JP2686830B2 - Hybrid integrated circuit - Google Patents

Description

The present invention relates to a hybrid integrated circuit, and more particularly to a lead terminal structure of the hybrid integrated circuit.

(B) Conventional Technique A conventional hybrid integrated circuit will be described with reference to FIG.

The substrate (21) is a ceramic substrate or an insulating metal substrate having one surface of a metal such as aluminum coated with a resin, and a metal layer formed by vapor deposition, plating or adhesion is selectively etched on the upper surface of the substrate to form a conductive path of a predetermined shape. (Not shown) is formed. A transistor on the conductive path,
Multiple circuit elements such as IC, LSI or chip resistors (26)
Is fixed, and a metallic lead terminal (23) for external connection is fixed to a fixing pad (not shown) continuous to a predetermined conductive path. The substrate on which the circuit element (26) and the lead terminal (23) are fixed and the hybrid integrated circuit is formed is hermetically sealed in the resin case (22) using an adhesive sheet or the like, and the lead terminal (23) The fixed portion is filled with a resin (24) to reinforce the fixed portion.

In the hybrid integrated circuit configured as described above, the lead terminal (23) is directly attached to another circuit board for use, or the hybrid integrated circuit is attached to the radiator,
The lead terminal (23) is used by being cable-connected to another circuit board. Therefore, in consideration of the case where the hybrid integrated circuit is attached to the radiator, the lead terminal (23) is separated from the lower surface of the substrate by the thickness of the socket, so that the lead terminal is formed into a substantially L shape.

(C) Problems to be Solved by the Invention In a conventional hybrid integrated circuit, prior to the work of fixing the lead terminals, the lead terminals are vertically and horizontally aligned and the tilt is adjusted at the same time to fix the lead terminal fixing portion. A high degree of skill was required for the assembly work because it had to be correctly opposed to the conductive path.

In addition, the fixed part of the lead terminal is easily peeled off by external force,
In particular, care must be taken when handling the hybrid integrated circuit board immediately after the lead terminals are fixed.

(D) Means for Solving the Problems The present invention has been made in view of the problems described above,
A hybrid integrated circuit board having a recess or a through hole at its end, and a plurality of lead-shaped lead-out portions each having a substantially crank shape composed of a fixed pad connection portion, a vertical gap setting portion and a lead-out portion are supported at predetermined intervals. And a supporting member integrally formed with a recess or a through hole formed in the hybrid integrated circuit board, and a closed space is formed on the upper surface of the hybrid integrated circuit board, and abuts the supporting member in a suitable structure. A case member is provided to solve the above problems.

(E) Action According to the present invention, the fitting structure formed on the lower surface of the supporting member is fitted to the concave portion or the through hole formed at the end portion of the hybrid integrated circuit board so as to fit the lead terminals up and down,
The left-right alignment and tilt adjustment are complete.

In addition, sufficient strength is obtained immediately after the lead terminals are fixed, and the contact area between the supporting member and the substrate is large, so that the sealing is performed densely.

(F) Embodiments The present invention will be described in detail based on the embodiments illustrated in FIGS. 1 to 3.

Referring to FIG. 1 for explaining the cross-sectional structure of the first embodiment, a hybrid integrated circuit of the present invention is a hybrid integrated circuit substrate (1) (hereinafter, simply referred to as a substrate) in which a recess (1 ′) is formed in an end portion. "), And a support member on which a plurality of lead terminals (3) are integrally formed, and a resin case material (2) having a recess (2 ') formed at the end, and projections formed on the upper and lower surfaces. (4)
It is composed of Case material (2) is case material (2)
And a side surface of the substrate (1) so as to form a sealed space for a circuit element described later between the substrate and the substrate (1). Part of that is indicated by reference numeral (2). The recess (1 ′) of the substrate (1) and the recess (2 ′) of the case material (2) can be through holes, and the convex structure of the support member (4) is a step structure or a support structure. It is possible to adopt a structure in which the entire one surface of the member (4) is fitted.

Substrate (1) is deposited a surface of a metal such as a ceramic substrate or aluminum insulated substrate coated with resin, a metal layer such as C _u formed by plating or adhering or the like, the conductive path having a predetermined shape by selective etching (5 ) Is formed. Then, on the conductive path (5), transistors, IC, LS
A plurality of circuit elements (6) such as I or chip resistors are fixed. Further, a predetermined conductive path is extended to the end of the substrate (1) to connect the lead terminals to the fixing pad (5 ').
Are formed.

The structure of the support member (4) will be described in more detail with reference to FIG.

The convex portion (4 ') of the lower surface of the support member (4) is fitted with the concave portion (1') of the substrate (1), and is formed on the entire lower surface, part of the lower surface or divided into the lower surface. The structure described above is an essential structure for the present invention. On the other hand, the convex portion (4 ′) on the upper surface and the convex portion (4 ″) on the side surface have a structure that fits with the case member (2) and are formed as necessary. When adopted, the support member (4) and the case member (2) are more strongly engaged with each other, and the effect of more completely preventing the intrusion of water and the like into the hybrid integrated circuit due to the increase in the bonding area is expected. To be done.

The lead terminal (3) is a vertical interval setting part (3 ') that separates the lead terminal from the substrate (1) in the vertical direction by a predetermined length, and a connection part (3) that is soldered to the fixing pad (5') of the substrate (1). ") And the lead-out portion (3), and has a substantially crank shape. The illustrated support member structure in which the lead-out portion (3) of the lead terminal (3) having such a shape is integrated at a predetermined interval is a monolithic structure. It is easily obtained by a manufacturing method similar to the molding of lead frames in the manufacture of integrated circuits.

