2 JP3765582B2 (ja) | 2006-04-12 |
Family
ID=24305834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP52373797A Expired - Fee Related JP3765582B2 (ja) | 1995-12-21 | 1996-12-17 | ポジ型フォトレジスト用の混合溶剤系 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5853947A (ja) |
| EP (1) | EP0868684B1 (ja) |
| JP (1) | JP3765582B2 (ja) |
| KR (1) | KR100483762B1 (ja) |
| CN (1) | CN1094208C (ja) |
| DE (1) | DE69605821T2 (ja) |
| TW (1) | TW412664B (ja) |
| WO (1) | WO1997023808A2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000081700A (ja) * | 1998-07-02 | 2000-03-21 | Nippon Zeon Co Ltd | パタ―ン形成方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6099798A (en) | 1997-10-31 | 2000-08-08 | Nanogram Corp. | Ultraviolet light block and photocatalytic materials |
| KR100594815B1 (ko) * | 1999-12-24 | 2006-07-03 | 삼성전자주식회사 | 포토레지스트 린스용 씬너 및 이를 이용한 포토레지스트막의 처리 방법 |
| JP4209297B2 (ja) * | 2003-10-06 | 2009-01-14 | 東京応化工業株式会社 | 吐出ノズル式塗布法用ポジ型ホトレジスト組成物及びレジストパターンの形成方法 |
| DE102013103723B4 (de) * | 2013-04-12 | 2023-02-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Bauteils |
| CN107918249A (zh) * | 2016-10-05 | 2018-04-17 | 罗门哈斯电子材料韩国有限公司 | 感光性树脂组合物和由其制备的固化膜 |
| CN110441989B (zh) * | 2019-08-07 | 2022-08-23 | 沧州信联化工有限公司 | 一种光刻胶组合物 |
| JP7539466B2 (ja) | 2019-11-19 | 2024-08-23 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Pag不含ポジ型化学増幅レジスト組成物及びそれの使用法 |
| CN119668034B (zh) * | 2025-02-20 | 2025-07-18 | 江苏中科智芯集成科技有限公司 | 一种改善光刻胶涂胶均匀度的方法及系统 |
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| DE938233C (de) * | 1953-03-11 | 1956-01-26 | Kalle & Co Ag | Lichtempfindliches Material fuer die photomechanische Herstellung von Druckformen |
| NL199484A (ja) * | 1954-08-20 | |||
| NL247405A (ja) * | 1959-01-15 | |||
| NL131386C (ja) * | 1959-08-29 | |||
| US3201329A (en) * | 1963-06-10 | 1965-08-17 | Burt And Redman | Carbonizing process and apparatus |
| US3802885A (en) * | 1967-08-15 | 1974-04-09 | Algraphy Ltd | Photosensitive lithographic naphthoquinone diazide printing plate with aluminum base |
| US3666473A (en) * | 1970-10-06 | 1972-05-30 | Ibm | Positive photoresists for projection exposure |
| US3785825A (en) * | 1971-07-19 | 1974-01-15 | Polychrome Corp | Light-sensitive quinone diazide compounds,compositions,and presensitized lithographic plate |
| GB1375461A (ja) * | 1972-05-05 | 1974-11-27 | ||
| JPS5280022A (en) * | 1975-12-26 | 1977-07-05 | Fuji Photo Film Co Ltd | Light solubilizable composition |
| US4173470A (en) * | 1977-11-09 | 1979-11-06 | Bell Telephone Laboratories, Incorporated | Novolak photoresist composition and preparation thereof |
| US4439516A (en) * | 1982-03-15 | 1984-03-27 | Shipley Company Inc. | High temperature positive diazo photoresist processing using polyvinyl phenol |
| US5143814A (en) * | 1984-06-11 | 1992-09-01 | Hoechst Celanese Corporation | Positive photoresist compositions with o-quinone diazide, novolak and propylene glycol alkyl ether acetate |
| US4550069A (en) * | 1984-06-11 | 1985-10-29 | American Hoechst Corporation | Positive photoresist compositions with o-quinone diazide, novolak, and propylene glycol alkyl ether acetate |
| US5066561A (en) * | 1984-06-11 | 1991-11-19 | Hoechst Celanese Corporation | Method for producing and using a positive photoresist with o-quinone diazide, novolak, and propylene glycol alkyl ether acetate |
| JPH083630B2 (ja) * | 1986-01-23 | 1996-01-17 | 富士写真フイルム株式会社 | 感光性組成物 |
| EP0260994B1 (en) * | 1986-09-18 | 1992-07-15 | Japan Synthetic Rubber Co., Ltd. | Process for producing integrated circuit |
| JPH049852A (ja) * | 1990-04-27 | 1992-01-14 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
-
1995
- 1995-12-21 US US08/576,748 patent/US5853947A/en not_active Expired - Fee Related
-
1996
- 1996-12-04 TW TW085114949A patent/TW412664B/zh active
- 1996-12-17 DE DE69605821T patent/DE69605821T2/de not_active Expired - Fee Related
- 1996-12-17 JP JP52373797A patent/JP3765582B2/ja not_active Expired - Fee Related
- 1996-12-17 EP EP96945607A patent/EP0868684B1/en not_active Expired - Lifetime
- 1996-12-17 KR KR10-1998-0704612A patent/KR100483762B1/ko not_active Expired - Fee Related
- 1996-12-17 WO PCT/US1996/019953 patent/WO1997023808A2/en not_active Ceased
- 1996-12-17 CN CN961992026A patent/CN1094208C/zh not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000081700A (ja) * | 1998-07-02 | 2000-03-21 | Nippon Zeon Co Ltd | パタ―ン形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0868684A2 (en) | 1998-10-07 |
| KR19990072215A (ko) | 1999-09-27 |
| KR100483762B1 (ko) | 2005-09-15 |
| DE69605821T2 (de) | 2000-07-27 |
| TW412664B (en) | 2000-11-21 |
| EP0868684B1 (en) | 1999-12-22 |
| CN1094208C (zh) | 2002-11-13 |
| CN1205783A (zh) | 1999-01-20 |
| US5853947A (en) | 1998-12-29 |
| DE69605821D1 (de) | 2000-01-27 |
| WO1997023808A3 (en) | 1997-08-07 |
| JP3765582B2 (ja) | 2006-04-12 |
| WO1997023808A2 (en) | 1997-07-03 |
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