JPH01102976A - Oxide high temperature superconductor thin film pattern formation method - Google Patents

Oxide high temperature superconductor thin film pattern formation method

Info

Publication number
JPH01102976A
JPH01102976A JP62260933A JP26093387A JPH01102976A JP H01102976 A JPH01102976 A JP H01102976A JP 62260933 A JP62260933 A JP 62260933A JP 26093387 A JP26093387 A JP 26093387A JP H01102976 A JPH01102976 A JP H01102976A
Authority
JP
Japan
Prior art keywords
high temperature
thin film
superconductor thin
substrate
temperature superconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62260933A
Other languages
Japanese (ja)
Inventor
Shinji Matsui
真二 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62260933A priority Critical patent/JPH01102976A/en
Publication of JPH01102976A publication Critical patent/JPH01102976A/en
Pending legal-status Critical Current

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  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To obtain a high temperature oxide superconductor thin film pattern and to simplify a process by forming a pattern on a substrate by a resist, and depositing the high temperature oxide superconductor material then applying a lift-off method. CONSTITUTION:A mask 12 of resist or the like is formed by a light, electron, or ion beam exposure method on a substrate 11. Here, magnesia(MgO) is employed as the substrate. As the resist polymethylmethacrylate(PMMA) is employed. A high temperature oxide superconductor thin film is deposited by a deposition method. A Y-Ba-Cu-O oxide high temperature superconducting material which obtains 90K of transition temperature is employed. The resist mask is removed with an organic solvent and a high temperature oxide superconductor thin film pattern is obtained. After the pattern is formed on the substrate 11, it is heat treated to provide superconducting characteristic.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、酸化物高温超伝導体薄膜パターン形成方法に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for forming an oxide high temperature superconductor thin film pattern.

(従来の技術) 第2図は従来性われている酸化物高温超伝導体薄膜パタ
ーン形成方法を示している。第2図(1)では、基板2
1上にスパッタ法等により酸化物高温超伝導体薄膜22
を形成する(第2図(1))。
(Prior Art) FIG. 2 shows a conventional method for forming an oxide high temperature superconductor thin film pattern. In FIG. 2 (1), the substrate 2
1, an oxide high temperature superconductor thin film 22 is formed by sputtering or the like.
(Fig. 2 (1)).

さらに、レジスト等のマスク23を光や電子ビーム露光
法により形成する(第2図(2))。次に、マスク23
を用いて、ドライエツチングにより、酸化物高温超伝導
体22をエツチングし、パターン転写を行う(第2図(
3))。その後、酸素プラズマによりレジストを除去す
る(第2図4)〉。この様にして、基板21上に酸化物
高温超伝導体薄膜パターンを形成したのち、熱処理を行
い、超伝導特性をもたせる。
Furthermore, a mask 23 made of resist or the like is formed by light or electron beam exposure (FIG. 2 (2)). Next, mask 23
The oxide high-temperature superconductor 22 is etched by dry etching to transfer the pattern (see Fig. 2).
3)). Thereafter, the resist is removed using oxygen plasma (FIG. 2, 4). After forming the oxide high temperature superconductor thin film pattern on the substrate 21 in this manner, heat treatment is performed to impart superconducting properties.

(発明が解決しようとする問題点) しかしながら、この従来の方法では、工程が複雑である
という欠点を有していた。本発明の目的は、リフトオフ
プロセスを用いることにより、工程が簡素化された酸化
物高温超伝導体薄膜パターン形成方法を提゛供すること
である。
(Problems to be Solved by the Invention) However, this conventional method has the disadvantage that the steps are complicated. An object of the present invention is to provide a method for forming an oxide high temperature superconductor thin film pattern in which the process is simplified by using a lift-off process.

(問題点を解決するための手段) 本発明は、基板上に所望のパターンをレジストにより形
成した後、酸化物高温超伝導体材料を蒸着し、リフトオ
フ法により所望の酸化物高温超伝導体薄膜パターンを得
る。その後、熱処理することにより、超伝導体薄膜パタ
ーンを得ることを特徴とする酸化物高温超伝導体薄膜パ
ターン形成方法である。
(Means for Solving the Problems) The present invention involves forming a desired pattern on a substrate using a resist, then depositing an oxide high-temperature superconductor material, and forming a desired oxide high-temperature superconductor thin film by a lift-off method. Get the pattern. This is a method for forming an oxide high-temperature superconductor thin film pattern, which is characterized in that a superconductor thin film pattern is obtained by subsequent heat treatment.

(作用) 本発明の原理と作用について述べる。酸化物高温超伝導
体として現在知られている代表的な材料はY−Ba−C
u−0である。この材料はきわめて不安定で他の物質と
反応しやすい。そのために、図2で示した、従来のプロ
セスでは、ドライエツチングのマスク材と反応し、パタ
ーン転写した後の超伝導特性の劣化が見られる。そこで
、リフトオフプロセスを用いることによりマクスの界面
反応の問題が解決される。
(Operation) The principle and operation of the present invention will be described. The typical material currently known as an oxide high temperature superconductor is Y-Ba-C.
It is u-0. This material is extremely unstable and easily reacts with other substances. Therefore, in the conventional process shown in FIG. 2, the material reacts with the dry etching mask material, resulting in deterioration of superconducting properties after pattern transfer. Therefore, the problem of Max's interfacial reaction can be solved by using the lift-off process.

