JPH01108951U - - Google Patents
Info
- Publication number
- JPH01108951U JPH01108951U JP1988003561U JP356188U JPH01108951U JP H01108951 U JPH01108951 U JP H01108951U JP 1988003561 U JP1988003561 U JP 1988003561U JP 356188 U JP356188 U JP 356188U JP H01108951 U JPH01108951 U JP H01108951U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- power
- power semiconductor
- control circuit
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は平面図、第３図は従来例を示す断面図である
。 １…ケース、２…電力回路基板、３…制御回路
基板、４…電力用半導体素子、５…アルミワイヤ
ー、６…電気部品、９…保護用樹脂、１０…封止
樹脂、１２…空気層。
図は平面図、第３図は従来例を示す断面図である
。 １…ケース、２…電力回路基板、３…制御回路
基板、４…電力用半導体素子、５…アルミワイヤ
ー、６…電気部品、９…保護用樹脂、１０…封止
樹脂、１２…空気層。
Claims (1)
- 【実用新案登録請求の範囲】 電力用半導体素子が搭載された電力回路基板と
、各種の電気部品が搭載された制御回路基板とを
液状樹脂注入用のケースにより積層保持してなる
電力半導体装置において、 前記電力回路基板上の半導体素子保護用樹脂と
、前記制御回路基板との間に、空気層が形成され
る空間部を設けたことを特徴とする電力半導体装
置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988003561U JPH01108951U (ja) | 1988-01-14 | 1988-01-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988003561U JPH01108951U (ja) | 1988-01-14 | 1988-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01108951U true JPH01108951U (ja) | 1989-07-24 |
Family
ID=31205304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988003561U Pending JPH01108951U (ja) | 1988-01-14 | 1988-01-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01108951U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04354359A (ja) * | 1991-05-31 | 1992-12-08 | Nippondenso Co Ltd | 電子装置 |
| JP2000228492A (ja) * | 1999-02-05 | 2000-08-15 | Hitachi Ltd | 樹脂封止した半導体装置 |
| WO2016158072A1 (ja) * | 2015-03-27 | 2016-10-06 | 三菱電機株式会社 | パワーモジュール |
-
1988
- 1988-01-14 JP JP1988003561U patent/JPH01108951U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04354359A (ja) * | 1991-05-31 | 1992-12-08 | Nippondenso Co Ltd | 電子装置 |
| JP2000228492A (ja) * | 1999-02-05 | 2000-08-15 | Hitachi Ltd | 樹脂封止した半導体装置 |
| WO2016158072A1 (ja) * | 2015-03-27 | 2016-10-06 | 三菱電機株式会社 | パワーモジュール |
| JPWO2016158072A1 (ja) * | 2015-03-27 | 2017-08-17 | 三菱電機株式会社 | パワーモジュール |
| US11011442B2 (en) | 2015-03-27 | 2021-05-18 | Mitsubishi Electric Corporation | Power module |