JPH03116032U - - Google Patents

Info

Publication number
JPH03116032U
JPH03116032U JP1990025807U JP2580790U JPH03116032U JP H03116032 U JPH03116032 U JP H03116032U JP 1990025807 U JP1990025807 U JP 1990025807U JP 2580790 U JP2580790 U JP 2580790U JP H03116032 U JPH03116032 U JP H03116032U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit chip
terminals
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990025807U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990025807U priority Critical patent/JPH03116032U/ja
Publication of JPH03116032U publication Critical patent/JPH03116032U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体集積
回路のワイヤボンデイング装置を示す断面図、第
２図は第１図のキヤピラリ４の横断面図、第３図
はこの考案の他の実施例を示すキヤピラリの横断
面図、第４図は従来の半導体集積回路のワイヤボ
ンデイング装置を示す断面図、第５図は従来のワ
イヤボンデイングによる半導体集積回路チツプと
リードとの接続状態を示す断面図である。 図において、１……半導体集積回路チツプ、２
……リード、３……ワイヤ、４……キヤピラリ、
５……パツケージ、６……ワイヤ通路、７……絶
縁物通路、８……絶縁薄膜を示す。なお、図中、
同一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 単一あるいは複数の半導体集積回路チツプ及び
    半導体集積回路チツプ端子をパツケージの外部へ
    引き出すためのリード端子を設け、前記半導体集
    積回路チツプ端子と前記リード端子とを接続して
    これらを単一パツケージ内に封止した半導体集積
    回路のワイヤボンデイング装置において、前記半
    導体集積回路チツプ端子と前記リード端子を接続
    するワイヤに絶縁薄膜を場所選択的に付加する装
    置を備えたことを特徴とする半導体集積回路のワ
    イヤボンデイング装置。
JP1990025807U 1990-03-14 1990-03-14 Pending JPH03116032U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990025807U JPH03116032U (ja) 1990-03-14 1990-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990025807U JPH03116032U (ja) 1990-03-14 1990-03-14

Publications (1)

Publication Number Publication Date
JPH03116032U true JPH03116032U (ja) 1991-12-02

Family

ID=31528728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990025807U Pending JPH03116032U (ja) 1990-03-14 1990-03-14

Country Status (1)

Country Link
JP (1) JPH03116032U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007300847A (ja) * 2006-05-11 2007-11-22 Kyushu Shizen Kankyo Kenkyusho:Kk 獣類の捕獲装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007300847A (ja) * 2006-05-11 2007-11-22 Kyushu Shizen Kankyo Kenkyusho:Kk 獣類の捕獲装置

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