JP5568253B2 - フロートゾーン法により製造したシリコン単結晶及びシリコン基板 - Google Patents
フロートゾーン法により製造したシリコン単結晶及びシリコン基板 Download PDFInfo
- Publication number
- JP5568253B2 JP5568253B2 JP2009136116A JP2009136116A JP5568253B2 JP 5568253 B2 JP5568253 B2 JP 5568253B2 JP 2009136116 A JP2009136116 A JP 2009136116A JP 2009136116 A JP2009136116 A JP 2009136116A JP 5568253 B2 JP5568253 B2 JP 5568253B2
- Authority
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- Prior art keywords
- single crystal
- rotation
- silicon
- vessel
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 title claims description 74
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 10
- 229910052710 silicon Inorganic materials 0.000 title claims description 10
- 239000010703 silicon Substances 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 title claims description 4
- 238000000034 method Methods 0.000 title description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 16
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000002441 reversible effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000000155 melt Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/26—Stirring of the molten zone
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
Claims (2)
- 容器内の不活性ガス及び窒素からなる雰囲気が1.5〜2.2barの圧力であり、前記の雰囲気を連続的に交換し、この場合、1時間当たり容器の容量の少なくとも2倍を交換し、かつ原料棒の溶融のために少なくとも220mmの外径の平板コイルを使用し、単結晶を1.4〜2.2mm/minの範囲内の速度で引き下げかつ回転角の1セットづつ周期的に回転させ、このセットの回転角ごとの各回転の後に回転方向を反転させ、その際、回転方向の反転が単結晶の領域上でターニングポイントを定義し、かつこのターニングポイントにより少なくとも1つの繰り返すパターンが生じ、この場合、このターニングポイントはz軸に対して平行に配向しかつ相互に均等に間隔を置いている直線上に分布している、フロートゾーン法により容器中で単結晶を製造する方法により得られた、少なくとも200mmの長さにわたり少なくとも200mmの直径を有し、この長さの範囲内で無転位であるシリコンからなる単結晶。
- 請求項1記載の単結晶からスライシングされたシリコンからなる基板。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10137856A DE10137856B4 (de) | 2001-08-02 | 2001-08-02 | Durch tiegelloses Zonenziehen hergestellter Einkristall aus Silicium |
| DE10137856.4 | 2001-08-02 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002221342A Division JP4404529B2 (ja) | 2001-08-02 | 2002-07-30 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014088956A Division JP2014133702A (ja) | 2001-08-02 | 2014-04-23 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009227581A JP2009227581A (ja) | 2009-10-08 |
| JP5568253B2 true JP5568253B2 (ja) | 2014-08-06 |
Family
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002221342A Expired - Lifetime JP4404529B2 (ja) | 2001-08-02 | 2002-07-30 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
| JP2009136116A Expired - Lifetime JP5568253B2 (ja) | 2001-08-02 | 2009-06-05 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
| JP2014088956A Pending JP2014133702A (ja) | 2001-08-02 | 2014-04-23 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002221342A Expired - Lifetime JP4404529B2 (ja) | 2001-08-02 | 2002-07-30 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014088956A Pending JP2014133702A (ja) | 2001-08-02 | 2014-04-23 | フロートゾーン法により製造したシリコン単結晶及びシリコン基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6840998B2 (ja) |
| JP (3) | JP4404529B2 (ja) |