Referring again to FIG. 1, the description of the hybrid integrated circuit of the present invention will be continued.

When the convex portion (4 ') on the lower surface of the supporting member (4) is brought into contact with and fitted into the concave portion (1') formed at the end of the substrate (1), the connecting portion of all the lead terminals (3) (3 ") correctly abuts each fixing pad (5 ') of the substrate (1) with a proper pressing force. This allows the fixing pad (5') and the connecting portion (3") to be soldered. A very simple and good residual stress-free connection is obtained. Then, the substrate (1) is covered with the resin case material (2) and sealed with an adhesive sheet or the like. Further, the space of the fixing pad (5 ') is filled with a resin if necessary.

The lead terminal (3) is formed by the end portion (1 ") of the substrate (1), the end portion (2") of the case member (2) and the supporting member (4).
When a recess is formed in the vicinity of the lead-out portion of the socket, the recess serves as a socket insertion hole, which prevents the lead terminal (3) from being deformed when the socket (7) is inserted and prevents the socket from coming off. . In that case, it is possible to employ a locking mechanism that utilizes the elasticity of the case material (2 "). Further, this socket insertion hole has a lead terminal (3) on the support member (4) itself.
It can also be formed by providing a structure (not shown) surrounding the lead-out portion (3).

 Another embodiment of the present invention will be described with reference to FIG.

Hybrid integrated circuits for high-power applications are often placed apart from the main circuit board in consideration of heat dissipation, and the main circuit board and the hybrid integrated circuit are connected by a cable having sockets and connectors at both ends. The present embodiment provides a hybrid integrated circuit suitable for the above-mentioned special purpose in which the cable length is designed in advance.

In FIG. 3, the support member (4) is internally connected to the lead terminal (3) and the external connection cable (8). Such a support member structure can also be easily obtained by a method similar to the molding of lead frames in the manufacture of monolithic integrated circuits. The connector (9)
Is connected to the cable in advance or after the hybrid integrated circuit is completed.

The support member (4) of this embodiment is used for the same substrate (1) and case member (2) as in the first embodiment, and is assembled in the same manner. Therefore, in addition to the new effect that the socket is not required on the cable side, the same effect as the first embodiment is provided.

FIG. 5 shows still another embodiment of the present invention. In this embodiment, a conductive path (10) is formed on the back surface of the case material (2), that is, the surface facing the substrate (1), similarly to the substrate (1), and the circuit element (11) is formed on the conductive path (10). ) Is fixed, the case material is also a hybrid integrated circuit board. Therefore, according to this embodiment, it is possible to provide a hybrid integrated circuit having a higher degree of integration.

(G) Effect of the Invention As described above, according to the present invention, since the lead terminals are completely aligned by fitting the supporting member to the substrate, the soldering work of the lead terminals is extremely simplified and the residual A good connection without stress is obtained.

Further, since the external force applied to the lead terminal is absorbed by the fitting portion of the support member, sufficient strength is obtained in the lead terminal connecting portion immediately after the lead terminal is fixed, and peeling of the lead terminal connecting portion is prevented.

Furthermore, since it is possible to connect the lead terminal and the external connection cable inside the support member, the workability of electrical equipment is improved and the socket on the hybrid integrated circuit side is not required.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a hybrid integrated circuit of the present invention, FIG. 2 is a perspective view showing a supporting member used in FIG. 1, and FIG. 3 is a sectional view showing another embodiment of the present invention. FIG. 5 is a sectional view showing a conventional example, and FIG. 5 is a sectional view showing yet another embodiment of the present invention. (1) ... Hybrid integrated circuit board, (2) ... Case material,
(3) ... Lead terminal, (4) ... Support member, (5) ...
… Conductive path, (6) …… Circuit element, (7) …… Socket,
(8) …… Cable, (9) …… Connector.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Chizumi Izumi, 3-1, Shinchi Fuchu-cho, Aki-gun, Hiroshima Prefecture Mazda Co., Ltd. (72) Yuichi Ito 3-1-1 Shinchi, Fuchu-cho, Aki-gun, Hiroshima Prefecture Da Co., Ltd. (56) Reference Japanese Unexamined Patent Publication No. 3-89540 (JP, A) Actually open 62-74345 (JP, U) Actually open 2-144670 (JP, U)

Claims (6)

(57) [Claims] 1. A hybrid integrated circuit board having a recess or a through hole formed at an end thereof, and a lead-out portion of a plurality of lead terminals each having a substantially crank shape, the lead-out portion having a fixed pad connection portion, a vertical gap setting portion and a lead-out portion. A supporting member integrally formed with a structure for supporting at a predetermined interval and a structure for fitting with a recess or a through hole formed in the hybrid integrated circuit board, and a closed space is formed on the upper surface of the hybrid integrated circuit board so as to be properly connected to the supporting member. A hybrid integrated circuit comprising: a case member that abuts in a structure. 2. The hybrid integrated circuit according to claim 1, wherein the support member has fitting structures on its four surfaces. 3. The hybrid integrated circuit according to claim 1, wherein the lead-out portion of the lead terminal is connected to the cable within the support member. 4. The hybrid integrated circuit according to claim 1, wherein a socket insertion hole is formed by the hybrid integrated circuit board, the case member and the supporting member. 5. The hybrid integrated circuit according to claim 1, wherein the support member has a socket surrounding structure. 6. The hybrid integrated circuit according to claim 1, wherein the case member is a hybrid integrated circuit board.