(実施例) 以下、本発明の実施例について、第1図を用いて説明す
る。第1図(1)では、基板11上にレジスト等のマス
ク12を光や電子、イオンビーム露光法により形成する
(第1図(11)、ここでは、基板としてマグネシア(
MgO>を用いた。また、レジストとして、ポリメチル
メタクリレイト(PMMA)を用いた。さらに、集束イ
オンビームリソグラフィによりパターニングを行った。
(Example) Hereinafter, an example of the present invention will be described using FIG. 1. In FIG. 1 (1), a mask 12 such as a resist is formed on a substrate 11 by light, electron, or ion beam exposure (FIG. 1 (11); here, magnesia (magnesia) is used as a substrate.
MgO> was used. Furthermore, polymethyl methacrylate (PMMA) was used as a resist. Furthermore, patterning was performed using focused ion beam lithography.

次に、イオンビームスパッタ法等の蒸着法により酸化物
高温超伝導体薄膜を蒸着する(第1図(21)。ここで
は、90にの転移温度が得られるY−Ba−Cu−0酸
化物高温超伝導材料を用いた。さらに、蒸着法としては
、イオンビームスパッタ法を用いた。次に、アセトン等
の有機溶剤によりレジストマスクを除去し、酸化物高温
超伝導体薄膜パターンをえる(第1図(3)〉。この様
にして、基板11上に超伝導体薄膜パターンを形成した
後、熱処理を行い、超伝導特性をもたせる。本実施例で
は、基板としてMgOを用いたがチタンサンストロンチ
ウム等の他の基板でもよい。さらに、超伝導体材料とし
て、La−Y−Ba−Cu−0等の他の酸化物高温超伝
導体でもよい。
Next, an oxide high temperature superconductor thin film is deposited by a vapor deposition method such as ion beam sputtering (Fig. 1 (21). A high-temperature superconducting material was used.Furthermore, the ion beam sputtering method was used as the vapor deposition method.Next, the resist mask was removed using an organic solvent such as acetone to obtain an oxide high-temperature superconductor thin film pattern. 1 (3)>. After forming a superconductor thin film pattern on the substrate 11 in this way, heat treatment is performed to impart superconducting properties. In this example, MgO was used as the substrate, but titanium sulfate was used as the substrate. Other substrates such as strontium may be used.Furthermore, other oxide high temperature superconductors such as La-Y-Ba-Cu-0 may be used as the superconductor material.

(発明の効果) 以上説明した様に、本発明の超伝導体薄膜パターン形成
方法によれば、基板上にレジストパターンを形成した後
、酸化物高温超伝導体材料を蒸着しリフトオフ法を用い
て、酸化膜高温超伝導体薄膜パターン形成を行うことが
できる。
(Effects of the Invention) As explained above, according to the superconductor thin film pattern forming method of the present invention, after forming a resist pattern on a substrate, an oxide high temperature superconductor material is evaporated and a lift-off method is used. , oxide film high temperature superconductor thin film patterning can be performed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を模敷き的に示す部分断面図
、第2図は従来の酸化物高温超伝導体薄膜パターン形成
方法を示す断面図である。 11.21:基板、12.23:マスク13.23:酸
化物高温超伝導体薄膜
FIG. 1 is a partial sectional view schematically showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional method for forming an oxide high temperature superconductor thin film pattern. 11.21: Substrate, 12.23: Mask 13.23: Oxide high temperature superconductor thin film

Claims (1)

【特許請求の範囲】[Claims]  基板上にパターン化したレジストを形成させる工程と
、基板上に高温超伝導体材料を蒸着する工程と、上記レ
ジストを除去するリフトオフ法により酸化物高温超伝導
体薄膜パターンを形成させる工程と、続いて熱処理する
工程とより構成されることを特徴とする酸化物高温超伝
導体薄膜パターン形成方法。
forming a patterned resist on the substrate; depositing a high temperature superconductor material on the substrate; forming an oxide high temperature superconductor thin film pattern by a lift-off method to remove the resist; A method for forming an oxide high-temperature superconductor thin film pattern, the method comprising: a step of heat-treating the oxide.
JP62260933A 1987-10-15 1987-10-15 Oxide high temperature superconductor thin film pattern formation method Pending JPH01102976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62260933A JPH01102976A (en) 1987-10-15 1987-10-15 Oxide high temperature superconductor thin film pattern formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62260933A JPH01102976A (en) 1987-10-15 1987-10-15 Oxide high temperature superconductor thin film pattern formation method

Publications (1)

Publication Number Publication Date
JPH01102976A true JPH01102976A (en) 1989-04-20

Family

ID=17354786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62260933A Pending JPH01102976A (en) 1987-10-15 1987-10-15 Oxide high temperature superconductor thin film pattern formation method

Country Status (1)

Country Link
JP (1) JPH01102976A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236663A (en) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd Manufacture of superconducting wiring
JPH0354875A (en) * 1989-07-24 1991-03-08 Furukawa Electric Co Ltd:The Formation of superconductor circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5646582A (en) * 1979-09-21 1981-04-27 Mitsubishi Electric Corp Formation of pattern of filmlike article
JPS63299193A (en) * 1987-05-28 1988-12-06 Hitachi Chem Co Ltd Manufacturing method of superconducting printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5646582A (en) * 1979-09-21 1981-04-27 Mitsubishi Electric Corp Formation of pattern of filmlike article
JPS63299193A (en) * 1987-05-28 1988-12-06 Hitachi Chem Co Ltd Manufacturing method of superconducting printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01236663A (en) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd Manufacture of superconducting wiring
JPH0354875A (en) * 1989-07-24 1991-03-08 Furukawa Electric Co Ltd:The Formation of superconductor circuit

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