| DE (1) | DE10137856B4 (ja) |
| DK (2) | DK176944B1 (ja) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10137856B4 (de) * | 2001-08-02 | 2007-12-13 | Siltronic Ag | Durch tiegelloses Zonenziehen hergestellter Einkristall aus Silicium |
| US20040186813A1 (en) * | 2003-02-26 | 2004-09-23 | Tedesco Daniel E. | Image analysis method and apparatus in a network that is structured with multiple layers and differentially weighted neurons |
| JP4407188B2 (ja) * | 2003-07-23 | 2010-02-03 | 信越半導体株式会社 | シリコンウェーハの製造方法およびシリコンウェーハ |
| JP4982034B2 (ja) * | 2004-03-30 | 2012-07-25 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| JP2006169060A (ja) * | 2004-12-17 | 2006-06-29 | Shin Etsu Handotai Co Ltd | 単結晶製造装置及び単結晶製造方法 |
| JP4604700B2 (ja) * | 2004-12-17 | 2011-01-05 | 信越半導体株式会社 | 単結晶製造装置及び単結晶製造方法 |
| DE102005063346B4 (de) * | 2005-04-06 | 2010-10-28 | Pv Silicon Forschungs Und Produktions Gmbh | Verfahren zur Herstellung einer einkristallinen Si-Scheibe mit annähernd rundem polygonalem Querschnitt |
| JP4581977B2 (ja) * | 2005-11-24 | 2010-11-17 | 信越半導体株式会社 | シリコン単結晶の製造方法 |
| JP5296992B2 (ja) | 2007-01-31 | 2013-09-25 | Sumco Techxiv株式会社 | シリコン結晶素材及びその製造方法 |
| US20100107968A1 (en) * | 2007-04-13 | 2010-05-06 | Topsil Simiconductor Materials A/S | Method and apparatus for producing a single crystal |
| JP5318365B2 (ja) | 2007-04-24 | 2013-10-16 | Sumco Techxiv株式会社 | シリコン結晶素材及びこれを用いたfzシリコン単結晶の製造方法 |
| JP4831203B2 (ja) * | 2009-04-24 | 2011-12-07 | 信越半導体株式会社 | 半導体単結晶の製造方法および半導体単結晶の製造装置 |
| DE102009037286A1 (de) | 2009-08-12 | 2011-02-24 | Siltronic Ag | Verfahren zur Herstellung eines Einkristalls aus Silicium durch Zonenziehen und Einkristall aus Silicium |
| JP5246209B2 (ja) * | 2010-06-10 | 2013-07-24 | 信越半導体株式会社 | 半導体単結晶棒の製造方法 |
| JP5375889B2 (ja) * | 2010-12-28 | 2013-12-25 | 信越半導体株式会社 | 単結晶の製造方法 |
| WO2012114375A1 (ja) * | 2011-02-23 | 2012-08-30 | 信越半導体株式会社 | N型シリコン単結晶の製造方法及びリンドープn型シリコン単結晶 |
| JP5234148B2 (ja) * | 2011-08-04 | 2013-07-10 | 信越半導体株式会社 | 半導体単結晶の製造方法および半導体単結晶の製造装置 |
| CN103114325A (zh) * | 2013-02-25 | 2013-05-22 | 天津市环欧半导体材料技术有限公司 | 气相掺杂区熔硅单晶的生产方法 |
| DE102014226419A1 (de) | 2014-12-18 | 2016-06-23 | Siltronic Ag | Verfahren zum Züchten eines Einkristalls durch Kristallisieren des Einkristalls aus einer Fließzone |
| DK3414367T3 (da) | 2016-02-08 | 2020-05-25 | Topsil Globalwafers As | Fosfordoteret siliciumenkeltkrystal |
| EP3208366A1 (en) | 2016-02-16 | 2017-08-23 | Siltronic AG | Fz silicon and method to prepare fz silicon |
| JP7727373B2 (ja) * | 2020-06-23 | 2025-08-21 | 信越化学工業株式会社 | 単結晶シリコンの製造方法 |
| DK4144894T3 (da) | 2021-09-07 | 2025-09-08 | Siltronic Ag | Fremgangsmåde til fremstilling af et silicium-enkeltkrystal |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3007377A1 (de) * | 1980-02-27 | 1981-09-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum tiegelfreien zonenschmelzen eines siliciumstabes |
| JPS6230698A (ja) * | 1985-07-31 | 1987-02-09 | Fujitsu Ltd | 単結晶成長法 |
| DE3805118A1 (de) * | 1988-02-18 | 1989-08-24 | Wacker Chemitronic | Verfahren zum tiegelfreien zonenziehen von halbleiterstaeben und induktionsheizspule zu seiner durchfuehrung |
