JPH01104046U - - Google Patents
Info
- Publication number
- JPH01104046U JPH01104046U JP1987198975U JP19897587U JPH01104046U JP H01104046 U JPH01104046 U JP H01104046U JP 1987198975 U JP1987198975 U JP 1987198975U JP 19897587 U JP19897587 U JP 19897587U JP H01104046 U JPH01104046 U JP H01104046U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- thin metal
- semiconductor device
- length
- transistor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の第一実施例のボンデイングの
様子を示す説明図。第２図は本考案の第二実施例
のボンデイングの様子を示す説明図。第３図は従
来例のボンデイングの様子を示す説明図。 １，１ａ，１０１，１０１ａ……入力用金属細
線、２，２ａ……入力ボンデイングパツド、３…
…入力リード接続部、４，４ａ……ペレツト、５
，５ａ……接地部、６……絶縁基板、７，７ａ…
…接地用金属細線、８……出力リード接続部、９
……出力リード線、１０……入力リード線、１１
，１１ａ……接地ボンデイングパツド。
様子を示す説明図。第２図は本考案の第二実施例
のボンデイングの様子を示す説明図。第３図は従
来例のボンデイングの様子を示す説明図。 １，１ａ，１０１，１０１ａ……入力用金属細
線、２，２ａ……入力ボンデイングパツド、３…
…入力リード接続部、４，４ａ……ペレツト、５
，５ａ……接地部、６……絶縁基板、７，７ａ…
…接地用金属細線、８……出力リード接続部、９
……出力リード線、１０……入力リード線、１１
，１１ａ……接地ボンデイングパツド。
Claims (1)
- 【実用新案登録請求の範囲】 複数のトランジスタ素子が並列に接続された構
造を有し、かつ外部リード線１０が接続された少
くとも一つの外部リード接続部３と前記各トラン
ジスタ素子の少くとも一つの電極端子２，２ａと
がそれぞれ金属細線１０１，１０１ａで接続され
た半導体装置において、 前記金属細線の長さを前記外部リード線の端面
と前記電極端子との間の長さに応じて短くしたこ
と を特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198975U JPH01104046U (ja) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987198975U JPH01104046U (ja) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104046U true JPH01104046U (ja) | 1989-07-13 |
Family
ID=31489450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987198975U Pending JPH01104046U (ja) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104046U (ja) |
-
1987
- 1987-12-28 JP JP1987198975U patent/JPH01104046U/ja active Pending