| JP2807688B2 (ja) * | 1990-02-26 | 1998-10-08 | 住友シチックス株式会社 | 結晶製造に用いる酸素供給物 |
| JP2883910B2 (ja) * | 1990-03-30 | 1999-04-19 | 株式会社住友シチックス尼崎 | 単結晶シリコンの製造方法 |
| DE4318184A1 (de) * | 1993-06-01 | 1994-12-08 | Wacker Chemitronic | Verfahren und Vorrichtung zum Ziehen von Einkristallen |
| JPH07291783A (ja) * | 1994-04-21 | 1995-11-07 | Sumitomo Metal Ind Ltd | シリコン単結晶およびその製造方法 |
| JP2820027B2 (ja) * | 1994-05-24 | 1998-11-05 | 信越半導体株式会社 | 半導体単結晶の成長方法 |
| JP2754163B2 (ja) * | 1994-05-31 | 1998-05-20 | 信越半導体株式会社 | 高周波誘導加熱コイル |
| US5487355A (en) * | 1995-03-03 | 1996-01-30 | Motorola, Inc. | Semiconductor crystal growth method |
| US5578284A (en) * | 1995-06-07 | 1996-11-26 | Memc Electronic Materials, Inc. | Silicon single crystal having eliminated dislocation in its neck |
| DE19538020A1 (de) * | 1995-10-12 | 1997-04-17 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zur Herstellung von Einkristallen aus Silicium |
| WO1997032059A1 (fr) * | 1996-02-29 | 1997-09-04 | Sumitomo Sitix Corporation | Procede et appareil pour retirer un monocristal |
| JP2973917B2 (ja) * | 1996-03-15 | 1999-11-08 | 住友金属工業株式会社 | 単結晶引き上げ方法 |
| US5935321A (en) * | 1997-08-01 | 1999-08-10 | Motorola, Inc. | Single crystal ingot and method for growing the same |
| DE19737581B4 (de) * | 1997-08-28 | 2007-03-08 | Sumitomo Mitsubishi Silicon Corp. | Verfahren zum (Aus)Ziehen eines Einkristalls |
| JP3267225B2 (ja) * | 1997-12-26 | 2002-03-18 | 住友金属工業株式会社 | 単結晶引き上げ方法、及び単結晶引き上げ装置 |
| JP3065076B1 (ja) * | 1999-05-13 | 2000-07-12 | 住友金属工業株式会社 | 単結晶引き上げ方法及び単結晶引き上げ装置 |
| JP2001163696A (ja) * | 1999-12-09 | 2001-06-19 | Toshiba Ceramics Co Ltd | シリコン単結晶引上装置及びこの装置を用いたシリコン単結晶製造方法 |
| JP4521933B2 (ja) * | 2000-02-22 | 2010-08-11 | エム・イー・エム・シー株式会社 | シリコン単結晶の成長方法 |
| DE10137856B4 (de) * | 2001-08-02 | 2007-12-13 | Siltronic Ag | Durch tiegelloses Zonenziehen hergestellter Einkristall aus Silicium |
-
2001
- 2001-08-02 DE DE10137856A patent/DE10137856B4/de not_active Expired - Lifetime
-
2002
- 2002-07-12 DK DKPA200201097A patent/DK176944B1/da not_active IP Right Cessation
- 2002-07-23 US US10/201,431 patent/US6840998B2/en not_active Expired - Lifetime
- 2002-07-30 JP JP2002221342A patent/JP4404529B2/ja not_active Expired - Lifetime
-
2009
- 2009-06-05 JP JP2009136116A patent/JP5568253B2/ja not_active Expired - Lifetime
-
2010
- 2010-03-05 DK DK201000179A patent/DK177854B1/da not_active IP Right Cessation
-
2014
- 2014-04-23 JP JP2014088956A patent/JP2014133702A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE10137856A1 (de) | 2003-02-27 |
| JP2014133702A (ja) | 2014-07-24 |
| US6840998B2 (en) | 2005-01-11 |
| DK201000179A (da) | 2010-03-05 |
| JP2009227581A (ja) | 2009-10-08 |
| DK177854B1 (da) | 2014-09-29 |
| DE10137856B4 (de) | 2007-12-13 |
| DK200201097A (da) | 2003-02-03 |
| JP2003055089A (ja) | 2003-02-26 |
| DK176944B1 (da) | 2010-06-14 |
| US20030024469A1 (en) | 2003-02-06 |
| JP4404529B2 (ja) | 2010-01-27 |
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